GB2337159B - Method for manufacturing capacitor's lower electrode - Google Patents
Method for manufacturing capacitor's lower electrodeInfo
- Publication number
- GB2337159B GB2337159B GB9809770A GB9809770A GB2337159B GB 2337159 B GB2337159 B GB 2337159B GB 9809770 A GB9809770 A GB 9809770A GB 9809770 A GB9809770 A GB 9809770A GB 2337159 B GB2337159 B GB 2337159B
- Authority
- GB
- United Kingdom
- Prior art keywords
- lower electrode
- manufacturing capacitor
- capacitor
- manufacturing
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/84—Electrodes with an enlarged surface, e.g. formed by texturisation being a rough surface, e.g. using hemispherical grains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/86—Electrodes with an enlarged surface, e.g. formed by texturisation having horizontal extensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9809770A GB2337159B (en) | 1998-02-07 | 1998-05-07 | Method for manufacturing capacitor's lower electrode |
DE19823253A DE19823253C1 (en) | 1998-02-07 | 1998-05-26 | Capacitor lower electrode is produced especially for a DRAM capacitor |
FR9806657A FR2774804B1 (en) | 1998-02-07 | 1998-05-27 | METHOD FOR FORMING THE LOWER ELECTRODE OF A CAPACITOR |
JP10146282A JP2936326B1 (en) | 1998-02-07 | 1998-05-27 | Method of manufacturing lower electrode of capacitor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087101622A TW374242B (en) | 1998-02-07 | 1998-02-07 | Method for manufacturing an underside electrode of a capacitor |
GB9809770A GB2337159B (en) | 1998-02-07 | 1998-05-07 | Method for manufacturing capacitor's lower electrode |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9809770D0 GB9809770D0 (en) | 1998-07-08 |
GB2337159A GB2337159A (en) | 1999-11-10 |
GB2337159B true GB2337159B (en) | 2000-12-06 |
Family
ID=26313614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9809770A Expired - Fee Related GB2337159B (en) | 1998-02-07 | 1998-05-07 | Method for manufacturing capacitor's lower electrode |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2936326B1 (en) |
DE (1) | DE19823253C1 (en) |
FR (1) | FR2774804B1 (en) |
GB (1) | GB2337159B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3344482B2 (en) * | 1999-10-01 | 2002-11-11 | 日本電気株式会社 | Semiconductor memory device and method of manufacturing the same |
JP4731025B2 (en) * | 2001-02-07 | 2011-07-20 | Okiセミコンダクタ株式会社 | Cylinder type capacitor and method of manufacturing cylinder type capacitor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5622889A (en) * | 1995-01-26 | 1997-04-22 | Samsung Electronics Co., Ltd. | High capacitance capacitor manufacturing method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5278091A (en) * | 1993-05-04 | 1994-01-11 | Micron Semiconductor, Inc. | Process to manufacture crown stacked capacitor structures with HSG-rugged polysilicon on all sides of the storage node |
KR970054170A (en) * | 1995-12-25 | 1997-07-31 |
-
1998
- 1998-05-07 GB GB9809770A patent/GB2337159B/en not_active Expired - Fee Related
- 1998-05-26 DE DE19823253A patent/DE19823253C1/en not_active Expired - Fee Related
- 1998-05-27 JP JP10146282A patent/JP2936326B1/en not_active Expired - Lifetime
- 1998-05-27 FR FR9806657A patent/FR2774804B1/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5622889A (en) * | 1995-01-26 | 1997-04-22 | Samsung Electronics Co., Ltd. | High capacitance capacitor manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
DE19823253C1 (en) | 1999-07-15 |
JP2936326B1 (en) | 1999-08-23 |
JPH11238848A (en) | 1999-08-31 |
FR2774804A1 (en) | 1999-08-13 |
FR2774804B1 (en) | 2000-08-11 |
GB2337159A (en) | 1999-11-10 |
GB9809770D0 (en) | 1998-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20030507 |