GB0922741D0 - Method for cutting a block of silicon into wafers - Google Patents

Method for cutting a block of silicon into wafers

Info

Publication number
GB0922741D0
GB0922741D0 GBGB0922741.4A GB0922741A GB0922741D0 GB 0922741 D0 GB0922741 D0 GB 0922741D0 GB 0922741 A GB0922741 A GB 0922741A GB 0922741 D0 GB0922741 D0 GB 0922741D0
Authority
GB
United Kingdom
Prior art keywords
wafers
silicon
cutting
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0922741.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REC Wafer Norway AS
Original Assignee
REC Wafer Norway AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REC Wafer Norway AS filed Critical REC Wafer Norway AS
Priority to GBGB0922741.4A priority Critical patent/GB0922741D0/en
Publication of GB0922741D0 publication Critical patent/GB0922741D0/en
Priority to PCT/NO2010/000491 priority patent/WO2011081533A1/en
Priority to TW099147399A priority patent/TW201125705A/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GBGB0922741.4A 2009-12-31 2009-12-31 Method for cutting a block of silicon into wafers Ceased GB0922741D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0922741.4A GB0922741D0 (en) 2009-12-31 2009-12-31 Method for cutting a block of silicon into wafers
PCT/NO2010/000491 WO2011081533A1 (en) 2009-12-31 2010-12-30 Method for cutting a block of silicon into wafers
TW099147399A TW201125705A (en) 2009-12-31 2010-12-31 Method for cutting a block of silicon into wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0922741.4A GB0922741D0 (en) 2009-12-31 2009-12-31 Method for cutting a block of silicon into wafers

Publications (1)

Publication Number Publication Date
GB0922741D0 true GB0922741D0 (en) 2010-02-17

Family

ID=41795925

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0922741.4A Ceased GB0922741D0 (en) 2009-12-31 2009-12-31 Method for cutting a block of silicon into wafers

Country Status (3)

Country Link
GB (1) GB0922741D0 (en)
TW (1) TW201125705A (en)
WO (1) WO2011081533A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102350741A (en) * 2011-09-22 2012-02-15 英利能源（中国）有限公司 Silicon block cutting method
EP2767375A1 (en) * 2013-02-13 2014-08-20 Applied Materials Switzerland Sàrl Wire guide and a method for forming a wire guide
CN104441281B (en) * 2014-10-31 2016-08-31 内蒙古中环光伏材料有限公司 A kind of cutting method of ultra thin silicon wafers

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001091981A1 (en) * 2000-05-31 2001-12-06 Memc Electronic Materials, S.P.A. Wire saw and process for slicing multiple semiconductor ingots
US20030047177A1 (en) * 2001-09-11 2003-03-13 Michael Christ Method for cutting ingots for use with a wire cutting apparatus
GB2414204B (en) 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
DE102006058819B4 (en) * 2006-12-13 2010-01-28 Siltronic Ag A method of separating a plurality of slices from a workpiece

Also Published As

Publication number Publication date
WO2011081533A1 (en) 2011-07-07
TW201125705A (en) 2011-08-01

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)