GB0922708D0 - Sawing blocks into wafers using initially bowed wires - Google Patents

Sawing blocks into wafers using initially bowed wires

Info

Publication number
GB0922708D0
GB0922708D0 GBGB0922708.3A GB0922708A GB0922708D0 GB 0922708 D0 GB0922708 D0 GB 0922708D0 GB 0922708 A GB0922708 A GB 0922708A GB 0922708 D0 GB0922708 D0 GB 0922708D0
Authority
GB
United Kingdom
Prior art keywords
wafers
sawing blocks
initially bowed
bowed wires
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0922708.3A
Other versions
GB2476658A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REC Wafer Norway AS
Original Assignee
REC Wafer Norway AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REC Wafer Norway AS filed Critical REC Wafer Norway AS
Priority to GB0922708A priority Critical patent/GB2476658A/en
Publication of GB0922708D0 publication Critical patent/GB0922708D0/en
Priority to PCT/NO2010/000490 priority patent/WO2011081532A1/en
Priority to TW099146973A priority patent/TW201134634A/en
Publication of GB2476658A publication Critical patent/GB2476658A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB0922708A 2009-12-30 2009-12-30 Process for cutting a block using a planar array of wires Withdrawn GB2476658A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0922708A GB2476658A (en) 2009-12-30 2009-12-30 Process for cutting a block using a planar array of wires
PCT/NO2010/000490 WO2011081532A1 (en) 2009-12-30 2010-12-29 Sawing blocks into wafers using initially bowed wires
TW099146973A TW201134634A (en) 2009-12-30 2010-12-30 Sawing blocks into wafers using initially bowed wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0922708A GB2476658A (en) 2009-12-30 2009-12-30 Process for cutting a block using a planar array of wires

Publications (2)

Publication Number Publication Date
GB0922708D0 true GB0922708D0 (en) 2010-02-17
GB2476658A GB2476658A (en) 2011-07-06

Family

ID=41795897

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0922708A Withdrawn GB2476658A (en) 2009-12-30 2009-12-30 Process for cutting a block using a planar array of wires

Country Status (3)

Country Link
GB (1) GB2476658A (en)
TW (1) TW201134634A (en)
WO (1) WO2011081532A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013219468B4 (en) * 2013-09-26 2015-04-23 Siltronic Ag A method of simultaneously separating a plurality of slices from a workpiece
DE102014208187B4 (en) 2014-04-30 2023-07-06 Siltronic Ag Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574769A (en) * 1984-02-18 1986-03-11 Ishikawa Ken Ichi Multi-wire vibratory cutting method and apparatus
TW330884B (en) * 1996-03-26 1998-05-01 Shinetsu Handotai Co Ltd Wire saw and method of slicing a cylindrical workpiece
DE19841492A1 (en) * 1998-09-10 2000-03-23 Wacker Siltronic Halbleitermat Method and device for separating a large number of disks from a brittle hard workpiece
GB2414204B (en) 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
DE102006060358A1 (en) * 2006-12-20 2008-06-26 Siltronic Ag Apparatus and method for sawing a workpiece
GB2468874A (en) * 2009-03-24 2010-09-29 Rec Wafer Norway As Apparatus for cutting wafers using wires and abrasive slurry

Also Published As

Publication number Publication date
TW201134634A (en) 2011-10-16
GB2476658A (en) 2011-07-06
WO2011081532A1 (en) 2011-07-07

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)