GB776301A - Improvements in or relating to methods of manufacturing semi-conductor devices - Google Patents

Improvements in or relating to methods of manufacturing semi-conductor devices

Info

Publication number
GB776301A
GB776301A GB35253/54A GB3525354A GB776301A GB 776301 A GB776301 A GB 776301A GB 35253/54 A GB35253/54 A GB 35253/54A GB 3525354 A GB3525354 A GB 3525354A GB 776301 A GB776301 A GB 776301A
Authority
GB
United Kingdom
Prior art keywords
electrode
wafer
electrodes
transistor
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35253/54A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB776301A publication Critical patent/GB776301A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P10/00—
    • H10P50/00—
    • H10P95/00—
    • H10P95/50—
    • H10W72/071—
    • H10W74/10—
    • H10W76/10—
    • H10W76/17—
    • H10W76/60—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/18—Mechanical movements
    • Y10T74/18056—Rotary to or from reciprocating or oscillating
    • Y10T74/18088—Rack and pinion type
    • Y10T74/1812—Alternately rotated pinion

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
GB35253/54A 1953-12-09 1954-12-06 Improvements in or relating to methods of manufacturing semi-conductor devices Expired GB776301A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL183475 1953-12-09

Publications (1)

Publication Number Publication Date
GB776301A true GB776301A (en) 1957-06-05

Family

ID=19750635

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35253/54A Expired GB776301A (en) 1953-12-09 1954-12-06 Improvements in or relating to methods of manufacturing semi-conductor devices

Country Status (6)

Country Link
US (1) US2911706A (enExample)
BE (1) BE533946A (enExample)
DE (1) DE1018555B (enExample)
FR (1) FR1115250A (enExample)
GB (1) GB776301A (enExample)
NL (1) NL91651C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1163977B (de) * 1962-05-15 1964-02-27 Intermetall Sperrfreier Kontakt an einer Zone des Halbleiterkoerpers eines Halbleiterbauelementes

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL216667A (enExample) * 1956-04-25
NL121250C (enExample) * 1958-01-16
NL110575C (enExample) * 1958-01-17 1965-02-15 Philips Nv
GB860400A (en) * 1958-07-17 1961-02-01 Ass Elect Ind Improvements relating to semi-conductor diodes
DE1071846B (enExample) * 1959-01-03 1959-12-24
US3079254A (en) * 1959-01-26 1963-02-26 George W Crowley Photographic fabrication of semiconductor devices
LU38605A1 (enExample) * 1959-05-06
GB871161A (en) * 1959-05-13 1961-06-21 Ass Elect Ind Improvements relating to the production of junction transistors
US6849918B1 (en) * 1965-09-28 2005-02-01 Chou H. Li Miniaturized dielectrically isolated solid state device
US5696402A (en) * 1965-09-28 1997-12-09 Li; Chou H. Integrated circuit device
US7038290B1 (en) * 1965-09-28 2006-05-02 Li Chou H Integrated circuit device
US3448354A (en) * 1967-01-20 1969-06-03 Rca Corp Semiconductor device having increased resistance to second breakdown
US20040144999A1 (en) * 1995-06-07 2004-07-29 Li Chou H. Integrated circuit device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665399A (en) * 1954-01-05 Rectifier assembly
US2629800A (en) * 1950-04-15 1953-02-24 Bell Telephone Labor Inc Semiconductor signal translating device
BE523775A (enExample) * 1950-09-29
GB728244A (en) * 1951-10-19 1955-04-13 Gen Electric Improvements in and relating to germanium photocells
US2802159A (en) * 1953-10-20 1957-08-06 Hughes Aircraft Co Junction-type semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1163977B (de) * 1962-05-15 1964-02-27 Intermetall Sperrfreier Kontakt an einer Zone des Halbleiterkoerpers eines Halbleiterbauelementes

Also Published As

Publication number Publication date
BE533946A (enExample)
DE1018555B (de) 1957-10-31
US2911706A (en) 1959-11-10
FR1115250A (fr) 1956-04-20
NL91651C (enExample)

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