GB2264887B - A material processing apparatus - Google Patents

A material processing apparatus

Info

Publication number
GB2264887B
GB2264887B GB9205072A GB9205072A GB2264887B GB 2264887 B GB2264887 B GB 2264887B GB 9205072 A GB9205072 A GB 9205072A GB 9205072 A GB9205072 A GB 9205072A GB 2264887 B GB2264887 B GB 2264887B
Authority
GB
United Kingdom
Prior art keywords
processing apparatus
material processing
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9205072A
Other versions
GB2264887A (en
GB9205072D0 (en
Inventor
Stewart Wynn Williams
Graeme Scott
Howard James Price
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
British Aerospace PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aerospace PLC filed Critical British Aerospace PLC
Priority to GB9205072A priority Critical patent/GB2264887B/en
Publication of GB9205072D0 publication Critical patent/GB9205072D0/en
Publication of GB2264887A publication Critical patent/GB2264887A/en
Application granted granted Critical
Publication of GB2264887B publication Critical patent/GB2264887B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
GB9205072A 1992-03-07 1992-03-07 A material processing apparatus Expired - Fee Related GB2264887B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9205072A GB2264887B (en) 1992-03-07 1992-03-07 A material processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9205072A GB2264887B (en) 1992-03-07 1992-03-07 A material processing apparatus

Publications (3)

Publication Number Publication Date
GB9205072D0 GB9205072D0 (en) 1992-04-22
GB2264887A GB2264887A (en) 1993-09-15
GB2264887B true GB2264887B (en) 1994-12-07

Family

ID=10711751

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9205072A Expired - Fee Related GB2264887B (en) 1992-03-07 1992-03-07 A material processing apparatus

Country Status (1)

Country Link
GB (1) GB2264887B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110280913A (en) * 2019-05-10 2019-09-27 江苏大学 A kind of laser processing device and method of water base ultrasonic vibration coupled magnetic field auxiliary
CN111055029A (en) * 2019-12-31 2020-04-24 武汉大学 Laser cutting device and method for regulating and controlling crack propagation by controlling plasma through electromagnetic field

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004039916A1 (en) * 2004-08-18 2006-03-09 Universität Stuttgart Institut für Strahlwerkzeuge Narrow recess production in metal workpiece comprises subjecting workpiece to high energy stream, e.g. electron or laser beam, used in cutting, boring and structuring workpieces with action of Lorenze force and magnetic field on melt
DE102005005707B3 (en) * 2005-01-31 2006-02-02 Technische Universität Dresden Radiation of object surface with melting in radiation active region useful for decontamination of an object with electrically conductive surface and production of high purity compositions, where melt is electrically conductive
CN102310269A (en) * 2011-06-22 2012-01-11 胡忠 Numerical-control magnetic-partition laser vaporization cutting machine
CN102310279A (en) * 2011-06-22 2012-01-11 胡忠 Magnetic separated numerical control laser fusion cutting machine
CN103817430B (en) * 2014-02-13 2015-08-12 温州大学 A kind of electromagnetism auxiliary laser drilling method and device
CN104043905B (en) * 2014-06-09 2015-10-28 江苏大学 A kind of device of rotary electromagnetic field auxiliary laser punching
CN107868958B (en) * 2017-12-01 2023-12-05 浙江工业大学 Flexible self-adaptive composite carbon brush type electromagnetic composite field synchronous laser cladding device
CN109014620B (en) * 2018-07-13 2020-07-31 江苏大学 Laser hole making device based on direct current electric field and magnetic field
CN110293324B (en) * 2019-07-29 2020-10-30 长沙理工大学 Electromagnetic field assisted laser cutting method
CN110293325B (en) * 2019-07-29 2020-10-30 长沙理工大学 Thick plate laser cutting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1057306A (en) * 1963-06-14 1967-02-01 Siemens Ag Improvements in or relating to methods of and apparatus for machining or otherwise processing work-pieces by the use of laser beams
US5015818A (en) * 1988-12-30 1991-05-14 Zenith Electronics Corporation Magnetic collector for FTM laser weld debris and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1057306A (en) * 1963-06-14 1967-02-01 Siemens Ag Improvements in or relating to methods of and apparatus for machining or otherwise processing work-pieces by the use of laser beams
US5015818A (en) * 1988-12-30 1991-05-14 Zenith Electronics Corporation Magnetic collector for FTM laser weld debris and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110280913A (en) * 2019-05-10 2019-09-27 江苏大学 A kind of laser processing device and method of water base ultrasonic vibration coupled magnetic field auxiliary
CN111055029A (en) * 2019-12-31 2020-04-24 武汉大学 Laser cutting device and method for regulating and controlling crack propagation by controlling plasma through electromagnetic field

Also Published As

Publication number Publication date
GB2264887A (en) 1993-09-15
GB9205072D0 (en) 1992-04-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020307