GB843699A - Improvements in or relating to semi-conductor devices - Google Patents

Improvements in or relating to semi-conductor devices

Info

Publication number
GB843699A
GB843699A GB3192357A GB3192357A GB843699A GB 843699 A GB843699 A GB 843699A GB 3192357 A GB3192357 A GB 3192357A GB 3192357 A GB3192357 A GB 3192357A GB 843699 A GB843699 A GB 843699A
Authority
GB
United Kingdom
Prior art keywords
silver
alumina
carrier
semi
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3192357A
Inventor
Joseph Blamires Kaye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Painton and Co Ltd
Original Assignee
Painton and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Painton and Co Ltd filed Critical Painton and Co Ltd
Priority to GB3192357A priority Critical patent/GB843699A/en
Publication of GB843699A publication Critical patent/GB843699A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet

Abstract

843,699. Semi-conductor devices. PAINTON & CO. Ltd. Oct. 13, 1958 [Oct. 11, 1957] No. 31923/57. Class 37. Semi-conductor devices such as transistors and rectifiers are mounted in heat conducting relationship in a carrier or on a block'of sintered alumina or a ceramic material including a high proportion of alumina. As shown, Fig. 2, a transistor comprising a germanium disc 1 is mounted in a carrier 5 of sintered alumina, which is screwed to a metal base plate 15, the base electrode 4 and the collector 3 of the transistor being soldered to areas 7 of silver on an annular ridge 6 of the carrier, and inside the annular ridge, respectively. The latter area extends through a gap 10 in the ridge, and leads 8, from the areas 7 and the emitter 2, pass through a sealed cover plate 13 mounted on a second annulus 11. In an unsealed embodiment Fig. 1, (not shown) the lead from the area 7 associated with collector 3 is taken through a hole in the carrier 5. In Fig. 3 (not shown), one electrode of a germanium diode is soldered to the single silver area on an alumina slab. The areas of silver may be deposited in the form of a silver-glaze paste on the alumina, which is then fired to at least 500‹C, alternatively a silver resin mixture may be applied and heatcured or chemically cured.
GB3192357A 1957-10-11 1957-10-11 Improvements in or relating to semi-conductor devices Expired GB843699A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3192357A GB843699A (en) 1957-10-11 1957-10-11 Improvements in or relating to semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3192357A GB843699A (en) 1957-10-11 1957-10-11 Improvements in or relating to semi-conductor devices

Publications (1)

Publication Number Publication Date
GB843699A true GB843699A (en) 1960-08-10

Family

ID=10330405

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3192357A Expired GB843699A (en) 1957-10-11 1957-10-11 Improvements in or relating to semi-conductor devices

Country Status (1)

Country Link
GB (1) GB843699A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2557763A (en) * 1948-08-05 1951-06-19 Hilbert W Reck Wheel suspension

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2557763A (en) * 1948-08-05 1951-06-19 Hilbert W Reck Wheel suspension

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