GB2235825A - Double-sided composite printed circuit board - Google Patents

Double-sided composite printed circuit board Download PDF

Info

Publication number
GB2235825A
GB2235825A GB9017182A GB9017182A GB2235825A GB 2235825 A GB2235825 A GB 2235825A GB 9017182 A GB9017182 A GB 9017182A GB 9017182 A GB9017182 A GB 9017182A GB 2235825 A GB2235825 A GB 2235825A
Authority
GB
United Kingdom
Prior art keywords
board
printed circuit
circuit board
double
sided printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9017182A
Other languages
English (en)
Other versions
GB9017182D0 (en
Inventor
Yoshikazu Asao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO INTERNATIONAL COMPONENT
Original Assignee
TOKYO INTERNATIONAL COMPONENT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO INTERNATIONAL COMPONENT filed Critical TOKYO INTERNATIONAL COMPONENT
Publication of GB9017182D0 publication Critical patent/GB9017182D0/en
Publication of GB2235825A publication Critical patent/GB2235825A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
GB9017182A 1989-08-09 1990-08-06 Double-sided composite printed circuit board Withdrawn GB2235825A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板

Publications (2)

Publication Number Publication Date
GB9017182D0 GB9017182D0 (en) 1990-09-19
GB2235825A true GB2235825A (en) 1991-03-13

Family

ID=14069727

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9017182A Withdrawn GB2235825A (en) 1989-08-09 1990-08-06 Double-sided composite printed circuit board

Country Status (3)

Country Link
JP (1) JPH0635499Y2 (https=)
KR (1) KR920002343Y1 (https=)
GB (1) GB2235825A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341628A (zh) * 2006-08-02 2009-01-07 株式会社村田制作所 芯片元件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2030007A (en) * 1978-06-29 1980-03-26 Rogers Corp Printed circuit board manufacture
EP0065425A2 (en) * 1981-05-18 1982-11-24 Matsushita Electric Industrial Co., Ltd. Hybrid integrated circuit component and printed circuit board mounting said component
GB2101411A (en) * 1981-06-04 1983-01-12 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
GB2153595A (en) * 1984-01-17 1985-08-21 O Key Printed Wiring Co Ltd Printed circuit board and method of manufacturing such a board
GB2163007A (en) * 1984-08-08 1986-02-12 Krone Gmbh Sheet with printed conductors on both sides and method of forming interconnections between the conductors
GB2219892A (en) * 1988-06-16 1989-12-20 Plessey Co Plc Circuit board laminate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (ja) * 1984-10-04 1986-05-01 横浜ゴム株式会社 可撓性フイルムへの電子回路印刷法
JPS6187392A (ja) * 1984-10-05 1986-05-02 横浜ゴム株式会社 可撓性プリント配線板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2030007A (en) * 1978-06-29 1980-03-26 Rogers Corp Printed circuit board manufacture
EP0065425A2 (en) * 1981-05-18 1982-11-24 Matsushita Electric Industrial Co., Ltd. Hybrid integrated circuit component and printed circuit board mounting said component
GB2101411A (en) * 1981-06-04 1983-01-12 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
GB2153595A (en) * 1984-01-17 1985-08-21 O Key Printed Wiring Co Ltd Printed circuit board and method of manufacturing such a board
GB2163007A (en) * 1984-08-08 1986-02-12 Krone Gmbh Sheet with printed conductors on both sides and method of forming interconnections between the conductors
GB2219892A (en) * 1988-06-16 1989-12-20 Plessey Co Plc Circuit board laminate

Also Published As

Publication number Publication date
GB9017182D0 (en) 1990-09-19
JPH0332465U (https=) 1991-03-29
KR920002343Y1 (ko) 1992-04-09
KR910010399U (ko) 1991-06-29
JPH0635499Y2 (ja) 1994-09-14

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)