GB0922741D0 - Method for cutting a block of silicon into wafers - Google Patents
Method for cutting a block of silicon into wafersInfo
- Publication number
- GB0922741D0 GB0922741D0 GBGB0922741.4A GB0922741A GB0922741D0 GB 0922741 D0 GB0922741 D0 GB 0922741D0 GB 0922741 A GB0922741 A GB 0922741A GB 0922741 D0 GB0922741 D0 GB 0922741D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafers
- silicon
- cutting
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0922741.4A GB0922741D0 (en) | 2009-12-31 | 2009-12-31 | Method for cutting a block of silicon into wafers |
PCT/NO2010/000491 WO2011081533A1 (en) | 2009-12-31 | 2010-12-30 | Method for cutting a block of silicon into wafers |
TW099147399A TW201125705A (en) | 2009-12-31 | 2010-12-31 | Method for cutting a block of silicon into wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0922741.4A GB0922741D0 (en) | 2009-12-31 | 2009-12-31 | Method for cutting a block of silicon into wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0922741D0 true GB0922741D0 (en) | 2010-02-17 |
Family
ID=41795925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0922741.4A Ceased GB0922741D0 (en) | 2009-12-31 | 2009-12-31 | Method for cutting a block of silicon into wafers |
Country Status (3)
Country | Link |
---|---|
GB (1) | GB0922741D0 (en) |
TW (1) | TW201125705A (en) |
WO (1) | WO2011081533A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102350741A (en) * | 2011-09-22 | 2012-02-15 | 英利能源(中国)有限公司 | Silicon block cutting method |
EP2767375A1 (en) * | 2013-02-13 | 2014-08-20 | Applied Materials Switzerland Sàrl | Wire guide and a method for forming a wire guide |
CN104441281B (en) * | 2014-10-31 | 2016-08-31 | 内蒙古中环光伏材料有限公司 | A kind of cutting method of ultra thin silicon wafers |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2000251024A1 (en) * | 2000-05-31 | 2001-12-11 | Memc Electronic Materials S.P.A. | Wire saw and process for slicing multiple semiconductor ingots |
US20030047177A1 (en) * | 2001-09-11 | 2003-03-13 | Michael Christ | Method for cutting ingots for use with a wire cutting apparatus |
GB2414204B (en) | 2004-05-18 | 2006-04-12 | David Ainsworth Hukin | Abrasive wire sawing |
DE102006058819B4 (en) * | 2006-12-13 | 2010-01-28 | Siltronic Ag | A method of separating a plurality of slices from a workpiece |
-
2009
- 2009-12-31 GB GBGB0922741.4A patent/GB0922741D0/en not_active Ceased
-
2010
- 2010-12-30 WO PCT/NO2010/000491 patent/WO2011081533A1/en active Application Filing
- 2010-12-31 TW TW099147399A patent/TW201125705A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2011081533A1 (en) | 2011-07-07 |
TW201125705A (en) | 2011-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |