GB267172A - Improvements in wireless and other electrical apparatus - Google Patents

Improvements in wireless and other electrical apparatus

Info

Publication number
GB267172A
GB267172A GB2274425A GB2274425A GB267172A GB 267172 A GB267172 A GB 267172A GB 2274425 A GB2274425 A GB 2274425A GB 2274425 A GB2274425 A GB 2274425A GB 267172 A GB267172 A GB 267172A
Authority
GB
United Kingdom
Prior art keywords
stampings
layer
sockets
panel
plugs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2274425A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEORGE WILLIAM CROOT
PARAGON RUBBER Manufacturing Co Ltd
Original Assignee
GEORGE WILLIAM CROOT
PARAGON RUBBER Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEORGE WILLIAM CROOT, PARAGON RUBBER Manufacturing Co Ltd filed Critical GEORGE WILLIAM CROOT
Priority to GB2274425A priority Critical patent/GB267172A/en
Publication of GB267172A publication Critical patent/GB267172A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

267,172. Paragon Rubber Manufacturing Co., Ltd., and Croot, G. W. Sept. 11, 1925. Receiving - sets, construction of.-In a wireless receiving set or other electrical apparatus comprising a panel to which the components are attached by plug and socket means, the connections between the fixed plugs or sockets are embodied m the panel. Thus the connecting leads may be stamped out of sheet metal e by a press tool # co-operating with a die d. The stampings fall upon a layer c of mouldable material. Flanged sockets b or plugs may then be pressed through holes previously formed in the stampings and through the material c, which is held in a mould a or template for the purpose, and a second layer g of mouldable material is added, the layers c, g being then vulcanized to form a panel. The layer g may be drilled to provide access to the sockets b or plugs. In modifications (a) sockets or plugs may be embedded in layer c and have pins extending above this layer to make contact with the stampings ; (b) there may be three layers of insulating material containing two insulated layers of stampings; (c) the stampings may be of substantial thickness and may be pressed into the layer c, an insulating cover being provided if desired; (d) the layer c may be provided with grooves for the stampings; (e) instead of stampings, the connecting conductors may comprise metal which has been run into grooves when molten; (f) metal may be sprayed upon the panel through a stencil, or deposited by electrodeposition or electrotyping; (g) one panel formed as described may be mounted at rightangles upon another, the two being attached by screws and sockets which serve to connect the two systems electrically.
GB2274425A 1925-09-11 1925-09-11 Improvements in wireless and other electrical apparatus Expired GB267172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2274425A GB267172A (en) 1925-09-11 1925-09-11 Improvements in wireless and other electrical apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2274425A GB267172A (en) 1925-09-11 1925-09-11 Improvements in wireless and other electrical apparatus

Publications (1)

Publication Number Publication Date
GB267172A true GB267172A (en) 1927-03-11

Family

ID=10184386

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2274425A Expired GB267172A (en) 1925-09-11 1925-09-11 Improvements in wireless and other electrical apparatus

Country Status (1)

Country Link
GB (1) GB267172A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3509624A (en) * 1967-09-11 1970-05-05 Sanders Associates Inc Method of making multilayer printed circuits
GB2288075A (en) * 1994-03-30 1995-10-04 Electrovac Circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3509624A (en) * 1967-09-11 1970-05-05 Sanders Associates Inc Method of making multilayer printed circuits
GB2288075A (en) * 1994-03-30 1995-10-04 Electrovac Circuit board
GB2288075B (en) * 1994-03-30 1998-07-15 Electrovac Circuit boards and their manufacture
US5819858A (en) * 1994-03-30 1998-10-13 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Circuit board having a metal matrix composite inlay

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