GB0905059D0 - Wire sawing to form thin wafers - Google Patents

Wire sawing to form thin wafers

Info

Publication number
GB0905059D0
GB0905059D0 GBGB0905059.2A GB0905059A GB0905059D0 GB 0905059 D0 GB0905059 D0 GB 0905059D0 GB 0905059 A GB0905059 A GB 0905059A GB 0905059 D0 GB0905059 D0 GB 0905059D0
Authority
GB
United Kingdom
Prior art keywords
form thin
thin wafers
wire sawing
sawing
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0905059.2A
Other versions
GB2468874A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renewable Energy Corp ASA
Original Assignee
Renewable Energy Corp ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renewable Energy Corp ASA filed Critical Renewable Energy Corp ASA
Priority to GB0905059A priority Critical patent/GB2468874A/en
Publication of GB0905059D0 publication Critical patent/GB0905059D0/en
Priority to TW099108782A priority patent/TW201107101A/en
Priority to PCT/NO2010/000111 priority patent/WO2010110673A1/en
Publication of GB2468874A publication Critical patent/GB2468874A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/005—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for preventing collision of saw blades with other machine parts or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB0905059A 2009-03-24 2009-03-24 Apparatus for cutting wafers using wires and abrasive slurry Withdrawn GB2468874A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0905059A GB2468874A (en) 2009-03-24 2009-03-24 Apparatus for cutting wafers using wires and abrasive slurry
TW099108782A TW201107101A (en) 2009-03-24 2010-03-24 Wire sawing to form thin wafers
PCT/NO2010/000111 WO2010110673A1 (en) 2009-03-24 2010-03-24 Wire sawing to form thin wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0905059A GB2468874A (en) 2009-03-24 2009-03-24 Apparatus for cutting wafers using wires and abrasive slurry

Publications (2)

Publication Number Publication Date
GB0905059D0 true GB0905059D0 (en) 2009-05-06
GB2468874A GB2468874A (en) 2010-09-29

Family

ID=40640080

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0905059A Withdrawn GB2468874A (en) 2009-03-24 2009-03-24 Apparatus for cutting wafers using wires and abrasive slurry

Country Status (3)

Country Link
GB (1) GB2468874A (en)
TW (1) TW201107101A (en)
WO (1) WO2010110673A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2476658A (en) * 2009-12-30 2011-07-06 Rec Wafer Norway As Process for cutting a block using a planar array of wires
CN104215537B (en) * 2013-05-30 2016-12-07 正达国际光电股份有限公司 Diamond wire testing method
TWI497067B (en) * 2013-05-30 2015-08-21 G Tech Optoelectronics Corp Method for testing diamond cutting line
TWI641461B (en) * 2016-09-13 2018-11-21 友達晶材股份有限公司 Ultrasonic auxiliary wire cutting cutting method and device thereof, and wafer manufacturing method
CN111878492A (en) * 2020-09-24 2020-11-03 钱佳钰 Pipeline adhesive fixing device and using method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2656719B2 (en) * 1993-11-24 1997-09-24 株式会社安永 Device for preventing foreign matter from being caught in rollers in wire saws
JPH07308919A (en) * 1994-05-16 1995-11-28 Tokyo Seimitsu Co Ltd Wire washing equipment for wire saw
WO2001091981A1 (en) * 2000-05-31 2001-12-06 Memc Electronic Materials, S.P.A. Wire saw and process for slicing multiple semiconductor ingots
US20030047177A1 (en) * 2001-09-11 2003-03-13 Michael Christ Method for cutting ingots for use with a wire cutting apparatus
EP2343155B1 (en) * 2003-10-27 2014-08-20 Mitsubishi Denki Kabushiki Kaisha Multi-wire saw
JP2005153035A (en) * 2003-11-20 2005-06-16 Kyocera Corp Wire saw device
GB2414204B (en) 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
KR100667690B1 (en) * 2004-11-23 2007-01-12 주식회사 실트론 Method and machine for slicing wafers
DE102005026546A1 (en) * 2005-05-31 2006-12-07 Technische Universität Dresden Wire separation lapping method involves detecting operating parameters of feed rate, pendulum angle, wire tension and deflection angle and regulating one parameter during separation process, such that contact length of wire is kept constant
JP2007173721A (en) * 2005-12-26 2007-07-05 Sharp Corp Slicing method for silicon ingot
WO2009153877A1 (en) * 2008-06-19 2009-12-23 信濃電気製錬株式会社 Fret bar for ingot slicing, ingot to which fret bar is stuck, and ingot cutting method using fret bar

Also Published As

Publication number Publication date
WO2010110673A1 (en) 2010-09-30
GB2468874A (en) 2010-09-29
TW201107101A (en) 2011-03-01

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)