GB2473628A - Process for cutting a multiplicity of wafers - Google Patents
Process for cutting a multiplicity of wafers Download PDFInfo
- Publication number
- GB2473628A GB2473628A GB0916339A GB0916339A GB2473628A GB 2473628 A GB2473628 A GB 2473628A GB 0916339 A GB0916339 A GB 0916339A GB 0916339 A GB0916339 A GB 0916339A GB 2473628 A GB2473628 A GB 2473628A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solvent
- block
- wires
- surfactant
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 235000012431 wafers Nutrition 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005520 cutting process Methods 0.000 title claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 54
- 239000004094 surface-active agent Substances 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 10
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 6
- 229920002113 octoxynol Polymers 0.000 claims abstract description 5
- 239000002562 thickening agent Substances 0.000 claims abstract description 4
- JYCQQPHGFMYQCF-UHFFFAOYSA-N 4-tert-Octylphenol monoethoxylate Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCO)C=C1 JYCQQPHGFMYQCF-UHFFFAOYSA-N 0.000 claims abstract description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 3
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 claims abstract description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 17
- 239000010432 diamond Substances 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000002736 nonionic surfactant Substances 0.000 claims description 8
- 150000001455 metallic ions Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 229920001400 block copolymer Polymers 0.000 description 5
- 229920001983 poloxamer Polymers 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- -1 ethylene glycol-polypropylene Chemical group 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HCQKNMBGTLTZCQ-UHFFFAOYSA-N 2-[8-(2-hydroxyphenyl)octyl]phenol Chemical compound OC1=CC=CC=C1CCCCCCCCC1=CC=CC=C1O HCQKNMBGTLTZCQ-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000001828 Gelatine Substances 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000004435 Oxo alcohol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000013504 Triton X-100 Substances 0.000 description 1
- 229920004890 Triton X-100 Polymers 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 229920000591 gum Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
- B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/005—Cutting sheet laminae in planes between faces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0916339A GB2473628A (en) | 2009-09-17 | 2009-09-17 | Process for cutting a multiplicity of wafers |
| PCT/NO2010/000339 WO2011034439A1 (en) | 2009-09-17 | 2010-09-17 | Sawing of blocks into wafers using diamond coated wires |
| JP2012529704A JP2013505576A (ja) | 2009-09-17 | 2010-09-17 | ダイヤモンドでコーティングしたワイヤーを用いたブロックのウエハーへの切断 |
| TW099131673A TW201131628A (en) | 2009-09-17 | 2010-09-17 | Sawing of blocks into wafers using diamond coated wires |
| CN2010800420417A CN102648067A (zh) | 2009-09-17 | 2010-09-17 | 使用金刚石涂覆的线材将块状体切割成晶片 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0916339A GB2473628A (en) | 2009-09-17 | 2009-09-17 | Process for cutting a multiplicity of wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0916339D0 GB0916339D0 (en) | 2009-10-28 |
| GB2473628A true GB2473628A (en) | 2011-03-23 |
Family
ID=41277882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0916339A Withdrawn GB2473628A (en) | 2009-09-17 | 2009-09-17 | Process for cutting a multiplicity of wafers |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2013505576A (zh) |
| CN (1) | CN102648067A (zh) |
| GB (1) | GB2473628A (zh) |
| TW (1) | TW201131628A (zh) |
| WO (1) | WO2011034439A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2497120A (en) | 2011-12-01 | 2013-06-05 | Rec Wafer Norway As | Production of mono-crystalline silicon |
| GB2502102A (en) * | 2012-05-16 | 2013-11-20 | Rec Wafer Norway As | Improved production of monocrystalline silicon |
| CN102950659A (zh) * | 2012-10-18 | 2013-03-06 | 江西赛维Ldk太阳能高科技有限公司 | 一种硅块切割装置 |
| CN104385470B (zh) * | 2014-11-18 | 2016-07-06 | 泉州市永茂电子科技有限公司 | 一种晶棒切片系统 |
| TWI632041B (zh) * | 2017-09-11 | 2018-08-11 | 環球晶圓股份有限公司 | 晶棒切割方法及切削磨料套組 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB717874A (en) * | 1952-05-22 | 1954-11-03 | British Thomson Houston Co Ltd | Improvements in and relating to methods of and apparatus for cutting crystal |
| WO2009056153A1 (en) * | 2007-10-30 | 2009-05-07 | Pall Corporation | Method and system for manufacturing wafer-like slices from a substrate material |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054422A (en) | 1999-02-19 | 2000-04-25 | Ppt Research, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
| US6602834B1 (en) * | 2000-08-10 | 2003-08-05 | Ppt Resaerch, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
| US6837778B2 (en) * | 2000-11-24 | 2005-01-04 | Neomax Co., Ltd | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| WO2003042340A1 (en) * | 2001-11-14 | 2003-05-22 | Ppt Research, Inc. | A cutting and lubricating composition for use with a wire cutting apparatus |
| GB2414204B (en) * | 2004-05-18 | 2006-04-12 | David Ainsworth Hukin | Abrasive wire sawing |
| MY149008A (en) | 2006-08-30 | 2013-06-28 | Saint Gobain Ceramics | Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof |
| US8157876B2 (en) | 2007-07-31 | 2012-04-17 | Cabot Microelectronics Corporation | Slurry composition containing non-ionic polymer and method for use |
| US20090032006A1 (en) | 2007-07-31 | 2009-02-05 | Chul Woo Nam | Wire saw process |
-
2009
- 2009-09-17 GB GB0916339A patent/GB2473628A/en not_active Withdrawn
-
2010
- 2010-09-17 CN CN2010800420417A patent/CN102648067A/zh active Pending
- 2010-09-17 JP JP2012529704A patent/JP2013505576A/ja active Pending
- 2010-09-17 WO PCT/NO2010/000339 patent/WO2011034439A1/en active Application Filing
- 2010-09-17 TW TW099131673A patent/TW201131628A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB717874A (en) * | 1952-05-22 | 1954-11-03 | British Thomson Houston Co Ltd | Improvements in and relating to methods of and apparatus for cutting crystal |
| WO2009056153A1 (en) * | 2007-10-30 | 2009-05-07 | Pall Corporation | Method and system for manufacturing wafer-like slices from a substrate material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102648067A (zh) | 2012-08-22 |
| TW201131628A (en) | 2011-09-16 |
| GB0916339D0 (en) | 2009-10-28 |
| WO2011034439A1 (en) | 2011-03-24 |
| JP2013505576A (ja) | 2013-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |