GB749392A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB749392A
GB749392A GB26378/53A GB2637853A GB749392A GB 749392 A GB749392 A GB 749392A GB 26378/53 A GB26378/53 A GB 26378/53A GB 2637853 A GB2637853 A GB 2637853A GB 749392 A GB749392 A GB 749392A
Authority
GB
United Kingdom
Prior art keywords
indium
germanium
junction
plates
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB26378/53A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB749392A publication Critical patent/GB749392A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
GB26378/53A 1952-10-22 1953-09-24 Semiconductor devices Expired GB749392A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US316171A US2759133A (en) 1952-10-22 1952-10-22 Semiconductor devices

Publications (1)

Publication Number Publication Date
GB749392A true GB749392A (en) 1956-05-23

Family

ID=23227816

Family Applications (1)

Application Number Title Priority Date Filing Date
GB26378/53A Expired GB749392A (en) 1952-10-22 1953-09-24 Semiconductor devices

Country Status (5)

Country Link
US (2) US2759133A (enExample)
BE (1) BE523682A (enExample)
FR (1) FR1088007A (enExample)
GB (1) GB749392A (enExample)
NL (1) NL182212B (enExample)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882464A (en) * 1952-12-04 1959-04-14 Raytheon Mfg Co Transistor assemblies
NL104654C (enExample) * 1952-12-31 1900-01-01
US2823148A (en) * 1953-03-02 1958-02-11 Rca Corp Method for removing portions of semiconductor device electrodes
US2809332A (en) * 1953-07-29 1957-10-08 Rca Corp Power semiconductor devices
US2847335A (en) * 1953-09-15 1958-08-12 Siemens Ag Semiconductor devices and method of manufacturing them
US2850687A (en) * 1953-10-13 1958-09-02 Rca Corp Semiconductor devices
NL87784C (enExample) * 1953-10-23 1958-04-15
GB805292A (en) * 1953-12-02 1958-12-03 Philco Corp Semiconductor devices
BE535032A (enExample) * 1954-01-21
US2980594A (en) * 1954-06-01 1961-04-18 Rca Corp Methods of making semi-conductor devices
US3299331A (en) * 1955-05-10 1967-01-17 Texas Instruments Inc Transistor structure with heatconductive housing for cooling
US2941131A (en) * 1955-05-13 1960-06-14 Philco Corp Semiconductive apparatus
US3193737A (en) * 1955-05-18 1965-07-06 Ibm Bistable junction transistor
US2909715A (en) * 1955-05-23 1959-10-20 Texas Instruments Inc Base contacts for transistors
US2897587A (en) * 1955-05-23 1959-08-04 Philco Corp Method of fabricating semiconductor devices
US2927222A (en) * 1955-05-27 1960-03-01 Philco Corp Polarizing semiconductive apparatus
US2906932A (en) * 1955-06-13 1959-09-29 Sprague Electric Co Silicon junction diode
US2842841A (en) * 1955-06-13 1958-07-15 Philco Corp Method of soldering leads to semiconductor devices
NL101253C (enExample) * 1955-09-12
US2830238A (en) * 1955-09-30 1958-04-08 Hughes Aircraft Co Heat dissipating semiconductor device
NL251064A (enExample) * 1955-11-04
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
BE562491A (enExample) * 1956-03-05 1900-01-01
NL215386A (enExample) * 1956-03-30
US3020635A (en) * 1956-05-31 1962-02-13 Raytheon Co Soldering methods
DE1156173B (de) * 1956-07-11 1963-10-24 Bosch Gmbh Robert Leistungstransistor
US2994017A (en) * 1956-09-07 1961-07-25 Int Rectifier Corp Air-cooled rectifier assembly
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US2955242A (en) * 1956-11-27 1960-10-04 Raytheon Co Hermetically sealed power transistors
US2996800A (en) * 1956-11-28 1961-08-22 Texas Instruments Inc Method of making ohmic connections to silicon semiconductors
BE554048A (enExample) * 1957-01-09 1957-01-31
US2953693A (en) * 1957-02-27 1960-09-20 Westinghouse Electric Corp Semiconductor diode
US2981873A (en) * 1957-05-02 1961-04-25 Sarkes Tarzian Semiconductor device
US2915685A (en) * 1957-05-27 1959-12-01 Int Rectifier Corp Dry rectifier assembly and housing therefor
US3046651A (en) * 1958-03-14 1962-07-31 Honeywell Regulator Co Soldering technique
US2963631A (en) * 1958-07-10 1960-12-06 Texas Instruments Inc Arrangement for increasing heat dissipation in semi-conductor-device
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US3130272A (en) * 1958-10-17 1964-04-21 Talk A Phone Co Intercommunication system
US3066248A (en) * 1958-12-16 1962-11-27 Sarkes Tarzian Semiconductor device
FR1209312A (fr) * 1958-12-17 1960-03-01 Hughes Aircraft Co Perfectionnements aux dispositifs semi-conducteurs du type à jonction
US3257588A (en) * 1959-04-27 1966-06-21 Rca Corp Semiconductor device enclosures
US2964431A (en) * 1959-07-28 1960-12-13 Rca Corp Jig alloying of semiconductor devices
US3110089A (en) * 1959-12-16 1963-11-12 Engelhard Ind Inc Method of bonding amalgam inserts in cavities and structure thereby produced
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
GB910063A (en) * 1960-03-09 1962-11-07 Westinghouse Electric Corp Semi-conductor devices
DE1230912B (de) * 1960-06-09 1966-12-22 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung
US3141238A (en) * 1960-11-22 1964-07-21 Jr George G Harman Method of low temperature bonding for subsequent high temperature use
US3187423A (en) * 1962-01-04 1965-06-08 Lloyd C Lantz Method of releasing solid solder from a joint
US3255394A (en) * 1962-06-15 1966-06-07 Gen Motors Corp Transistor electrode connection
US3248615A (en) * 1963-05-13 1966-04-26 Bbc Brown Boveri & Cie Semiconductor device with liquidized solder layer for compensation of expansion stresses
US3355635A (en) * 1964-05-28 1967-11-28 Rca Corp Semiconductor device assemblage having two convex tabs
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
FR2052245A5 (enExample) * 1969-07-31 1971-04-09 Cit Alcatel
US3839780A (en) * 1971-04-14 1974-10-08 Raytheon Co Method of intermetallic bonding
FR2150214A1 (enExample) * 1971-08-20 1973-04-06 Thomson Csf
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
DE3527208A1 (de) * 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
US4788471A (en) * 1986-11-21 1988-11-29 Zenith Electronics Corporation Sealing for CRT components
JPH0547812A (ja) * 1991-08-19 1993-02-26 Mitsubishi Electric Corp 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563503A (en) * 1951-08-07 Transistor
US2563504A (en) * 1951-08-07 Semiconductor translating device
US924827A (en) * 1907-09-16 1909-06-15 Greenleaf Whittier Pickard Oscillation-receiver.
GB476375A (en) * 1936-07-16 1937-12-07 British Thomson Houston Co Ltd Improvements in and relating to methods of uniting metals
US2162487A (en) * 1936-09-28 1939-06-13 Westinghouse Electric & Mfg Co Selenium rectifier
GB492088A (en) * 1937-04-27 1938-09-14 British Thomson Houston Co Ltd Improvements in and relating to methods of joining metals
US2220961A (en) * 1937-11-06 1940-11-12 Bell Telephone Labor Inc Soldering alloy
US2646536A (en) * 1946-11-14 1953-07-21 Purdue Research Foundation Rectifier
US2629672A (en) * 1949-07-07 1953-02-24 Bell Telephone Labor Inc Method of making semiconductive translating devices
NL167482C (nl) * 1951-05-05 Toray Industries Kunstleervlies.
US2684457A (en) * 1951-09-04 1954-07-20 Gen Electric Asymmetrically conductive unit
US2639380A (en) * 1952-05-01 1953-05-19 Hollmann Hans Erich Electrical device and method of preparation
US2697052A (en) * 1953-07-24 1954-12-14 Bell Telephone Labor Inc Fabricating of semiconductor translating devices

Also Published As

Publication number Publication date
US2735050A (en) 1956-02-14
NL182212B (nl)
US2759133A (en) 1956-08-14
FR1088007A (fr) 1955-03-02
BE523682A (enExample)

Similar Documents

Publication Publication Date Title
GB749392A (en) Semiconductor devices
US2725505A (en) Semiconductor power devices
US2887628A (en) Semiconductor device construction
US3290564A (en) Semiconductor device
US3343255A (en) Structures for semiconductor integrated circuits and methods of forming them
US3025439A (en) Mounting for silicon semiconductor device
GB902176A (en) Thermoelectric cooling device
US2905873A (en) Semiconductor power devices and method of manufacture
GB1400608A (en) Transcalent semiconductor device
US3495023A (en) Flat pack having a beryllia base and an alumina ring
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
GB1292636A (en) Semiconductor devices and methods for their fabrication
GB1471495A (en) Heat-sink cooled power semiconductor device assembly
US2702360A (en) Semiconductor rectifier
GB768731A (en) Improvements in junction type semiconductor electrical devices
US3001113A (en) Semiconductor device assemblies
US3002271A (en) Method of providing connection to semiconductive structures
US2830238A (en) Heat dissipating semiconductor device
US3058041A (en) Electrical cooling devices
GB802429A (en) Improvements in semi-conductor devices
US2675509A (en) High-frequency response semiconductor device
US2864006A (en) Cooling structure for semiconductor devices
GB1000023A (en) Semi-conductor devices
US2874340A (en) Rectifying contact
GB817746A (en) Improvements in or relating to coolers for semi-conductor cells