JPH11145659A - Air cooling apparatus - Google Patents
Air cooling apparatusInfo
- Publication number
- JPH11145659A JPH11145659A JP30670697A JP30670697A JPH11145659A JP H11145659 A JPH11145659 A JP H11145659A JP 30670697 A JP30670697 A JP 30670697A JP 30670697 A JP30670697 A JP 30670697A JP H11145659 A JPH11145659 A JP H11145659A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- air
- deformable member
- cooling device
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、冷却対象の装置に
装着され、装置内の空気の排出および装置内への空気の
吸引を行うことによって装置を冷却する空冷装置に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air cooling device which is mounted on a device to be cooled and which cools the device by discharging air from the device and sucking air into the device.
【０００２】[0002]
【従来の技術】例えば電子装置を空冷する場合、従来は
次の２つの方法のいずれかが採られていた。第１の方法
は自然放熱によるものである。すなわち、電子装置筐体
内の種々の発熱源から発生した熱は、発熱源周辺の筐体
内部の空気に伝導し、熱を吸収した空気は自然対流によ
って筐体に形成された通気口を通じて筐体外に出る。ま
た、発熱源からの熱は直接または何らかの部材を介して
筐体に伝導し、筐体の外面から外部に放熱される。この
ような自然放熱の結果、電子装置が冷却される。第２の
方法は強制空冷によるものである。すなわち、ファンを
例えば筐体に形成した通気口近傍に装着し、筐体内で熱
を吸収して高温となった空気を筐体外に強制的に排出す
ることで電子装置を冷却する。2. Description of the Related Art For example, when an electronic device is air-cooled, one of the following two methods has conventionally been adopted. The first method is by natural heat radiation. In other words, heat generated from various heat sources in the housing of the electronic device is conducted to the air inside the housing around the heat source, and the air that has absorbed the heat passes through the vent formed in the housing by natural convection. Go to Further, heat from the heat source is conducted to the housing directly or through some member, and is radiated to the outside from the outer surface of the housing. As a result of such natural heat dissipation, the electronic device is cooled. The second method is by forced air cooling. That is, the electronic device is cooled by mounting a fan, for example, in the vicinity of a vent formed in the housing, and forcibly discharging the high-temperature air that has absorbed heat in the housing to the outside of the housing.
【０００３】[0003]
【発明が解決しようとする課題】しかし、第１の方法で
は、構造によっては筐体内での自然対流が効果的に発生
せず、また、筐体内での発熱量に比べ筐体の表面積が狭
い場合は必要な冷却効果を確保することは困難である。
一方、第２の方法では、ファンを使用するため、電力を
必要とし、さらに騒音が発生するとうい問題があり、そ
してファンを配置するたのスペースを確保しなければな
らない。本発明はこのような問題を解決するためになさ
れたもので、その目的は、十分な冷却効果が得られ、低
消費電力で、かつ騒音が発生せず、しかも場所をとらな
い空冷装置を提供することにある。However, in the first method, natural convection in the housing is not effectively generated depending on the structure, and the surface area of the housing is smaller than the calorific value in the housing. In such a case, it is difficult to secure a necessary cooling effect.
On the other hand, in the second method, since a fan is used, electric power is required, there is a problem that noise is generated, and a space for disposing the fan must be secured. The present invention has been made to solve such a problem, and an object of the present invention is to provide an air-cooling device that can obtain a sufficient cooling effect, consumes low power, does not generate noise, and does not require much space. Is to do.
【０００４】[0004]
【課題を解決するための手段】本発明は上記目的を達成
するため、通気口を備えた冷却対象の装置に装着され、
前記装置内の空気の排出および装置内への空気の吸引を
行うことによって前記装置を冷却する空冷装置を次のよ
うに構成した。すなわち、本発明の空冷装置では、電気
エネルギを供給することで、湾曲して振動する板状の変
形部材を、冷却対象装置の筐体の内面に近接し板面を前
記内面に対して略平行にして変形可能な状態で配設し、
柔軟性を有するシート部材を前記変形部材にほぼ密着さ
せて前記シート部材により前記変形部材を覆い、前記シ
ート部材の周辺部全体を前記筐体の前記内面にほぼ隙間
なく固定し、前記シート部材により前記変形部材と共に
覆われた前記筐体の箇所に第１の開口を形成して、前記
第１の開口を通じて前記筐体内の空気が流出することを
阻止する一方前記筐体内に空気が流入することは可能と
する第１の弁を前記第１の開口の箇所に取り付け、前記
シート部材に第２の開口を形成して、前記第２の開口を
通じて前記変形部材側に空気が流入することを阻止する
一方前記変形部材側から空気が流出することは可能とす
る第２の弁を前記第２の開口の箇所に取り付けた。In order to achieve the above object, the present invention is mounted on a device to be cooled provided with a vent,
An air cooling device configured to cool the device by discharging air from the device and sucking air into the device was configured as follows. That is, in the air cooling device of the present invention, by supplying electric energy, the plate-shaped deformable member that bends and vibrates is brought close to the inner surface of the housing of the device to be cooled and the plate surface is substantially parallel to the inner surface. And placed in a deformable state,
A flexible sheet member is brought into close contact with the deformable member to cover the deformable member with the sheet member, and the entire peripheral portion of the sheet member is fixed to the inner surface of the housing with substantially no gap. Forming a first opening at a location of the housing covered with the deformable member to prevent air in the housing from flowing out through the first opening, while allowing air to flow into the housing; Attaches a first valve that is enabled to the first opening, forms a second opening in the seat member, and prevents air from flowing into the deformable member through the second opening. On the other hand, a second valve that allows air to flow out from the deformable member side was attached to the second opening.
【０００５】本発明の空冷装置においては、変形部材に
電気エネルギを供給することで変形部材を湾曲して振動
させることができ、この振動に伴って、変形部材を覆っ
ているシート部材は筐体の内側方向への膨出、および逆
方向への縮退を繰り返す。そして、シート部材が膨出し
たときは、第２の弁の作用によって空気が第２の開口を
通じ変形部材側に流入することはなく、そしてシート部
材の膨出分だけ筐体内の空間部分の容積が縮小し、筐体
内の高温の空気が通気口を通じて筐体の外に排出され
る。また、このとき、第１の弁の作用によって第１の開
口を通じ筐体外の低温の空気がシート部材と、シート部
材により覆われた筐体の内面との間の空間内に流入す
る。逆に、シート部材が上述のように縮退するときは、
第１の弁の作用によって空気は第１の開口を通じ筐体外
に流出できず、一方、第２の弁の作用によって空気は第
２の開口を通じ変形部材側から流出可能であるため、シ
ート部材と、シート部材により覆われた筐体の内面との
間の空間内の低温の空気は、筐体の空間部分に流入す
る。したがって、変形部材を上述のように振動させるこ
とで、筐体外の低温の空気が第１および第２の開口（第
１および第２の弁）を通じて筐体の空間部分に流入し、
一方、筐体内の高温の空気は冷却対象装置の通気口を通
じて筐体から排出される。In the air cooling device of the present invention, the deformable member can be bent and vibrated by supplying electric energy to the deformable member, and with the vibration, the sheet member covering the deformable member becomes a casing. Swelling inward and contracting in the opposite direction are repeated. When the seat member swells, the air does not flow into the deformable member through the second opening due to the action of the second valve, and the volume of the space in the housing corresponds to the swelling of the seat member. Is reduced, and the high-temperature air in the housing is discharged out of the housing through the vent. At this time, low-temperature air outside the housing flows into the space between the sheet member and the inner surface of the housing covered by the sheet member through the first opening by the action of the first valve. Conversely, when the sheet member contracts as described above,
Air cannot flow out of the housing through the first opening by the action of the first valve, while air can flow out of the deformable member through the second opening by the action of the second valve. The low-temperature air in the space between the housing and the inner surface of the housing covered by the sheet member flows into the space of the housing. Therefore, by vibrating the deformable member as described above, low-temperature air outside the housing flows into the space of the housing through the first and second openings (first and second valves),
On the other hand, the high-temperature air in the housing is discharged from the housing through the vent of the device to be cooled.
【０００６】[0006]
【発明の実施の形態】次に本発明の実施の形態例につい
て図面を参照して説明する。図１は本発明による空冷装
置の一例を示す概略断面側面図である。この空冷装置２
は、圧電素子４およびゴムシート６を含んで構成されて
いる。圧電素子４は、矩形の板状に形成され、電圧を印
加することで湾曲して振動し、冷却対象装置の筐体８の
内面１０に近接し板面を内面１０に対して略平行にして
配設されている。圧電素子４の一方の端部１４は、圧電
素子４が変形可能な状態で筐体８の内面１０に固定さ
れ、もう一方の端部１６は、内面１０に接しているが自
由端となっている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic sectional side view showing an example of an air cooling device according to the present invention. This air cooling device 2
Includes a piezoelectric element 4 and a rubber sheet 6. The piezoelectric element 4 is formed in a rectangular plate shape, bends and vibrates when a voltage is applied, and approaches the inner surface 10 of the housing 8 of the device to be cooled, and makes the plate surface substantially parallel to the inner surface 10. It is arranged. One end 14 of the piezoelectric element 4 is fixed to the inner surface 10 of the housing 8 in a state where the piezoelectric element 4 is deformable, and the other end 16 is in contact with the inner surface 10 but is a free end. I have.
【０００７】ゴムシート６は、圧電素子４よりやや広
く、圧電素子４にほぼ密着して圧電素子４を覆ってお
り、ゴムシート６の周辺部は全体が筐体８の内面１０に
対しほぼ隙間なく、望ましくは隙間なく固定されてい
る。ゴムシート６により圧電素子４と共に覆われた筐体
の箇所、本実施の形態例では圧電素子４のほぼ中央部に
対向する箇所に第１の開口４０が形成され、この第１の
開口の箇所には第１の弁４２が取り付けられている。第
１の弁４２は、第１の開口を通じて筐体内の空気が流出
することを阻止する一方筐体内に空気が流入することは
可能とするものである。そして、ゴムシート６には、本
実施の形態例ではそのほぼ中央部に第２の開口４４が形
成され、第２の開口４４の箇所には、第２の弁４６が取
り付けられている。第２の弁４６は、第２の開口４４を
通じて圧電素子４側に空気が流動することを阻止する一
方、圧電素子４側から空気が流出することは可能とする
ものである。図２はこの空冷装置２を装着した電子装置
の全体を示す概略斜視図である。空冷装置２は電子装置
１８の筐体８の１つの側壁２０に装着されており、他の
側壁２２には通気口２４が形成されている。The rubber sheet 6 is slightly wider than the piezoelectric element 4 and covers the piezoelectric element 4 almost in close contact with the piezoelectric element 4, and the entire peripheral portion of the rubber sheet 6 is substantially spaced from the inner surface 10 of the housing 8. And preferably fixed without any gaps. A first opening 40 is formed at a location of the housing covered with the piezoelectric element 4 by the rubber sheet 6, in this embodiment, at a location facing a substantially central portion of the piezoelectric element 4. Is provided with a first valve 42. The first valve 42 prevents air from flowing into the housing through the first opening, while allowing air to flow into the housing. In the present embodiment, the rubber sheet 6 has a second opening 44 substantially at the center thereof, and a second valve 46 is attached to the second opening 44. The second valve 46 prevents air from flowing toward the piezoelectric element 4 through the second opening 44, while allowing air to flow out from the piezoelectric element 4 side. FIG. 2 is a schematic perspective view showing the entire electronic device to which the air cooling device 2 is attached. The air cooling device 2 is mounted on one side wall 20 of the housing 8 of the electronic device 18, and a vent 24 is formed on the other side wall 22.
【０００８】次に、このように構成された空冷装置２の
動作について説明する。圧電素子４に電圧を印加しない
状態では、圧電素子４は変形せず、図１に示したように
ほぼ平坦となっている。一方、圧電素子４に電圧を印加
すると、圧電素子４は、図３に示したように、筐体８の
内側に凸となって湾曲する。このとき、圧電素子４に密
着しているゴムシート６は、圧電素子４に押されて筐体
８の内側方向に膨出する。Next, the operation of the air cooling device 2 configured as described above will be described. When no voltage is applied to the piezoelectric element 4, the piezoelectric element 4 is not deformed and is almost flat as shown in FIG. On the other hand, when a voltage is applied to the piezoelectric element 4, as shown in FIG. At this time, the rubber sheet 6 in close contact with the piezoelectric element 4 is pushed by the piezoelectric element 4 and swells inward of the housing 8.
【０００９】そして、圧電素子４には周期的に電圧を印
加し、圧電素子４を周期的に湾曲させて振動させる。そ
の結果、この振動に伴って、圧電素子４を覆っているゴ
ムシート６は筐体８の内側方向への膨出、および逆方向
への縮退を繰り返す。図４の（Ａ）はゴムシート６が膨
出した場合の第１および第２の弁４２、４６の状態を示
す模式断面側面図、（Ｂ）はゴムシート６が縮退した場
合の第１および第２の弁４２、４６の状態を示す模式断
面側面図である。なお、これらの図では、各弁の作用を
明瞭に示すため、第１および第２の弁４２、４６は模式
的に描かれている。Then, a voltage is periodically applied to the piezoelectric element 4, and the piezoelectric element 4 is periodically bent and vibrated. As a result, with this vibration, the rubber sheet 6 covering the piezoelectric element 4 repeatedly swells inward of the housing 8 and contracts in the opposite direction. FIG. 4A is a schematic cross-sectional side view showing the state of the first and second valves 42 and 46 when the rubber sheet 6 swells, and FIG. It is a schematic cross section side view which shows the state of 2nd valve 42,46. In these figures, the first and second valves 42 and 46 are schematically illustrated in order to clearly show the operation of each valve.
【００１０】図４の（Ａ）に示したように、ゴムシート
６が膨出したときは、第２の弁４６の作用によって開口
４４を通じて空気が圧電素子４側に流入することはな
く、そしてゴムシート６の膨出分だけ筐体内の空間部分
の容積が縮小し、筐体内の高温の空気が、図５に矢印Ａ
で示したように、通気口２４を通じて筐体８の外に排出
される。また、このとき、第１の弁４２の作用によって
第１の開口４０を通じて筐体外の低温の空気が、矢印Ｂ
で示したように、ゴムシート６の内側の空間内に流入す
る。As shown in FIG. 4A, when the rubber sheet 6 swells, no air flows into the piezoelectric element 4 through the opening 44 by the action of the second valve 46, and The volume of the space in the housing is reduced by an amount corresponding to the bulging of the rubber sheet 6, and the high-temperature air in the housing is indicated by an arrow A in FIG.
As shown in the figure, the air is discharged out of the housing 8 through the ventilation port 24. At this time, the low-temperature air outside the housing flows through the first opening 40 due to the action of the first valve 42, as indicated by an arrow B.
As shown by, flows into the space inside the rubber sheet 6.
【００１１】そして、ゴムシート６が縮退するときは、
図４の（Ｂ）に示したように、第１の弁４２の作用によ
って空気は第１の開口４０を通じて筐体８外に流出でき
ず、一方、第２の弁４６の作用によって第２の開口４４
を通じて圧電素子４側から流出可能であるため、矢印Ｃ
で示したように、ゴムシート６の内側の低温の空気は第
２の開口４４を通じて筐体の空間部分へ流入する。When the rubber sheet 6 contracts,
As shown in FIG. 4B, the air cannot flow out of the housing 8 through the first opening 40 due to the action of the first valve 42, whereas the air does not flow out of the housing 8 through the action of the second valve 46. Opening 44
Can flow out of the piezoelectric element 4 through the
As shown by the arrow, the low-temperature air inside the rubber sheet 6 flows into the space of the housing through the second opening 44.
【００１２】したがって、圧電素子４を上述のように振
動させることで、筐体外の低温の空気が第１および第２
の開口４０、４４（第１および第２の弁４２、４６）を
通じて筐体内に流入し、一方、筐体内の高温の空気は冷
却対象装置の通気口２４を通じて筐体から排出される。
その結果電子装置１８は極めて効果的に冷却される。そ
して、この空冷装置２では、圧電素子４を駆動するのみ
であるから、必要な電力はファンなどに比べ少ない。ま
た、圧電素子４は比較的低い周期で振動させればよいの
で、ファンのような騒音は発生しない。しかも、全体が
平板であるから、場所をとらない。Therefore, by vibrating the piezoelectric element 4 as described above, low-temperature air outside the housing is removed from the first and second air-conditioners.
Flows into the housing through the openings 40, 44 (first and second valves 42, 46), while the high-temperature air in the housing is exhausted from the housing through the vent 24 of the device to be cooled.
As a result, the electronic device 18 is cooled very effectively. In this air cooling device 2, only the piezoelectric element 4 is driven, so that the required electric power is smaller than that of a fan or the like. In addition, since the piezoelectric element 4 only needs to be vibrated at a relatively low cycle, noise like a fan does not occur. Moreover, since the whole is a flat plate, no space is required.
【００１３】なお、本実施の形態例では、変形部材とし
て圧電素子４を用いたが、圧電素子以外にも、例えばバ
イメタルや形状記憶合金を変形部材として用いることが
できる。バイメタルを用いた場合には、バイメタルに通
電するとバイメタルは発熱して温度が上昇し、その結
果、湾曲する。そして、通電を停止すると発熱が停止
し、温度が下がってもとの平坦な状態にもどる。したが
って、バイメタルに対して周期的に通電することで、圧
電素子４と同様の作用を実現でき、電子装置を効果的に
冷却することができる。形状記憶合金を用いた場合に
は、例えば図５に示したように、形状記憶合金３８と筐
体８の内面１０との間にバネ９を配してバネ９で付勢し
ておき、常時は湾曲した状態にしておく。そして、通電
すると、形状記憶合金は発熱して温度が上昇し、形状記
憶合金３８はバネ９の力に打ち勝って、記憶しているも
との平坦な形状に戻る。したがって、この場合にも、形
状記憶合金に対して周期的に通電することで、圧電素子
４と同様に振動させることができ、電子装置の効果的な
冷却が可能となる。In this embodiment, the piezoelectric element 4 is used as the deformable member. However, other than the piezoelectric element, for example, a bimetal or a shape memory alloy can be used as the deformable member. In the case where a bimetal is used, when the bimetal is energized, the bimetal generates heat and its temperature rises, and as a result, it bends. When the energization is stopped, the heat generation stops, and the temperature returns to the original flat state. Therefore, by applying a current to the bimetal periodically, the same operation as that of the piezoelectric element 4 can be realized, and the electronic device can be effectively cooled. When a shape memory alloy is used, a spring 9 is disposed between the shape memory alloy 38 and the inner surface 10 of the housing 8 and is urged by the spring 9 as shown in FIG. Is kept in a curved state. Then, when electricity is supplied, the shape memory alloy generates heat and its temperature rises, and the shape memory alloy 38 overcomes the force of the spring 9 to return to the stored flat shape. Therefore, also in this case, by periodically energizing the shape memory alloy, it is possible to vibrate similarly to the piezoelectric element 4, and it is possible to effectively cool the electronic device.
【００１４】[0014]
【実施例】図１に示した空冷装置２において、圧電素子
４は、０．１〜１００Ｈｚの周期で振動させることで良
好な冷却効果が得られた。また、圧電素子４の大きさ
を、横が１０ｃｍ、縦が３ｃｍとし、振動周期を１００
Ｈｚとした場合、８１０ミリリットル／秒もの換気量が
得られ、これによる放熱量は２０Ｗに達した。EXAMPLE In the air cooling device 2 shown in FIG. 1, a good cooling effect was obtained by vibrating the piezoelectric element 4 at a period of 0.1 to 100 Hz. The size of the piezoelectric element 4 is 10 cm in width and 3 cm in length, and the vibration cycle is 100 cm.
In the case of Hz, a ventilation volume of 810 ml / sec was obtained, and the heat radiation amount thereby reached 20 W.
【００１５】[0015]
【発明の効果】以上説明したように本発明の空冷装置で
は、変形部材に電気エネルギを供給することで変形部材
を湾曲して振動させることができ、この振動に伴って、
変形部材を覆っているシート部材は筐体の内側方向への
膨出、および逆方向への縮退を繰り返す。そして、シー
ト部材が膨出したときは、第２の弁の作用によって空気
が第２の開口を通じ変形部材側に流入することはなく、
そしてシート部材の膨出分だけ筐体内の空間部分の容積
が縮小し、筐体内の高温の空気が通気口を通じて筐体の
外に排出される。また、このとき、第１の弁の作用によ
って第１の開口を通じ筐体外の低温の空気がシート部材
と、シート部材により覆われた筐体の内面との間の空間
内に流入する。逆に、シート部材が上述のように縮退す
るときは、第１の弁の作用によって空気は第１の開口を
通じ筐体外に流出できず、一方、第２の弁の作用によっ
て空気は第２の開口を通じ変形部材側から流出可能であ
るため、シート部材と、シート部材により覆われた筐体
の内面との間の空間内の低温の空気は、筐体の空間部分
に流入する。したがって、変形部材を上述のように振動
させることで、筐体外の低温の空気が第１および第２の
開口（第１および第２の弁）を通じて筐体の空間部分に
流入し、一方、筐体内の高温の空気は冷却対象装置の通
気口を通じて筐体から排出される。その結果、冷却対象
装置を極めて効果的に冷却することができる。そして、
本発明の空冷装置では、例えば圧電素子などの変形部材
を駆動するのみであるから、必要な電力はファンなどに
比べ少ない。また、変形部材は比較的低い周期で振動さ
せればよいので、ファンのような騒音は発生しない。し
かも、全体が平板であるから場所をとらない。As described above, in the air cooling apparatus of the present invention, the deformable member can be bent and vibrated by supplying electric energy to the deformable member.
The sheet member covering the deformable member repeatedly swells inward and contracts in the opposite direction. When the seat member swells, the air does not flow into the deformable member through the second opening by the action of the second valve.
Then, the volume of the space in the housing is reduced by the amount of the swelling of the sheet member, and the high-temperature air in the housing is discharged out of the housing through the vent. At this time, low-temperature air outside the housing flows into the space between the sheet member and the inner surface of the housing covered by the sheet member through the first opening by the action of the first valve. Conversely, when the seat member contracts as described above, the air cannot flow out of the housing through the first opening by the action of the first valve, while the air flows to the second by the action of the second valve. Since it is possible to flow out of the deformable member through the opening, low-temperature air in the space between the sheet member and the inner surface of the housing covered by the sheet member flows into the space of the housing. Therefore, by vibrating the deformable member as described above, low-temperature air outside the housing flows into the space portion of the housing through the first and second openings (first and second valves). High-temperature air inside the body is discharged from the housing through a vent of the device to be cooled. As a result, the cooling target device can be cooled very effectively. And
In the air cooling device of the present invention, for example, only a deformable member such as a piezoelectric element is driven. Also, since the deformable member only needs to be vibrated at a relatively low cycle, noise like a fan does not occur. Moreover, since the whole is a flat plate, no space is required.
【図１】本発明による空冷装置の一例を示す概略断面側
面図である。FIG. 1 is a schematic sectional side view showing an example of an air cooling device according to the present invention.
【図２】空冷装置を装着した電子装置の全体を示す概略
斜視図である。FIG. 2 is a schematic perspective view showing the entire electronic device equipped with an air cooling device.
【図３】図１において圧電素子が湾曲した状態を示す概
略断面側面図である。FIG. 3 is a schematic sectional side view showing a state in which the piezoelectric element is curved in FIG.
【図４】（Ａ）はゴムシートが膨出した場合の第１およ
び第２の弁の状態を示す模式断面側面図、（Ｂ）はゴム
シートが縮退した場合の第１および第２の弁の状態を示
す模式断面側面図である。FIG. 4A is a schematic cross-sectional side view showing a state of the first and second valves when the rubber sheet is expanded, and FIG. 4B is a diagram showing the first and second valves when the rubber sheet is contracted. It is a schematic cross section side view which shows the state of.
【図５】圧電素子として形状記憶合金を用いた場合の構
成を示す概略断面側面図である。FIG. 5 is a schematic cross-sectional side view showing a configuration when a shape memory alloy is used as a piezoelectric element.
２……空冷装置、４……圧電素子、６……ゴムシート、
８……筐体、２４……通気口、４０……第１の開口、４
２……第１の弁、４４……第２の開口、４６……第２の
弁。2 ... air cooling device, 4 ... piezoelectric element, 6 ... rubber sheet,
8 ... housing, 24 ... vent, 40 ... first opening, 4
2... First valve, 44... Second opening, 46.
Claims (6)
れ、前記装置内の空気の排出および装置内への空気の吸
引を行うことによって前記装置を冷却する空冷装置であ
って、 電気エネルギを供給することで、湾曲して振動する板状
の変形部材を、冷却対象装置の筐体の内面に近接し板面
を前記内面に対して略平行にして変形可能な状態で配設
し、 柔軟性を有するシート部材を前記変形部材にほぼ密着さ
せて前記シート部材により前記変形部材を覆い、前記シ
ート部材の周辺部全体を前記筐体の前記内面にほぼ隙間
なく固定し、 前記シート部材により前記変形部材と共に覆われた前記
筐体の箇所に第１の開口を形成して、前記第１の開口を
通じて前記筐体内の空気が流出することを阻止する一方
前記筐体内に空気が流入することは可能とする第１の弁
を前記第１の開口の箇所に取り付け、 前記シート部材に第２の開口を形成して、前記第２の開
口を通じて前記変形部材側に空気が流入することを阻止
する一方前記変形部材側から空気が流出することは可能
とする第２の弁を前記第２の開口の箇所に取り付けた、 ことを特徴とする空冷装置。1. An air-cooling device mounted on a device to be cooled having a vent, and cooling the device by discharging air from the device and sucking air into the device. By providing a plate-shaped deformable member that vibrates in a curved manner, disposed in a deformable state in a state in which the plate surface is close to the inner surface of the housing of the device to be cooled and the plate surface is substantially parallel to the inner surface, A flexible sheet member is brought into close contact with the deformable member to cover the deformable member with the sheet member, and the entire periphery of the sheet member is fixed to the inner surface of the housing with substantially no gap. Forming a first opening at a location of the housing covered with the deformable member to prevent air in the housing from flowing out through the first opening, while allowing air to flow into the housing; Is the first A second valve is formed in the seat member to prevent air from flowing into the deformable member through the second opening; An air cooling device, wherein a second valve that allows air to flow out from a side is attached to the second opening.
筐体の前記内面から離れる方向に凸の状態とを採って振
動することを特徴とする請求項１記載の空冷装置。2. The air cooling device according to claim 1, wherein the deformation member vibrates in a substantially flat state and in a state protruding in a direction away from the inner surface of the housing.
内面に固定されていることを特徴とする請求項１記載の
空冷装置。3. The air cooling device according to claim 1, wherein one end of the deformable member is fixed to the inner surface of the housing.
徴とする請求項１記載の空冷装置。4. The air cooling device according to claim 1, wherein the deformable member is a piezoelectric element.
特徴とする請求項１記載の空冷装置。5. The air cooling device according to claim 1, wherein the deformable member is a bimetal.
記筐体の前記内面と前記形状記憶合金との間にバネを介
在させ、前記バネによって前記形状記憶合金に対し前記
形状記憶合金の板面に略直交する方向に付勢する構成と
したことを特徴とする請求項１記載の空冷装置。6. The shape memory alloy, wherein the deformable member is a shape memory alloy, a spring is interposed between the inner surface of the housing and the shape memory alloy, and the shape memory alloy plate is applied to the shape memory alloy by the spring. 2. The air cooling device according to claim 1, wherein the air cooling device is configured to be urged in a direction substantially perpendicular to the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30670697A JPH11145659A (en) | 1997-11-10 | 1997-11-10 | Air cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30670697A JPH11145659A (en) | 1997-11-10 | 1997-11-10 | Air cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11145659A true JPH11145659A (en) | 1999-05-28 |
Family
ID=17960336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30670697A Abandoned JPH11145659A (en) | 1997-11-10 | 1997-11-10 | Air cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11145659A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000036892A1 (en) * | 1998-12-11 | 2000-06-22 | Telefonaktiebolaget Lm Ericsson (Publ) | Device for increasing heat transfer |
| WO2005041006A1 (en) * | 2003-10-28 | 2005-05-06 | Samsung Electronics Co., Ltd. | Display |
| JP2007527618A (en) * | 2003-07-07 | 2007-09-27 | ジョージア テック リサーチ コーポレイション | System and method for thermal management using distributed synthetic jet actuators |
| WO2013145604A1 (en) * | 2012-03-30 | 2013-10-03 | 日東電工株式会社 | Ventilation system |
| JP2021526380A (en) * | 2018-06-14 | 2021-10-07 | フィリップ・モーリス・プロダクツ・ソシエテ・アノニム | Aerosol generator with shape memory heater |
-
1997
- 1997-11-10 JP JP30670697A patent/JPH11145659A/en not_active Abandoned
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000036892A1 (en) * | 1998-12-11 | 2000-06-22 | Telefonaktiebolaget Lm Ericsson (Publ) | Device for increasing heat transfer |
| JP2007527618A (en) * | 2003-07-07 | 2007-09-27 | ジョージア テック リサーチ コーポレイション | System and method for thermal management using distributed synthetic jet actuators |
| WO2005041006A1 (en) * | 2003-10-28 | 2005-05-06 | Samsung Electronics Co., Ltd. | Display |
| WO2013145604A1 (en) * | 2012-03-30 | 2013-10-03 | 日東電工株式会社 | Ventilation system |
| JP2013229281A (en) * | 2012-03-30 | 2013-11-07 | Nitto Denko Corp | Ventilation system |
| CN104206042A (en) * | 2012-03-30 | 2014-12-10 | 日东电工株式会社 | Ventilation system |
| EP2833706A4 (en) * | 2012-03-30 | 2016-02-10 | Nitto Denko Corp | Ventilation system |
| JP2021526380A (en) * | 2018-06-14 | 2021-10-07 | フィリップ・モーリス・プロダクツ・ソシエテ・アノニム | Aerosol generator with shape memory heater |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Effective date: 20060613 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20060810 |