GB2444037A - Laser Machining - Google Patents

Laser Machining Download PDF

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Publication number
GB2444037A
GB2444037A GB0623642A GB0623642A GB2444037A GB 2444037 A GB2444037 A GB 2444037A GB 0623642 A GB0623642 A GB 0623642A GB 0623642 A GB0623642 A GB 0623642A GB 2444037 A GB2444037 A GB 2444037A
Authority
GB
United Kingdom
Prior art keywords
laser
machining
substrate
pulses
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0623642A
Other languages
English (en)
Other versions
GB0623642D0 (en
Inventor
Kali Dunne
Cillian O'briain Fallon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xsil Technology Ltd
Original Assignee
Xsil Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xsil Technology Ltd filed Critical Xsil Technology Ltd
Priority to GB0623642A priority Critical patent/GB2444037A/en
Publication of GB0623642D0 publication Critical patent/GB0623642D0/en
Priority to JP2009537562A priority patent/JP2010510885A/ja
Priority to EP07846853.5A priority patent/EP2097209B1/de
Priority to CN200780049577.XA priority patent/CN101657292B/zh
Priority to PCT/EP2007/010291 priority patent/WO2008064863A1/en
Priority to US12/515,926 priority patent/US7947575B2/en
Priority to KR1020097012900A priority patent/KR101260752B1/ko
Priority to TW096145175A priority patent/TWI448345B/zh
Publication of GB2444037A publication Critical patent/GB2444037A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
GB0623642A 2006-11-27 2006-11-27 Laser Machining Withdrawn GB2444037A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB0623642A GB2444037A (en) 2006-11-27 2006-11-27 Laser Machining
JP2009537562A JP2010510885A (ja) 2006-11-27 2007-11-27 レーザ加工
EP07846853.5A EP2097209B1 (de) 2006-11-27 2007-11-27 Laserbearbeitung
CN200780049577.XA CN101657292B (zh) 2006-11-27 2007-11-27 激光加工
PCT/EP2007/010291 WO2008064863A1 (en) 2006-11-27 2007-11-27 Laser machining
US12/515,926 US7947575B2 (en) 2006-11-27 2007-11-27 Laser machining
KR1020097012900A KR101260752B1 (ko) 2006-11-27 2007-11-27 레이저 가공 방법
TW096145175A TWI448345B (zh) 2006-11-27 2007-11-28 雷射加工技術

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0623642A GB2444037A (en) 2006-11-27 2006-11-27 Laser Machining

Publications (2)

Publication Number Publication Date
GB0623642D0 GB0623642D0 (en) 2007-01-03
GB2444037A true GB2444037A (en) 2008-05-28

Family

ID=37636595

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0623642A Withdrawn GB2444037A (en) 2006-11-27 2006-11-27 Laser Machining

Country Status (8)

Country Link
US (1) US7947575B2 (de)
EP (1) EP2097209B1 (de)
JP (1) JP2010510885A (de)
KR (1) KR101260752B1 (de)
CN (1) CN101657292B (de)
GB (1) GB2444037A (de)
TW (1) TWI448345B (de)
WO (1) WO2008064863A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
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DE102009044316A1 (de) * 2009-10-22 2011-05-05 Ewag Ag Laserbearbeitungsvorrichtung und Verfahren zur Herstellung einer Fläche an einem Rohling

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GB2444037A (en) * 2006-11-27 2008-05-28 Xsil Technology Ltd Laser Machining
US8536054B2 (en) * 2008-01-18 2013-09-17 Miasole Laser polishing of a solar cell substrate
US8546172B2 (en) 2008-01-18 2013-10-01 Miasole Laser polishing of a back contact of a solar cell
US8586398B2 (en) * 2008-01-18 2013-11-19 Miasole Sodium-incorporation in solar cell substrates and contacts
US20100252959A1 (en) * 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
US8319146B2 (en) * 2009-05-05 2012-11-27 General Electric Company Method and apparatus for laser cutting a trench
TWI523720B (zh) 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP5620669B2 (ja) * 2009-10-26 2014-11-05 東芝機械株式会社 レーザダイシング方法およびレーザダイシング装置
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
DK2584066T3 (da) * 2009-12-17 2014-07-14 Byd Co Ltd Overflademetalliseringsmetode, metode til fremstilling af plastgenstande og plastgenstand fremstillet heraf
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
CN102071424B (zh) 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US7977213B1 (en) * 2010-03-31 2011-07-12 Electro Scientific Industries, Inc. Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
TW201134596A (en) * 2010-04-15 2011-10-16 Epileds Technologies Inc Laser processing method
US8804102B2 (en) * 2010-05-19 2014-08-12 Materials Solutions Laser scan speed calibration
JP2012000640A (ja) * 2010-06-17 2012-01-05 Omron Corp レーザ加工装置およびレーザ加工方法
JP5981094B2 (ja) 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
WO2012054927A2 (en) * 2010-10-22 2012-04-26 Electro Scientific Industries, Inc. Laser processing systems and methods for beam dithering and skiving
CN102637639A (zh) * 2011-02-12 2012-08-15 安徽三安光电有限公司 一种劈裂半导体芯片或其封装基板的方法
JP5140198B1 (ja) 2011-07-27 2013-02-06 東芝機械株式会社 レーザダイシング方法
CN102489884A (zh) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 一种激光切割圆孔或椭圆孔的方法
CN103212859A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种激光切割厚材料的方法
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP2014011358A (ja) 2012-06-29 2014-01-20 Toshiba Mach Co Ltd レーザダイシング方法
KR101213958B1 (ko) * 2012-10-12 2012-12-20 주식회사 엘티에스 레이저를 이용한 내장형 안테나 제조방법
US20140175067A1 (en) * 2012-12-20 2014-06-26 Electro Scientific Industries, Inc. Methods of forming images by laser micromachining
EP3336195B1 (de) 2012-12-20 2020-02-26 3M Innovative Properties Company Verfahren zur differenzierung von mikrobenkolonien auf einem bild
US20140268134A1 (en) * 2013-03-15 2014-09-18 Electro Scientific Industries, Inc. Laser sampling methods for reducing thermal effects
KR101999336B1 (ko) * 2013-04-09 2019-07-11 엘지디스플레이 주식회사 액정표시장치 및 그 제조 방법
US10851884B2 (en) 2014-03-14 2020-12-01 ZPE Licensing Inc. Super charger components
US11041558B2 (en) 2014-03-14 2021-06-22 ZPE Licensing Inc. Super charger components
DE102014210611A1 (de) * 2014-06-04 2015-12-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Markieren eines DataMatrix-Codes auf einem Werkstück mittels eines Laserstrahls
CN107850554B (zh) 2015-08-26 2021-09-07 伊雷克托科学工业股份有限公司 相对于气流的镭射扫描定序及方向
US10794663B2 (en) * 2017-05-11 2020-10-06 ZPE Licensing Inc. Laser induced friction surface on firearm
US10640837B2 (en) * 2017-09-27 2020-05-05 Faurecia Interior Systems, Inc. Vehicle interior panel with laser-formed tear seam
CN109048047B (zh) * 2018-07-09 2020-09-25 江苏峰钛激光科技有限公司 一种硬脆材料的激光打标方法
DE102018120763A1 (de) * 2018-08-24 2020-02-27 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung wenigstens eines Schlitzes in ein flächenhaftes Werkstück mittels Laserstrahl
CN109262147A (zh) * 2018-09-29 2019-01-25 北京工业大学 一种陶瓷增强金属基复合材料脉冲激光刻蚀加工方法
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
CN110681988A (zh) * 2019-09-17 2020-01-14 北京兆维电子(集团)有限责任公司 一种激光加工方法及系统
CN111992545B (zh) * 2020-08-28 2023-09-08 格力电器（武汉）有限公司 一种热水器内胆下环缝氧化皮清洗装置及清洗方法
KR102311246B1 (ko) * 2021-01-28 2021-10-14 이노덴 주식회사 유동형 어버트먼트 및 이를 구비한 임플란트
CN118559190A (zh) * 2024-07-31 2024-08-30 北京镭科光电科技有限公司 一种提升分布密度的焦点平移方法及相应的激光加工装置

Citations (2)

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US20020088780A1 (en) * 2000-10-26 2002-07-11 Adrian Boyle Control of laser machining
WO2003090258A2 (en) * 2002-04-19 2003-10-30 Xsil Technology Limited Laser machining

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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20020088780A1 (en) * 2000-10-26 2002-07-11 Adrian Boyle Control of laser machining
WO2003090258A2 (en) * 2002-04-19 2003-10-30 Xsil Technology Limited Laser machining

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009044316A1 (de) * 2009-10-22 2011-05-05 Ewag Ag Laserbearbeitungsvorrichtung und Verfahren zur Herstellung einer Fläche an einem Rohling
US8969758B2 (en) 2009-10-22 2015-03-03 Ewag Ag Laser machining apparatus and method for forming a surface on an unfinished product
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
EP2097209A1 (de) 2009-09-09
WO2008064863A1 (en) 2008-06-05
CN101657292B (zh) 2016-03-16
EP2097209B1 (de) 2014-04-09
TW200922727A (en) 2009-06-01
TWI448345B (zh) 2014-08-11
US20100099239A1 (en) 2010-04-22
CN101657292A (zh) 2010-02-24
US7947575B2 (en) 2011-05-24
GB0623642D0 (en) 2007-01-03
KR101260752B1 (ko) 2013-05-06
KR20090104003A (ko) 2009-10-05
JP2010510885A (ja) 2010-04-08

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20090514 AND 20090520

WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)