GB2570820A - Macromolecular conductive wear-resistant composite board and manufacturing process thereof - Google Patents

Macromolecular conductive wear-resistant composite board and manufacturing process thereof Download PDF

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Publication number
GB2570820A
GB2570820A GB1905867.6A GB201905867A GB2570820A GB 2570820 A GB2570820 A GB 2570820A GB 201905867 A GB201905867 A GB 201905867A GB 2570820 A GB2570820 A GB 2570820A
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United Kingdom
Prior art keywords
holes
board
resistant composite
copper plate
macromolecular
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GB1905867.6A
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GB2570820B (en
GB201905867D0 (en
Inventor
Huang Kai
Huang Beilei
Ye Halei
Huang Yi
Chen Shengquan
Zhou Changwang
Xu Youqing
Yang Xiaojun
Huang Donglai
Ye Hui
Fang Minghua
He Linjuan
Dai Danyan
Lei Xunning
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Jiangxi Eastern Leopard Fastener Co Ltd
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Jiangxi Eastern Leopard Fastener Co Ltd
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Publication of GB201905867D0 publication Critical patent/GB201905867D0/en
Publication of GB2570820A publication Critical patent/GB2570820A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/103—Metal fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/80—Sintered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/30—Iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00—Vehicles
    • B32B2605/08—Cars

Abstract

The wear resistant board comprises a matrix layer, an intermediate layer and a macromolecular, conductive, inner layer. The matrix and intermediate layers are integrally sintered. The conductive layer overall wraps the intermediate layer, which contains holes, preferably tensile through holes. The preferred holes are tapered, stretched, and punched at equal distances. The matrix is preferably steel. The intermediate layer is preferably copper. The preferred inner layer comprises 25% polytetrafluoroethylene (PTFE), 10% glass fibre, 60% graphite and 5% molybdenum disulphide (MoS2) and has resistance < 1000 Ω. Production of the board using an electric furnace at 900-930 °C in a protective atmosphere of 70% hydrogen (H2) and 30% nitrogen (N2) at 0.7-0.8 mPa is also claimed. The polymeric composition is injected into the holes in the intermediate layer, before the board is rolled and plasticised at 380 °C. The board is used in machinery, cars, high-speed trains and aeroplanes.

Description

MACROMOLECULAR CONDUCTIVE WEAR-RESISTANT COMPOSITE
BOARD AND MANUFACTURING PROCESS THEREOF
TECHNICAL FIELD [0001] The present invention relates to the technical field of novel composite materials, and more particularly relates to a macromolecular conductive wear-resistant composite board and a manufacturing process thereof.
BACKGROUND ART [0002] At present, more advanced boards in the wear-resistant board industry are mainly as follows: 1. a board composed of a steel plate, copper powder and polytetrafluoroethylene has the advantages of light weight and self-lubrication without oiling, but also has serious defects, such as a thin wear layer, short wear time and low wear resistance; 2. a board composed of a steel plate, a copper mesh and polytetrafluoroethylene; although this board significantly improves some defects of the structure composed of the steel plate, the copper powder and the polytetrafluoroethylene and increases the thickness of a wear-resistant layer to a large extent to prolong the service life, since the copper mesh is woven by copper wires, the copper wires are likely to have the defects of spinning and loosening under the influence of a force during processing of a finished board product, which affects the quality of the finished board product.
[0003] In an automobile with rear window heating and defogging functions, a rear trunk glass circuit needs to be connected through a bushing of a door hinge to realize the heating and defogging functions. However, since the polytetrafluoroethylene material as macromolecular material is non-conductive, and a macromolecular wear-resistant surface of an inner layer of a traditional bushing is non-conductive, an automobile factory needs to add a wiring harness to realize a conductive function, which not only increases the automobile manufacturing cost, but also increases the risk of line leakage and the like.
SUMMARY OF THE INVENTION [0004] In order to solve the defects and deficiencies in the prior art, the present invention provides a macromolecular conductive wear-resistant composite board and a manufacturing process thereof, so as to overcome the two technical problems in the prior art that a copper mesh is spun, loosened and non-conductive, so that the macromolecular conductive wear-resistant composite board has characteristics of strong sintering, tight structure, stable conductivity and high wear resistance, which greatly improves the suitability, extensiveness and reliability of a conductive composite material.
[0005] A technical solution adopted in the present invention is as follows: a macromolecular conductive wear-resistant composite board. The macromolecular conductive wear-resistant composite board is composed of a matrix layer, an intermediate layer and a macromolecular conductive inner layer in sequence from bottom to top. The matrix layer and the intermediate layer are integrally sintered. A plurality of through holes are formed in the intermediate layer. The macromolecular conductive inner layer overall wraps the intermediate layer.
[0006] The through holes in the surface of the intermediate layer are tensile through holes that are stretched and punched at equal distances, and the tensile through holes are of round-table-shaped tapered sunken structures on the intermediate layer material.
[0007] The matrix layer is superposed with the surface, having a large aperture of the tensile through holes of the round-table-shaped tapered sunken structures, of the intermediate layer. [0008] The matrix layer is a strip steel plate.
[0009] The intermediate layer is a strip copper plate.
[0010] A small aperture of each of the tensile through holes of the round-table-shaped tapered sunken structures of the intermediate layer is Φ1.5 mm, and a large aperture of each of the tensile through holes is Φ2 mm, and each of the tensile through holes has a height of 0.45 mm.
[0011] The macromolecular conductive inner layer is a macromolecular conductive wear-resistant composite material having a resistance value less than 1000 Ω and having conductive performance. The macromolecular conductive wear-resistant composite material is composed of 25% of polytetrafluoroethylene, 10% of glass fiber, 60% of graphite and 5% of molybdenum disulfide.
[0012] A manufacturing process of a macromolecular conductive wear-resistant composite board includes the following steps:
(1) releasing and cutting: placing a strip steel plate and a strip copper plate at cutting positions, cutting the strip steel plate and the strip copper plate according to required sizes, and forming a strip steel plate and a strip copper plate of required specifications;
(2) punching: continuously and automatically punching the strip copper plate at equal distances in longitudinal and transverse directions, so as to form a plurality of small tapered tensile holes of 1.5 x 2 x 0.45 mm in the surface of the strip copper plate;
(3) sintering: simultaneously putting the strip copper plate punched with the small tensile holes and the cut strip steel plate into an electric furnace through a limiter, performing high-temperature sintering under a protective atmosphere condition, and superposing one surface of the strip steel plate with the surface having a large aperture of the through holes on the strip copper plate, wherein the strip steel plate is placed below the strip copper plate, and the strip steel plate and the strip copper plate are sintered to form a whole, and a temperature is controlled at 900°C to 930°C and the time is 700 r/min;
(4) cooling: naturally cooling an integrated board, formed by sintering the strip steel plate and the strip copper plate with the holes, in air through a cooling water tank;
(5) injection: pressing a macromolecular conductive wear-resistant composite material into the surface and the small tensile holes of the strip copper plate of the integrally sintered board, wherein the macromolecular conductive wear-resistant composite material is formed by stirring 25% of polytetrafluoroethylene, 10% of glass fiber, 60% of graphite and 5% of molybdenum disulfide;
(6) drying: putting the integrally sintered composite board into a drying furnace for drying at a drying temperature of 300°C for drying time of 700 r/min;
(7) primary rolling: placing the dried board below a rolling mill for primary rolling, so as to enable the board to basically have a required thickness;
(8) plasticizing: putting the primarily rolled board into the electric furnace for plasticizing and sintering under a protective atmosphere condition, wherein a plasticizing temperature is 380°C, and a rotating speed of a mesh belt furnace is 700 r/min;
(9) finish rolling: placing the plasticized board onto a finish rolling mill for finish rolling through a roller, so as to control the thickness precision of the board to be within +/- 0.03 mm to form the macromolecular conductive wear-resistant composite board; and (10) winding: winding the finish-rolled board into a bundle under the action of a traction motor. [0013] The protective atmosphere in the step (3) is mixed gas composed of 70% of hydrogen and 30% of nitrogen, and a pressure is 0.7 mpa to 0.8 mpa.
[0014] The protective atmosphere in the step (8) is nitrogen, and a gas pressure is maintained at 0.6 mpa to 0.8 mpa.
10015] The present invention has the beneficial effects that the present invention provides the macromolecular conductive wear-resistant composite board and the manufacturing process thereof. The strip steel plate serves as the matrix, and the strip copper plate serves as the intermediate layer, and the macromolecular conductive wear-resistant composite material serves as the inner layer. The composite board solves the problem that macromolecular plastic is non-conductive, and avoids the deficiencies of spinning and loosening of a copper mesh. According to the manufacturing process of the present invention, the strip steel plate, the strip copper plate and the macromolecular wear-resistant material are prepared into the integrated macromolecular conductive wear-resistant composite board through a working mode of an automatic assembly line. The manufacturing process has the characteristics of high efficiency, high speed, no waste produced during manufacturing, strong sintering, tight structure, stable conductivity, high wear resistance and the like, which greatly improves the suitability, extensiveness and reliability of conductive composite materials. A novel macromolecular conductive wear-resistant board is provided for the industries such as machinery, automobiles, high-speed trains and aircrafts in China. In addition, the preparation process of the macromolecular conductive wear-resistant composite board of the present invention can realize streamlined production, has high production efficiency and high quality, and can be applied in large scale.
BRIEF DESCRIPTION OF THE DRAWINGS [0016] Fig. 1 is a flow chart of a process of the present invention;
[0017] Fig. 2 is a structural schematic diagram of tensile holes of a copper plate of the present invention; and [0018] Fig. 3 is a structural schematic diagram of a macromolecular conductive wear-resistant composite board of the present invention.
DETAILED DESCRIPTION OF THE INVENTION [0019] In order to describe the contents of the present invention more clearly, specific embodiments are described below, and do not define the scope of the contents of the present invention.
[0020] A macromolecular conductive wear-resistant composite board is provided. The macromolecular conductive wear-resistant composite board is composed of a matrix layer, an intermediate layer and a macromolecular conductive inner layer in sequence from bottom to top. The matrix layer is a steel plate or other metal plates, preferably a strip steel plate SPCC, which is of a size of 0.5 mm x 1000 m. The intermediate layer is a copper plate or other metal plates, preferably a strip copper plate QSN6.5-0.1, which is high in intensity, elasticity, wear resistance and diamagnetism, has good pressure processibility in a hot state and a cold state, is relatively high in flame retardancy to electric sparks, is weldable and brazable, is good in cuttability, can resist corrosion in an atmosphere and fresh water and is of a size of 6.5 mm to 0.1 m. The macromolecular conductive inner layer is a macromolecular conductive wear-resistant composite material. The macromolecular conductive wear-resistant composite material is composed of 25% of polytetrafluoroethylene, 10% of glass fiber, 60% of graphite and 5% of molybdenum disulfide. The wear resistance of the manufactured board is enhanced, and the manufactured board has the conductive performance. The macromolecular conductive wear-resistant composite material is formed by stirring the polytetrafluoroethylene, the glass fiber, the graphite and the molybdenum disulfide. The matrix layer and the intermediate layer are synchronously combined and integrally sintered. The strip steel plate is placed below the strip copper plate. A plurality of tensile through holes that are stretched and punched at equal distances are formed in the surface of the intermediate layer in longitudinal and transverse directions, and the tensile through holes are of round-table-shaped tapered sunken structures on the intermediate layer material. The round-table-shaped tapered sunken structures increase the overall structural intensity of the strip copper plate, and also enable the macromolecular conductive inner layer overall wrapped in the strip copper plate to be difficult to separate from the strip copper plate, thereby enhancing the combination strength between the strip copper plate and the macromolecular conductive inner layer and enabling a macromolecular conductive inner layer material injected through the tensile through holes to cover the strip copper plate more easily and uniformly. A small aperture of each of the tensile through holes of the round-table-shaped tapered sunken structures of the intermediate layer material is 1.5 mm, and a large aperture of each of the tensile through holes is 2 mm, and each of the tensile through holes has a height of 0.45 mm. The matrix layer is superposed with the surface, having the large aperture of the tensile through holes of the round-table-shaped tapered sunken structures, of the intermediate layer. The macromolecular conductive inner layer overall wraps the intermediate layer.
10021] The macromolecular conductive wear-resistant composite board and a manufacturing process thereof of the present invention are specifically described below in detail in combination with Fig. 1. The macromolecular conductive wear-resistant composite board and the manufacturing process thereof include the following steps:
1, releasing: a strip steel plate and a strip copper plate are released through a traction motor, wherein a releasing speed is controlled by a speed adjustment motor; the steel plate adopts SPCC 0.5 mm x 1000 m, and the copper plate adopts QSN6.5-0.1; the strip copper plate QSN6.5-0.1 is high in intensity, elasticity, wear resistance and diamagnetism, has good pressure processibility in a hot state and a cold state, is relatively high in flame retardancy to electric sparks, is weldable and brazable, is good in cuttability and can resist corrosion in an atmosphere and fresh water;
2, cutting: the strip steel plate and the strip copper plate are cut according to required sizes through upper and lower disk blades, so as to form a required strip steel plate and a required strip copper plate;
3, punching: the cut strip copper plate of the required size is placed onto an automatic punching machine, and tensile through holes are continuously and automatically punched at equal distances in the copper plate in longitudinal and transverse directions, wherein the tensile through holes are stretched and punched at the equal distances; the tensile through holes are of round-table-shaped tapered sunken structures on an intermediate layer material; a diameter of a through hole and a height of the through hole are 1.5 m x 2 mm x 0.45 mm, namely a small aperture of the through hole x a large aperture of the through hole x the height of the through hole; the round-table-shaped tapered sunken structures increase the overall structural intensity of the strip copper plate, and also enable the macromolecular conductive inner layer entirely wrapped in the strip copper plate to be difficult to separate from the strip copper plate, thereby enhancing the combination strength between the strip copper plate and the macromolecular conductive inner layer and enabling a macromolecular conductive inner layer material injected through the tensile through holes to cover the strip copper plate more easily and uniformly;
4, sintering: the strip steel plate and the punched strip copper plate which have the same widths are put into a mesh belt type electric furnace through a limiter for high-temperature sintering, a temperature is controlled at 900°C to 930°C, and a rotating speed of a mesh belt is 700 r/min; one surface of the strip steel plate is superposed with the surface, having the large aperture of the through holes, of the strip copper plate, wherein the strip steel plate is placed below the strip copper plate, and the strip steel plate and the strip copper plate are sintered to form a whole, wherein in order to prevent plate oxidization, gas protection is needed in a sintering process, so that mixed gas composed of 70% of hydrogen and 30% of nitrogen is adopted, and a pressure is maintained at 0.7 mpa to 0.8 mpa;
5, cooling: a required integrated board formed by sintering the strip steel plate and the strip copper plate with the holes is withdrawn from a furnace port in the tail portion of the electric furnace, and then is naturally cooled in air through a cooling water tank, wherein water exists at the periphery of the cooling water tank, and the middle of the water tank is hollow and serves as a channel for board cooling;
6, injection: the cooled board is placed onto a worktable, and the stirred macromolecular conductive wear-resistant composite material is pressed into the surface and the small tensile holes of the strip copper plate through a rolling press, wherein the macromolecular conductive wear-resistant composite material is preferably composed of 25% of the polytetrafluoroethylene, 10% of the glass fiber, 60% of the graphite and 5% of the molybdenum disulfide, so that the wear resistance is enhanced, and the board also has conductive performance;
7, drying: the injected board is put into a drying furnace for drying at a drying temperature of 300 °C, and a rotating speed of the mesh belt furnace is 700 r/min;
8, primary rolling: the dried board is placed below a rolling mill for primary rolling, so as to enable the board to basically have a required thickness;
9, plasticizing: the primarily rolled board is put into the mesh belt type electric furnace for plasticizing and sintering, wherein a plasticizing temperature is 380°C, and a rotating speed of the mesh belt furnace is 700 r/min; nitrogen protects the inside of the furnace, and a gas pressure is maintained at 0.6 mpa to 0.8 mpa;
10, finish rolling: the plasticized board is placed onto a finish rolling mill for finish rolling through a roller, so as to control the thickness precision of the board to be within +/- 0.03 mm to form the macromolecular conductive wear-resistant composite board as shown in Fig. 3; and
11, winding: the finish-rolled board is wound into a bundle under the action of the traction motor.
The manufacturing process of the present invention has high efficiency, high speed, no waste produced during manufacturing, strong sintering, tight structure, stable conductivity, high wear resistance and the like, which greatly improves the suitability, extensiveness and reliability of conductive composite materials. A novel macromolecular conductive wear-resistant board with stable structure is provided for the industries such as machinery, automobiles, high-speed trains and aircrafts in China. In addition, the preparation process of the macromolecular conductive wear-resistant composite board of the present invention can be applicable to automatic streamlined production, has high production efficiency and high quality, and can be applied in large scale.
[0022] The above describes only preferred implementation modes of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All the technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be noted that for those ordinary skilled in the art, several improvements and embellishments that are made without departing from the principle of the present invention shall also fall within the protection scope of the present invention.

Claims (7)

1. A macromolecular conductive wear-resistant composite board, characterized in that the macromolecular conductive wear-resistant composite board is composed of a matrix layer, an intermediate layer and a macromolecular conductive inner layer in sequence from bottom to top; the matrix layer and the intermediate layer are integrally sintered; a plurality of through holes are formed in the intermediate layer; and the macromolecular conductive inner layer overall wraps the intermediate layer.
2. The macromolecular conductive wear-resistant composite board according to claim 1, characterized in that the through holes in the surface of the intermediate layer arc tensile through holes that are stretched and punched at equal distances, and the tensile through holes are of round-table-shaped tapered sunken structures on the intermediate layer material; and the matrix layer and the surface, having a large aperture of the tensile through holes of the round-table-shaped tapered sunken structures, of the intermediate layer are integrated through a sintering process.
3. The macromolecular conductive wear-resistant composite board according to claim1, characterized in that the matrix layer is a steel plate.
4. The macromolecular conductive wear-resistant composite board according to claim1, characterized in that the intermediate layer is a copper plate.
5. The macromolecular conductive wear-resistant composite board according to claim2, characterized in that a small aperture of each of the tensile through holes of the round-table-shaped tapered sunken structures of the intermediate layer material is Φ1.5 mm, and a large aperture of each of the tensile through holes is Φ2 mm, and each of the tensile through holes has a height of 0.45 mm.
6. The macromolecular conductive wear-resistant composite board according to claim 1, characterized in that the macromolecular conductive inner layer is a macromolecular conductive wear-resistant composite material having a resistance value less than 1000 Ω and having conductive performance, and the macromolecular conductive wear-resistant composite material is composed of 25% of polytetrafluoroethylene, 10% of glass fiber, 60% of graphite and 5% of molybdenum disulfide.
7. A manufacturing process of a macromolecular conductive wear-resistant composite board, characterized by comprising the following steps:
(1) releasing and cutting: placing a steel plate and a copper plate at cutting positions, cutting the steel plate and the copper plate according to required sizes, and forming a steel plate and a copper plate of required specifications;
(2) punching: continuously and automatically punching the copper plate at equal distances in longitudinal and transverse directions, so as to form a plurality of small tapered tensile holes of 1.5 x 2 x 0.45 mm in the surface of the copper plate;
(3) sintering: simultaneously putting the copper plate punched with the small tensile holes and the cut steel plate into an electric furnace through a limiter, performing high-temperature sintering under a protective atmosphere condition, and superposing one surface of the steel plate with the surface, having a large aperture of the through holes, of the copper plate, wherein the strip steel plate is placed below the strip copper plate, and the strip steel plate and the strip copper plate are sintered to form a whole, and a temperature is controlled at 900°C to 930°C, and the time is 700 r/min; the protective atmosphere is mixed gas composed of 70% of hydrogen and 30% of nitrogen, and a pressure is 0.7 mpa to 0.8 mpa;
(4) cooling: naturally cooling an integrated board, formed by sintering the steel plate and the copper plate with the holes, in air through a cooling water tank;
(5) injection: pressing a macromolecular conductive wear-resistant composite material into the surface and the small tensile holes of the copper plate of the integrally sintered board;
(6) drying: putting the integrally sintered composite board into a drying furnace for drying at a drying temperature of 300°C for drying time of 700 r/min;
(7) primary rolling: placing the dried board below a rolling mill for primary rolling, so as to enable the board to basically have a required thickness;
(8) plasticizing: putting the primarily rolled board into the electric furnace for plasticizing and sintering under a protective atmosphere condition, wherein a plasticizing temperature is 380°C, and a rotating speed of a mesh belt furnace is 700 r/min;
(9) finish rolling: placing the plasticized board onto a finish rolling mill for finish rolling through a roller, so as to control the thickness precision of the board to be within +/- 0.03 mm to form the macromolecular conductive wear-resistant composite board; and (10) winding: winding the finish-rolled board into a bundle under the action of a traction motor, so as to complete the board manufacturing process.
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