GB0916339D0 - Sawing of blocks into wafers using diamond coated wires - Google Patents

Sawing of blocks into wafers using diamond coated wires

Info

Publication number
GB0916339D0
GB0916339D0 GBGB0916339.5A GB0916339A GB0916339D0 GB 0916339 D0 GB0916339 D0 GB 0916339D0 GB 0916339 A GB0916339 A GB 0916339A GB 0916339 D0 GB0916339 D0 GB 0916339D0
Authority
GB
United Kingdom
Prior art keywords
sawing
wafers
blocks
coated wires
diamond coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0916339.5A
Other versions
GB2473628A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REC Wafer Norway AS
Original Assignee
REC Wafer Norway AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REC Wafer Norway AS filed Critical REC Wafer Norway AS
Priority to GB0916339A priority Critical patent/GB2473628A/en
Publication of GB0916339D0 publication Critical patent/GB0916339D0/en
Priority to JP2012529704A priority patent/JP2013505576A/en
Priority to TW099131673A priority patent/TW201131628A/en
Priority to CN2010800420417A priority patent/CN102648067A/en
Priority to PCT/NO2010/000339 priority patent/WO2011034439A1/en
Publication of GB2473628A publication Critical patent/GB2473628A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/005—Cutting sheet laminae in planes between faces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
GB0916339A 2009-09-17 2009-09-17 Process for cutting a multiplicity of wafers Withdrawn GB2473628A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB0916339A GB2473628A (en) 2009-09-17 2009-09-17 Process for cutting a multiplicity of wafers
JP2012529704A JP2013505576A (en) 2009-09-17 2010-09-17 Cutting blocks into wafers using diamond-coated wires
TW099131673A TW201131628A (en) 2009-09-17 2010-09-17 Sawing of blocks into wafers using diamond coated wires
CN2010800420417A CN102648067A (en) 2009-09-17 2010-09-17 Sawing of blocks into wafers using diamond coated wires
PCT/NO2010/000339 WO2011034439A1 (en) 2009-09-17 2010-09-17 Sawing of blocks into wafers using diamond coated wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0916339A GB2473628A (en) 2009-09-17 2009-09-17 Process for cutting a multiplicity of wafers

Publications (2)

Publication Number Publication Date
GB0916339D0 true GB0916339D0 (en) 2009-10-28
GB2473628A GB2473628A (en) 2011-03-23

Family

ID=41277882

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0916339A Withdrawn GB2473628A (en) 2009-09-17 2009-09-17 Process for cutting a multiplicity of wafers

Country Status (5)

Country Link
JP (1) JP2013505576A (en)
CN (1) CN102648067A (en)
GB (1) GB2473628A (en)
TW (1) TW201131628A (en)
WO (1) WO2011034439A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2497120A (en) 2011-12-01 2013-06-05 Rec Wafer Norway As Production of mono-crystalline silicon
GB2502102A (en) * 2012-05-16 2013-11-20 Rec Wafer Norway As Improved production of monocrystalline silicon
CN102950659A (en) * 2012-10-18 2013-03-06 江西赛维Ldk太阳能高科技有限公司 Silicon block cutting device
CN104385470B (en) * 2014-11-18 2016-07-06 泉州市永茂电子科技有限公司 A kind of crystal bar slice systems
TWI632041B (en) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 Ingot slicing method and slicing abrasive kit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB717874A (en) * 1952-05-22 1954-11-03 British Thomson Houston Co Ltd Improvements in and relating to methods of and apparatus for cutting crystal
US6054422A (en) * 1999-02-19 2000-04-25 Ppt Research, Inc. Cutting and lubricating composition for use with a wire cutting apparatus
US6602834B1 (en) * 2000-08-10 2003-08-05 Ppt Resaerch, Inc. Cutting and lubricating composition for use with a wire cutting apparatus
CN1228162C (en) * 2000-11-24 2005-11-23 株式会社新王磁材 Method for cutting off rare-earth alloy, process for preparing rare-earth magnet and fret saw
WO2003042340A1 (en) 2001-11-14 2003-05-22 Ppt Research, Inc. A cutting and lubricating composition for use with a wire cutting apparatus
GB2414204B (en) 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
KR101110593B1 (en) 2006-08-30 2012-02-15 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof
US8157876B2 (en) 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
US20090032006A1 (en) 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
WO2009056153A1 (en) * 2007-10-30 2009-05-07 Pall Corporation Method and system for manufacturing wafer-like slices from a substrate material

Also Published As

Publication number Publication date
GB2473628A (en) 2011-03-23
CN102648067A (en) 2012-08-22
TW201131628A (en) 2011-09-16
WO2011034439A1 (en) 2011-03-24
JP2013505576A (en) 2013-02-14

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)