GB784899A - Improvements in pectifier cell mountings - Google Patents

Improvements in pectifier cell mountings

Info

Publication number
GB784899A
GB784899A GB36801/55A GB3680155A GB784899A GB 784899 A GB784899 A GB 784899A GB 36801/55 A GB36801/55 A GB 36801/55A GB 3680155 A GB3680155 A GB 3680155A GB 784899 A GB784899 A GB 784899A
Authority
GB
United Kingdom
Prior art keywords
per cent
pectifier
mountings
cell
cell mountings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB36801/55A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB784899A publication Critical patent/GB784899A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/10Arrangements for heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42Fillings
    • H10W76/48Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/231Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Ceramic Products (AREA)
GB36801/55A 1954-12-27 1955-12-22 Improvements in pectifier cell mountings Expired GB784899A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US477822A US2756374A (en) 1954-12-27 1954-12-27 Rectifier cell mounting

Publications (1)

Publication Number Publication Date
GB784899A true GB784899A (en) 1957-10-16

Family

ID=23897505

Family Applications (1)

Application Number Title Priority Date Filing Date
GB36801/55A Expired GB784899A (en) 1954-12-27 1955-12-22 Improvements in pectifier cell mountings

Country Status (7)

Country Link
US (1) US2756374A (enExample)
BE (1) BE543951A (enExample)
CH (1) CH347900A (enExample)
DE (1) DE1010186B (enExample)
FR (1) FR1143327A (enExample)
GB (1) GB784899A (enExample)
NL (2) NL203133A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL101253C (enExample) * 1955-09-12
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
NL101591C (enExample) * 1956-03-22
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
NL225331A (enExample) * 1957-03-01 1900-01-01
US2915685A (en) * 1957-05-27 1959-12-01 Int Rectifier Corp Dry rectifier assembly and housing therefor
US2864980A (en) * 1957-06-10 1958-12-16 Gen Electric Sealed current rectifier
US2975342A (en) * 1957-08-16 1961-03-14 Research Corp Narrow base planar junction punch-thru diode
US2987658A (en) * 1958-01-10 1961-06-06 Philco Corp Improved semiconductor diode
US2921245A (en) * 1958-10-08 1960-01-12 Int Rectifier Corp Hermetically sealed junction means
US2946935A (en) * 1958-10-27 1960-07-26 Sarkes Tarzian Diode
US3030558A (en) * 1959-02-24 1962-04-17 Fansteel Metallurgical Corp Semiconductor diode assembly and housing therefor
NL258020A (enExample) * 1960-02-09
DE1271264B (de) * 1960-03-19 1968-06-27 Siemens Ag Kuehlanordnung fuer elektronische Bauelemente, insbesondere fuer Halbleiteranordnungen
NL264049A (enExample) * 1960-04-29
DE1123406B (de) * 1960-09-27 1962-02-08 Telefunken Patent Verfahren zur Herstellung von legierten Halbleiteranordnungen
SE312860B (enExample) * 1964-09-28 1969-07-28 Asea Ab
US3328650A (en) * 1965-01-14 1967-06-27 Int Rectifier Corp Compression bonded semiconductor device
USD262960S (en) 1979-04-24 1982-02-09 Aavid Engineering, Inc. Flanged-collar heat sink for electronic devices
US4541004A (en) * 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US7130197B2 (en) * 2004-09-09 2006-10-31 Artesyn Technologies, Inc. Heat spreader

Also Published As

Publication number Publication date
FR1143327A (fr) 1957-09-30
DE1010186B (de) 1957-06-13
NL203133A (enExample)
US2756374A (en) 1956-07-24
BE543951A (enExample)
CH347900A (de) 1960-07-31
NL100659C (enExample)

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