GB802987A - Improvements in or relating to junction rectifiers or junction transistors - Google Patents

Improvements in or relating to junction rectifiers or junction transistors

Info

Publication number
GB802987A
GB802987A GB5846/56A GB584656A GB802987A GB 802987 A GB802987 A GB 802987A GB 5846/56 A GB5846/56 A GB 5846/56A GB 584656 A GB584656 A GB 584656A GB 802987 A GB802987 A GB 802987A
Authority
GB
United Kingdom
Prior art keywords
junction
layers
indium
feb
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5846/56A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB802987A publication Critical patent/GB802987A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2924/01049—Indium [In]
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    • H01L2924/01067—Holmium [Ho]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)

Abstract

802,987. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. Feb. 24, 1956 [Feb. 26, 1955], No. 5846/56. Class 37. In a junction rectifier or transistor device a holder or heatdissipating member, one surface of which bears against an electrode of the device, is provided on the bearing surface with a coating of ductile material welded or soldered thereto. In the embodiment a transistor comprises a base 1a of germanium with layers of indium 1b, 1c fused to either side to form facing PN junctions. Holding members 2, 3 are provided with welded on indium or gold layers 4, 5 preferably containing less than 0.1 per cent impurity to give improved ductility. The layers are at least 50 Î 10-4 cm. thick to give sufficient material to flow into irregular surface features of the electrodes to provide an intimate contact when the members are pressed together. Specification 749,392 is referred to.
GB5846/56A 1955-02-26 1956-02-24 Improvements in or relating to junction rectifiers or junction transistors Expired GB802987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES42834A DE1042762B (en) 1955-02-26 1955-02-26 Surface rectifier or transistor, which has at least one of its electrodes in surface contact with a body which dissipates the heat loss

Publications (1)

Publication Number Publication Date
GB802987A true GB802987A (en) 1958-10-15

Family

ID=7484489

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5846/56A Expired GB802987A (en) 1955-02-26 1956-02-24 Improvements in or relating to junction rectifiers or junction transistors

Country Status (4)

Country Link
US (1) US2907935A (en)
CH (1) CH340558A (en)
DE (1) DE1042762B (en)
GB (1) GB802987A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3109234A (en) * 1957-07-22 1963-11-05 Rca Corp Method of mounting a semiconductor device
US3109225A (en) * 1958-08-29 1963-11-05 Rca Corp Method of mounting a semiconductor device
US2942166A (en) * 1959-03-23 1960-06-21 Philco Corp Semiconductor apparatus
NL113528C (en) * 1959-08-27
NL256369A (en) * 1959-09-30 1900-01-01
US3131460A (en) * 1959-11-09 1964-05-05 Corning Glass Works Method of bonding a crystal to a delay line
DE1185728B (en) * 1960-05-18 1965-01-21 Siemens Ag Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element
NL270517A (en) * 1960-11-16
US3333163A (en) * 1965-02-15 1967-07-25 Int Rectifier Corp Rectifier assembly with interconnecting bus-bar supports
CH442502A (en) * 1965-04-23 1967-08-31 Siemens Ag Rectifier system
GB1147645A (en) * 1965-07-01 1969-04-02 English Electric Co Ltd Housings for semi-conductor devices
FR1531647A (en) * 1967-05-24 1968-07-05 Comp Generale Electricite Semiconductor component with improved isolation
DE2638909A1 (en) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau SEMI-CONDUCTOR ARRANGEMENT
DE2729074C2 (en) * 1976-09-03 1982-08-26 International Business Machines Corp., 10504 Armonk, N.Y. Arrangement for an encapsulated semiconductor circuit die and method for the manufacture thereof
US4333101A (en) * 1979-07-19 1982-06-01 Flight Systems, Inc. Semiconductor heat sink mounting assembly
US4404739A (en) * 1980-04-21 1983-09-20 Thermal Associates, Inc. Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1894821A (en) * 1933-01-17 Edgar a
US1751360A (en) * 1924-09-22 1930-03-18 Ruben Rectifier Corp Electric-current rectifier
US1640335A (en) * 1925-01-07 1927-08-23 Union Switch & Signal Co Unidirectional current-carrying device
US1809925A (en) * 1929-05-14 1931-06-16 American Telephone & Telegraph Variable resistance device
US2406405A (en) * 1941-05-19 1946-08-27 Sperry Gyroscope Co Inc Coaxial condenser crystal and method of making same
GB560869A (en) * 1942-10-19 1944-04-25 Westinghouse Brake & Signal Improvements relating to alternating electric current rectifiers of the selenium type
US2776920A (en) * 1952-11-05 1957-01-08 Gen Electric Germanium-zinc alloy semi-conductors

Also Published As

Publication number Publication date
US2907935A (en) 1959-10-06
CH340558A (en) 1959-08-31
DE1042762B (en) 1958-11-06

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