GB2419644A - System and method for thermal management using distributed synthetic jet actuators - Google Patents

System and method for thermal management using distributed synthetic jet actuators Download PDF

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Publication number
GB2419644A
GB2419644A GB0600751A GB0600751A GB2419644A GB 2419644 A GB2419644 A GB 2419644A GB 0600751 A GB0600751 A GB 0600751A GB 0600751 A GB0600751 A GB 0600751A GB 2419644 A GB2419644 A GB 2419644A
Authority
GB
United Kingdom
Prior art keywords
synthetic jet
thermal management
jet actuator
housing
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0600751A
Other versions
GB0600751D0 (en
GB2419644B (en
Inventor
Ari Gleezer
Raghavendran Mahalingam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Georgia Tech Research Institute
Georgia Tech Research Corp
Original Assignee
Georgia Tech Research Institute
Georgia Tech Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Research Institute, Georgia Tech Research Corp filed Critical Georgia Tech Research Institute
Publication of GB0600751D0 publication Critical patent/GB0600751D0/en
Publication of GB2419644A publication Critical patent/GB2419644A/en
Application granted granted Critical
Publication of GB2419644B publication Critical patent/GB2419644B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
    • F04B45/047—Pumps having electric drive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Reciprocating Pumps (AREA)
  • Spray Control Apparatus (AREA)
  • Jet Pumps And Other Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60), though not required, typically comprises a housing (47) defining an internal chamber (45) and having an orifice (46) in a wall (44) of the housing (47). The synthetic jet actuator (60) typically also comprises a flexible diaphragm (42) forming a portion of the housing (47). The tube (61) of this exemplary embodiment typically comprises a proximal end (64) and a distal end (65), the proximal end (64) being positioned adjacent to the synthetic jet actuator (60). In this embodiment, operation of the synthetic jet actuator (60) causes a synthetic jet stream (52) to form at the distal end (65) of the tube (61).

Description

GB 2419644 A continuation (72) Inventor(s): An Gleezer Raghavendran
Mahalingam (74) Agent and/or Address for Service: Bow les Horton Felden House, Dower Mews, High Street, BERKHAMSTED, Herts, HP4 2BL, United Kingdom
GB0600751A 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators Expired - Fee Related GB2419644B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48517703P 2003-07-07 2003-07-07
US53278503P 2003-12-23 2003-12-23
PCT/US2004/021706 WO2005008348A2 (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators

Publications (3)

Publication Number Publication Date
GB0600751D0 GB0600751D0 (en) 2006-02-22
GB2419644A true GB2419644A (en) 2006-05-03
GB2419644B GB2419644B (en) 2008-04-09

Family

ID=34083331

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0600751A Expired - Fee Related GB2419644B (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators

Country Status (4)

Country Link
JP (2) JP2007527618A (en)
AU (1) AU2004258530A1 (en)
GB (1) GB2419644B (en)
WO (1) WO2005008348A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9452463B2 (en) 2010-02-13 2016-09-27 Nuventix, Inc. Synthetic jet ejector and design thereof to facilitate mass production

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677744B2 (en) 2003-11-04 2011-04-27 ソニー株式会社 Jet generating device, electronic device and jet generating method
JP4572548B2 (en) 2004-03-18 2010-11-04 ソニー株式会社 Gas ejection device
JP4747657B2 (en) 2005-04-21 2011-08-17 ソニー株式会社 Jet generator and electronic device
JP4887652B2 (en) 2005-04-21 2012-02-29 ソニー株式会社 Jet generator and electronic device
JP2006310586A (en) 2005-04-28 2006-11-09 Sony Corp Air current generator and electronic apparatus
US7932535B2 (en) * 2005-11-02 2011-04-26 Nuventix, Inc. Synthetic jet cooling system for LED module
CN101427617A (en) * 2006-02-23 2009-05-06 纽文迪斯公司 Electronics package for synthetic jet ejectors
CN101405508B (en) * 2006-03-21 2013-03-27 皇家飞利浦电子股份有限公司 Cooling device and electronic device comprising such a cooling device
US20100012301A1 (en) * 2006-12-15 2010-01-21 Koninklijke Philips Electronics N.V. Pulsating fluid cooling with frequency control
EP1975505A1 (en) 2007-03-26 2008-10-01 Koninklijke Philips Electronics N.V. Lighting device
CN101889145B (en) 2007-12-07 2013-07-24 皇家飞利浦电子股份有限公司 Low noise cooling device
US9726201B2 (en) * 2007-12-07 2017-08-08 Philips Lighting Holding B.V. Cooling device utilizing internal synthetic jets
EP2119581B1 (en) * 2008-05-06 2010-09-01 C.R.F. Società Consortile per Azioni Air diffusing or distributing device with synthetic jets
EP2312158B1 (en) 2008-06-05 2016-04-27 Murata Manufacturing Co. Ltd. Piezoelectric microblower
US8529105B2 (en) * 2008-07-10 2013-09-10 Koninklijke Philips N.V. Remote cooling by combining heat pipe and resonator for synthetic jet cooling
WO2010029485A1 (en) 2008-09-12 2010-03-18 Koninklijke Philips Electronics N.V. A device provided with a gap-like space and a synthetic jet generator coupled thereto
CH703357A1 (en) * 2010-06-25 2011-12-30 Alstom Technology Ltd HEAT-LOADED, COOLED COMPONENT.
US20120170216A1 (en) * 2011-01-04 2012-07-05 General Electric Company Synthetic jet packaging

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938742A (en) * 1988-02-04 1990-07-03 Smits Johannes G Piezoelectric micropump with microvalves
US5224843A (en) * 1989-06-14 1993-07-06 Westonbridge International Ltd. Two valve micropump with improved outlet
JPH06147104A (en) * 1992-10-30 1994-05-27 Hitachi Ltd Piezoelectric multi-channel pump and drive control method
US5876187A (en) * 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6186748B1 (en) * 1998-07-21 2001-02-13 Kawasaki Jukogyo Kabushiki Kaisha Axial piston pump
US6280148B1 (en) * 1997-02-19 2001-08-28 Hahn-Schickard-Gesellschaft Fur Angewandte Forschung Microdosing device and method for operating same
US20020098097A1 (en) * 2001-01-22 2002-07-25 Angad Singh Magnetically-actuated micropump
US6481984B1 (en) * 1999-10-27 2002-11-19 Seiko Instruments Inc. Pump and method of driving the same
US20030151895A1 (en) * 2002-02-11 2003-08-14 Jon Zuo Heat spreader with oscillating flow
US6869275B2 (en) * 2002-02-14 2005-03-22 Philip Morris Usa Inc. Piezoelectrically driven fluids pump and piezoelectric fluid valve

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55101800A (en) * 1979-01-25 1980-08-04 Pioneer Electronic Corp Air pump
JPS63234594A (en) * 1987-03-23 1988-09-29 古野電気株式会社 Fluid circulator
JPH03116961A (en) * 1989-09-29 1991-05-17 Victor Co Of Japan Ltd Heat dissipating device
US6457654B1 (en) * 1995-06-12 2002-10-01 Georgia Tech Research Corporation Micromachined synthetic jet actuators and applications thereof
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
JPH11145659A (en) * 1997-11-10 1999-05-28 Sony Corp Air cooling apparatus
JPH11145661A (en) * 1997-11-10 1999-05-28 Sony Corp Air cooler
SE514735C2 (en) * 1998-12-11 2001-04-09 Ericsson Telefon Ab L M Device for increasing heat output
JP2002134975A (en) * 2000-10-23 2002-05-10 Nippon Keiki Works Ltd Cooling fan

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938742A (en) * 1988-02-04 1990-07-03 Smits Johannes G Piezoelectric micropump with microvalves
US5224843A (en) * 1989-06-14 1993-07-06 Westonbridge International Ltd. Two valve micropump with improved outlet
JPH06147104A (en) * 1992-10-30 1994-05-27 Hitachi Ltd Piezoelectric multi-channel pump and drive control method
US5876187A (en) * 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
US6280148B1 (en) * 1997-02-19 2001-08-28 Hahn-Schickard-Gesellschaft Fur Angewandte Forschung Microdosing device and method for operating same
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6186748B1 (en) * 1998-07-21 2001-02-13 Kawasaki Jukogyo Kabushiki Kaisha Axial piston pump
US6481984B1 (en) * 1999-10-27 2002-11-19 Seiko Instruments Inc. Pump and method of driving the same
US20020098097A1 (en) * 2001-01-22 2002-07-25 Angad Singh Magnetically-actuated micropump
US20030151895A1 (en) * 2002-02-11 2003-08-14 Jon Zuo Heat spreader with oscillating flow
US6869275B2 (en) * 2002-02-14 2005-03-22 Philip Morris Usa Inc. Piezoelectrically driven fluids pump and piezoelectric fluid valve

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9452463B2 (en) 2010-02-13 2016-09-27 Nuventix, Inc. Synthetic jet ejector and design thereof to facilitate mass production

Also Published As

Publication number Publication date
WO2005008348A3 (en) 2005-07-14
JP2010101325A (en) 2010-05-06
JP2007527618A (en) 2007-09-27
GB0600751D0 (en) 2006-02-22
WO2005008348A2 (en) 2005-01-27
GB2419644B (en) 2008-04-09
AU2004258530A1 (en) 2005-01-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20150707