GB2194388A - Integrated circuit devices - Google Patents

Integrated circuit devices Download PDF

Info

Publication number
GB2194388A
GB2194388A GB8620291A GB8620291A GB2194388A GB 2194388 A GB2194388 A GB 2194388A GB 8620291 A GB8620291 A GB 8620291A GB 8620291 A GB8620291 A GB 8620291A GB 2194388 A GB2194388 A GB 2194388A
Authority
GB
United Kingdom
Prior art keywords
devices
integrated circuit
mounting structure
silicon
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8620291A
Other languages
English (en)
Other versions
GB8620291D0 (en
Inventor
Peter Henry Saul
David John Pedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB8620291A priority Critical patent/GB2194388A/en
Publication of GB8620291D0 publication Critical patent/GB8620291D0/en
Priority to PCT/GB1987/000588 priority patent/WO1988001437A1/fr
Publication of GB2194388A publication Critical patent/GB2194388A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738—Semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73207—Bump and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8620291A 1986-08-20 1986-08-20 Integrated circuit devices Withdrawn GB2194388A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB8620291A GB2194388A (en) 1986-08-20 1986-08-20 Integrated circuit devices
PCT/GB1987/000588 WO1988001437A1 (fr) 1986-08-20 1987-08-20 Dispositifs a circuits integres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8620291A GB2194388A (en) 1986-08-20 1986-08-20 Integrated circuit devices

Publications (2)

Publication Number Publication Date
GB8620291D0 GB8620291D0 (en) 1986-10-01
GB2194388A true GB2194388A (en) 1988-03-02

Family

ID=10602999

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8620291A Withdrawn GB2194388A (en) 1986-08-20 1986-08-20 Integrated circuit devices

Country Status (2)

Country Link
GB (1) GB2194388A (fr)
WO (1) WO1988001437A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
EP0372108B1 (fr) * 1988-12-05 1994-08-31 Heinz Karl Diedrich Récipient à vide pour le refroidissement cryogénique d'un empaquetage pour dispositif électronique
JP2726141B2 (ja) * 1990-06-05 1998-03-11 三菱電機株式会社 半導体装置およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007993A1 (fr) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Plaque de conducteurs pour le montage et la connexion électrique de pastilles semiconductrices
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4561011A (en) * 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2312172A1 (fr) * 1975-05-22 1976-12-17 Ibm Procede de fabrication d'ensembles de circuits integres
JPS58143556A (ja) * 1982-02-22 1983-08-26 Fujitsu Ltd 高密度集積回路用パツケ−ジ
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007993A1 (fr) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Plaque de conducteurs pour le montage et la connexion électrique de pastilles semiconductrices
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4561011A (en) * 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device

Also Published As

Publication number Publication date
GB8620291D0 (en) 1986-10-01
WO1988001437A1 (fr) 1988-02-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)