GB2351804B - Semiconductor factory automation system and method for controlling measurement equipment to measure semiconductor wafers - Google Patents

Semiconductor factory automation system and method for controlling measurement equipment to measure semiconductor wafers

Info

Publication number
GB2351804B
GB2351804B GB0015837A GB0015837A GB2351804B GB 2351804 B GB2351804 B GB 2351804B GB 0015837 A GB0015837 A GB 0015837A GB 0015837 A GB0015837 A GB 0015837A GB 2351804 B GB2351804 B GB 2351804B
Authority
GB
United Kingdom
Prior art keywords
semiconductor
automation system
measurement equipment
factory automation
measure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0015837A
Other languages
English (en)
Other versions
GB0015837D0 (en
GB2351804A (en
Inventor
Sung-Hae Ha
Young-Soo Cho
Myung-Jai Ko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-1999-0024934A external-priority patent/KR100498601B1/ko
Priority claimed from KR10-1999-0024870A external-priority patent/KR100498600B1/ko
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB0015837D0 publication Critical patent/GB0015837D0/en
Publication of GB2351804A publication Critical patent/GB2351804A/en
Application granted granted Critical
Publication of GB2351804B publication Critical patent/GB2351804B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
GB0015837A 1999-06-28 2000-06-28 Semiconductor factory automation system and method for controlling measurement equipment to measure semiconductor wafers Expired - Fee Related GB2351804B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-1999-0024934A KR100498601B1 (ko) 1999-06-28 1999-06-28 반도체 제조용 엘립소미터 장비의 데이터를 수집하기 위한 방법
KR10-1999-0024870A KR100498600B1 (ko) 1999-06-28 1999-06-28 반도체 제조용 프로메트릭스 장비의 데이터를 수집하기 위한방법

Publications (3)

Publication Number Publication Date
GB0015837D0 GB0015837D0 (en) 2000-08-23
GB2351804A GB2351804A (en) 2001-01-10
GB2351804B true GB2351804B (en) 2003-09-24

Family

ID=26635597

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0015837A Expired - Fee Related GB2351804B (en) 1999-06-28 2000-06-28 Semiconductor factory automation system and method for controlling measurement equipment to measure semiconductor wafers

Country Status (5)

Country Link
JP (1) JP2001076982A (de)
CN (1) CN1279424A (de)
DE (1) DE10031478A1 (de)
GB (1) GB2351804B (de)
TW (1) TW466577B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011075760A1 (en) * 2009-12-22 2011-06-30 Unitract Syringe Pty Ltd Retractable syringe with improved delivery efficiency and locking system

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6792328B2 (en) * 2002-03-29 2004-09-14 Timbre Technologies, Inc. Metrology diffraction signal adaptation for tool-to-tool matching
CN1720490B (zh) 2002-11-15 2010-12-08 应用材料有限公司 用于控制具有多变量输入参数的制造工艺的方法和系统
CN100342485C (zh) * 2003-06-10 2007-10-10 旺宏电子股份有限公司 炉管产能监视系统及其运作方法
CN105185731B (zh) * 2015-08-17 2018-10-16 北京北方华创微电子装备有限公司 一种半导体热处理设备的晶片调度控制方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828674A (en) * 1997-09-16 1998-10-27 Teradyne, Inc. Production interface for integrated circuit test system
JPH11176713A (ja) * 1997-12-12 1999-07-02 Kokusai Electric Co Ltd 基板処理管理装置
JPH11274076A (ja) * 1999-02-12 1999-10-08 Nikon Corp 露光装置、リソグラフィシステム及びこれを利用した半導体デバイス製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828674A (en) * 1997-09-16 1998-10-27 Teradyne, Inc. Production interface for integrated circuit test system
JPH11176713A (ja) * 1997-12-12 1999-07-02 Kokusai Electric Co Ltd 基板処理管理装置
JPH11274076A (ja) * 1999-02-12 1999-10-08 Nikon Corp 露光装置、リソグラフィシステム及びこれを利用した半導体デバイス製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011075760A1 (en) * 2009-12-22 2011-06-30 Unitract Syringe Pty Ltd Retractable syringe with improved delivery efficiency and locking system

Also Published As

Publication number Publication date
GB0015837D0 (en) 2000-08-23
GB2351804A (en) 2001-01-10
CN1279424A (zh) 2001-01-10
TW466577B (en) 2001-12-01
JP2001076982A (ja) 2001-03-23
DE10031478A1 (de) 2001-07-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090628