GB830597A - Nickel plating by chemical means - Google Patents

Nickel plating by chemical means

Info

Publication number
GB830597A
GB830597A GB18204/58A GB1820458A GB830597A GB 830597 A GB830597 A GB 830597A GB 18204/58 A GB18204/58 A GB 18204/58A GB 1820458 A GB1820458 A GB 1820458A GB 830597 A GB830597 A GB 830597A
Authority
GB
United Kingdom
Prior art keywords
sodium
fluoride
nickel
hypophosphite
litre
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18204/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of GB830597A publication Critical patent/GB830597A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Chemically Coating (AREA)

Abstract

An aqueous chemical nickel plating bath has a pH of 3.5-7.0 and contains 0.04-1.4 moles/litre of nickel obtained from soluble salts other than the chloride or sulphate, 0.04-2.6 moles/litre of hypophosphite, and 0.15-2.5 moles/litre of fluoride. The nickel salt may be basic nickelous carbonate or nickel carbonate, cyanide, fluoride, acid fluoride, hydroxide, hypophosphite, oxalate, oxide or phosphide; the hypophosphite may be derived from alkali metal, e.g. sodium, hypophosphite; and the fluoride may be added as hydrofluoric acid, ammonium bifluoride, or alkali metal, ammonium or nickel fluoride. Control of pH is accomplished by the addition of e.g. ammonium hydroxide or hydrofluoric acid, and an organic acid salt such as sodium or potassium citrate, sodium succinate, sodium tartrate, sodium phthalate or sodium lactate, is used as buffer. The bath is operated at a temperature of 90 DEG -212 DEG F. and is suitable for plating magnesium, magnesium-base alloys containing more than 75% magnesium, iron, aluminium, copper and brass. U.S.A. Specifications 2,532,283 and 2,694,019 are referred to.
GB18204/58A 1957-06-06 1958-06-06 Nickel plating by chemical means Expired GB830597A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US830597XA 1957-06-06 1957-06-06

Publications (1)

Publication Number Publication Date
GB830597A true GB830597A (en) 1960-03-16

Family

ID=22175911

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18204/58A Expired GB830597A (en) 1957-06-06 1958-06-06 Nickel plating by chemical means

Country Status (1)

Country Link
GB (1) GB830597A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101892471A (en) * 2010-07-09 2010-11-24 中南大学 Chemical nickel plating process of Mg-Gd-Y-Zr magnesium alloy
CN103898487A (en) * 2013-06-04 2014-07-02 无锡市锡山区鹅湖镇荡口青荡金属制品厂 Surface chemical nickel plating solution of magnesium alloy for notebook computer cases

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101892471A (en) * 2010-07-09 2010-11-24 中南大学 Chemical nickel plating process of Mg-Gd-Y-Zr magnesium alloy
CN101892471B (en) * 2010-07-09 2012-06-06 中南大学 Chemical nickel plating process of Mg-Gd-Y-Zr magnesium alloy
CN103898487A (en) * 2013-06-04 2014-07-02 无锡市锡山区鹅湖镇荡口青荡金属制品厂 Surface chemical nickel plating solution of magnesium alloy for notebook computer cases

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