GB1069520A - Encapsulated semiconductor device - Google Patents

Encapsulated semiconductor device

Info

Publication number
GB1069520A
GB1069520A GB31101/65A GB3110165A GB1069520A GB 1069520 A GB1069520 A GB 1069520A GB 31101/65 A GB31101/65 A GB 31101/65A GB 3110165 A GB3110165 A GB 3110165A GB 1069520 A GB1069520 A GB 1069520A
Authority
GB
United Kingdom
Prior art keywords
foils
bonding agent
cured silicone
semi
insulating ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB31101/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB1069520A publication Critical patent/GB1069520A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1,069,520. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. July 21, 1965 [July 25, 1964], No. 31101/65. Heading H1K. A semi-conductor element 4 is mounted between two metal (e.g. silver) foils 2 and surrounded by an insulating ring which is secured to the edge regions of the two metal foils and which consists at least partially of a cured silicone bonding agent. The insulating ring may consist of two component rings connected together by an intermediate layer 6 of cured silicone-bonding agent, the component rings possibly being of a ceramic material 5 (such as sintered aluminium oxide) hard-soldered to the respective foils 2, as shown, fig. 1, or of a plastic material 7, such as powdered quartz or asbestos with a cured silicone bonding agent as a binder, cast around the edges of the respective foils, Fig. 2 (not shown). Alternatively, the insulating ring may be cast in one piece around the edges of the foils, Fig. 3 (not shown), and consist of a mixture of cured silicone bonding agent and a finely divided filler, such as powdered quartz. The semi-conductor element 4 may be alloyed to molybdenum carrier plates 3.
GB31101/65A 1964-07-25 1965-07-21 Encapsulated semiconductor device Expired GB1069520A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0092265 1964-07-25

Publications (1)

Publication Number Publication Date
GB1069520A true GB1069520A (en) 1967-05-17

Family

ID=7517107

Family Applications (1)

Application Number Title Priority Date Filing Date
GB31101/65A Expired GB1069520A (en) 1964-07-25 1965-07-21 Encapsulated semiconductor device

Country Status (6)

Country Link
BE (1) BE667290A (en)
CH (1) CH427047A (en)
DE (1) DE1439421A1 (en)
GB (1) GB1069520A (en)
NL (1) NL6506706A (en)
SE (1) SE334945B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000642A (en) * 1977-07-04 1979-01-10 Commw Scient Ind Res Org Pyrometric sheath and process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000642A (en) * 1977-07-04 1979-01-10 Commw Scient Ind Res Org Pyrometric sheath and process
GB2000642B (en) * 1977-07-04 1982-02-03 Commw Scient Ind Res Org Pyrometric sheath and process

Also Published As

Publication number Publication date
SE334945B (en) 1971-05-10
DE1439421A1 (en) 1968-11-28
NL6506706A (en) 1966-01-26
CH427047A (en) 1966-12-31
BE667290A (en) 1966-01-24

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