NL203133A - - Google Patents

Info

Publication number: NL203133A
Authority: NL; Netherlands

Application number

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1954-12-27

Publication of NL203133A publication Critical patent/NL203133A/xx

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01011—Sodium [Na]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01014—Silicon [Si]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01018—Argon [Ar]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01023—Vanadium [V]
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01032—Germanium [Ge]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01049—Indium [In]
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- H01L2924/01068—Erbium [Er]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Adhesives Or Adhesive Processes (AREA)
Ceramic Products (AREA)
Connection Of Batteries Or Terminals (AREA)

NL203133D 1954-12-27 NL203133A (xx)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US477822A US2756374A (en)	1954-12-27	1954-12-27	Rectifier cell mounting

Publications (1)

Publication Number	Publication Date
NL203133A true NL203133A (xx)

Family

ID=23897505

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
NL100659D NL100659C (xx)	1954-12-27
NL203133D NL203133A (xx)	1954-12-27

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
NL100659D NL100659C (xx)	1954-12-27

Country Status (7)

Country	Link
US (1)	US2756374A (xx)
BE (1)	BE543951A (xx)
CH (1)	CH347900A (xx)
DE (1)	DE1010186B (xx)
FR (1)	FR1143327A (xx)
GB (1)	GB784899A (xx)
NL (2)	NL203133A (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1068816B (xx) *	1955-09-12	1959-11-12
US2889498A (en) *	1955-11-08	1959-06-02	Westinghouse Electric Corp	Semiconductor rectifier assembly
US2806187A (en) *	1955-11-08	1957-09-10	Westinghouse Electric Corp	Semiconductor rectifier device
NL101591C (xx) *	1956-03-22
US2984774A (en) *	1956-10-01	1961-05-16	Motorola Inc	Transistor heat sink assembly
NL111799C (xx) *	1957-03-01	1900-01-01
US2915685A (en) *	1957-05-27	1959-12-01	Int Rectifier Corp	Dry rectifier assembly and housing therefor
US2864980A (en) *	1957-06-10	1958-12-16	Gen Electric	Sealed current rectifier
US2975342A (en) *	1957-08-16	1961-03-14	Research Corp	Narrow base planar junction punch-thru diode
US2987658A (en) *	1958-01-10	1961-06-06	Philco Corp	Improved semiconductor diode
US2921245A (en) *	1958-10-08	1960-01-12	Int Rectifier Corp	Hermetically sealed junction means
US2946935A (en) *	1958-10-27	1960-07-26	Sarkes Tarzian	Diode
US3030558A (en) *	1959-02-24	1962-04-17	Fansteel Metallurgical Corp	Semiconductor diode assembly and housing therefor
NL258020A (xx) *	1960-02-09
DE1271264B (de) *	1960-03-19	1968-06-27	Siemens Ag	Kuehlanordnung fuer elektronische Bauelemente, insbesondere fuer Halbleiteranordnungen
NL123901C (xx) *	1960-04-29
DE1123406B (de) *	1960-09-27	1962-02-08	Telefunken Patent	Verfahren zur Herstellung von legierten Halbleiteranordnungen
SE312860B (xx) *	1964-09-28	1969-07-28	Asea Ab
US3328650A (en) *	1965-01-14	1967-06-27	Int Rectifier Corp	Compression bonded semiconductor device
US4541004A (en) *	1982-11-24	1985-09-10	Burroughs Corporation	Aerodynamically enhanced heat sink
US7130197B2 (en) *	2004-09-09	2006-10-31	Artesyn Technologies, Inc.	Heat spreader

0
- NL NL100659D patent/NL100659C/xx active
- NL NL203133D patent/NL203133A/xx unknown
- BE BE543951D patent/BE543951A/xx unknown
1954
- 1954-12-27 US US477822A patent/US2756374A/en not_active Expired - Lifetime
1955
- 1955-12-22 GB GB36801/55A patent/GB784899A/en not_active Expired
- 1955-12-24 DE DEG18667A patent/DE1010186B/de active Pending
- 1955-12-27 FR FR1143327D patent/FR1143327A/fr not_active Expired
- 1955-12-27 CH CH347900D patent/CH347900A/de unknown

Also Published As

Publication number	Publication date
FR1143327A (fr)	1957-09-30
CH347900A (de)	1960-07-31
GB784899A (en)	1957-10-16
BE543951A (xx)
NL100659C (xx)
US2756374A (en)	1956-07-24
DE1010186B (de)	1957-06-13

Publication	Publication Date	Title
AT191484B (xx)
AT192924B (xx)
AT195977B (xx)	1958-02-25
JPS3115568Y1 (xx)	1956-09-25
AT196304B (xx)	1958-03-10
AT190491B (xx)	1957-07-10
AT189950B (xx)	1957-05-25
AT195836B (xx)	1958-02-25
AT197898B (xx)	1958-05-27
AT196486B (xx)	1958-03-25
JPS316973B1 (xx)	1956-08-17
AT195943B (xx)	1958-02-25
AT197727B (xx)	1958-05-27
AT196701B (xx)	1958-03-25
AT196784B (xx)	1958-03-25
AT196650B (xx)	1958-03-25
AT180229B (xx)	1954-11-25
AT197095B (xx)	1958-04-10
AT197192B (xx)	1958-04-10
AT197683B (xx)	1958-05-10
AT196786B (xx)	1958-03-25
AT214341B (xx)	1961-03-27
DE1078479C2 (xx)	1960-09-15
AT197929B (xx)	1958-05-27
AT198617B (xx)	1958-07-10