GB552330A - Improvements in or relating to soft solders - Google Patents

Improvements in or relating to soft solders

Info

Publication number
GB552330A
GB552330A GB1599341A GB1599341A GB552330A GB 552330 A GB552330 A GB 552330A GB 1599341 A GB1599341 A GB 1599341A GB 1599341 A GB1599341 A GB 1599341A GB 552330 A GB552330 A GB 552330A
Authority
GB
United Kingdom
Prior art keywords
relating
per cent
soft solders
soft
solders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1599341A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Matthey PLC
Original Assignee
Johnson Matthey PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey PLC filed Critical Johnson Matthey PLC
Priority to GB1599341A priority Critical patent/GB552330A/en
Publication of GB552330A publication Critical patent/GB552330A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Abstract

552,330. Alloys. POWELL, A. R., and JOHNSON, MATTHEY & CO., Ltd. Dec. 11, 1941, No. 15993. [Class 82 (i)] A soft solder having a high resistance to creep at elevated temperatures consists of a lead alloy with 0.5-2.5 per cent. of silver and 0.5-10 per cent. preferably 4-6 per cent. of tin.
GB1599341A 1941-12-11 1941-12-11 Improvements in or relating to soft solders Expired GB552330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1599341A GB552330A (en) 1941-12-11 1941-12-11 Improvements in or relating to soft solders

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1599341A GB552330A (en) 1941-12-11 1941-12-11 Improvements in or relating to soft solders

Publications (1)

Publication Number Publication Date
GB552330A true GB552330A (en) 1943-04-01

Family

ID=10069261

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1599341A Expired GB552330A (en) 1941-12-11 1941-12-11 Improvements in or relating to soft solders

Country Status (1)

Country Link
GB (1) GB552330A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2968089A (en) * 1956-03-30 1961-01-17 Borg Warner Bronze to aluminum bond and the method of making it
EP0198353A2 (en) * 1985-04-12 1986-10-22 International Business Machines Corporation Lead base alloys and their application for reducing electromigration activity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2968089A (en) * 1956-03-30 1961-01-17 Borg Warner Bronze to aluminum bond and the method of making it
EP0198353A2 (en) * 1985-04-12 1986-10-22 International Business Machines Corporation Lead base alloys and their application for reducing electromigration activity
EP0198353A3 (en) * 1985-04-12 1988-09-14 International Business Machines Corporation Lead base alloys and their application for reducing electromigration activity

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