GB8531814D0 - Integrated circuit multilevel metallization - Google Patents

Integrated circuit multilevel metallization

Info

Publication number
GB8531814D0
GB8531814D0 GB8531814A GB8531814A GB8531814D0 GB 8531814 D0 GB8531814 D0 GB 8531814D0 GB 8531814 A GB8531814 A GB 8531814A GB 8531814 A GB8531814 A GB 8531814A GB 8531814 D0 GB8531814 D0 GB 8531814D0
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
multilevel metallization
circuit multilevel
metallization
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8531814A
Other versions
GB2169446A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB8531814D0 publication Critical patent/GB8531814D0/en
Publication of GB2169446A publication Critical patent/GB2169446A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB8531814A 1985-01-07 1985-12-24 Integrated circuit multilevel metallization and method for making same Withdrawn GB2169446A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68940885A 1985-01-07 1985-01-07

Publications (2)

Publication Number Publication Date
GB8531814D0 true GB8531814D0 (en) 1986-02-05
GB2169446A GB2169446A (en) 1986-07-09

Family

ID=24768322

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8531814A Withdrawn GB2169446A (en) 1985-01-07 1985-12-24 Integrated circuit multilevel metallization and method for making same

Country Status (2)

Country Link
JP (1) JPS61161740A (en)
GB (1) GB2169446A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816895A (en) * 1986-03-06 1989-03-28 Nec Corporation Integrated circuit device with an improved interconnection line
DE3830720A1 (en) * 1988-09-09 1990-03-22 Philips Nv METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
US6593657B1 (en) * 1997-03-03 2003-07-15 Micron Technology, Inc. Contact integration article
RU2548523C1 (en) * 2013-12-17 2015-04-20 Акционерное общество "Научно-исследовательский институт молекулярной электроники (АО "НИИМЭ") Method for manufacturing of multilevel copper metallisation with ultralow value of dielectric constant for intralayer insulation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1162759A (en) * 1966-05-09 1969-08-27 Motorola Inc Monolithic Integrated Circuit
GB1243247A (en) * 1968-03-04 1971-08-18 Texas Instruments Inc Ohmic contact and electrical interconnection system for electronic devices
US3654526A (en) * 1970-05-19 1972-04-04 Texas Instruments Inc Metallization system for semiconductors
JPS5334484A (en) * 1976-09-10 1978-03-31 Toshiba Corp Forming method for multi layer wiring
US4107726A (en) * 1977-01-03 1978-08-15 Raytheon Company Multilayer interconnected structure for semiconductor integrated circuit
CA1120611A (en) * 1978-12-29 1982-03-23 Hormazdyar M. Dalal Forming interconnections for multilevel interconnection metallurgy systems
US4259367A (en) * 1979-07-30 1981-03-31 International Business Machines Corporation Fine line repair technique

Also Published As

Publication number Publication date
JPS61161740A (en) 1986-07-22
GB2169446A (en) 1986-07-09

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)