GB2181894B - Duplicate wiring in a semiconductor device - Google Patents

Duplicate wiring in a semiconductor device

Info

Publication number
GB2181894B
GB2181894B GB8624497A GB8624497A GB2181894B GB 2181894 B GB2181894 B GB 2181894B GB 8624497 A GB8624497 A GB 8624497A GB 8624497 A GB8624497 A GB 8624497A GB 2181894 B GB2181894 B GB 2181894B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
duplicate
wiring
duplicate wiring
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8624497A
Other versions
GB8624497D0 (en
GB2181894A (en
Inventor
Toyoharu Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB8624497D0 publication Critical patent/GB8624497D0/en
Publication of GB2181894A publication Critical patent/GB2181894A/en
Application granted granted Critical
Publication of GB2181894B publication Critical patent/GB2181894B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB8624497A 1985-10-16 1986-10-13 Duplicate wiring in a semiconductor device Expired GB2181894B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60231715A JPS6290950A (en) 1985-10-16 1985-10-16 Semiconductor device

Publications (3)

Publication Number Publication Date
GB8624497D0 GB8624497D0 (en) 1986-11-19
GB2181894A GB2181894A (en) 1987-04-29
GB2181894B true GB2181894B (en) 1989-09-13

Family

ID=16927878

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8624497A Expired GB2181894B (en) 1985-10-16 1986-10-13 Duplicate wiring in a semiconductor device

Country Status (4)

Country Link
JP (1) JPS6290950A (en)
KR (1) KR900001659B1 (en)
DE (1) DE3635259A1 (en)
GB (1) GB2181894B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584986B2 (en) * 1987-03-10 1997-02-26 三菱電機株式会社 Wiring structure of semiconductor device
JPS63283040A (en) * 1987-05-15 1988-11-18 Toshiba Corp Semiconductor device
EP0394520A1 (en) * 1989-04-26 1990-10-31 Richard Nicolaus Apparatus and method for cutting material wound on reels
JPH05283467A (en) * 1992-03-30 1993-10-29 Nec Corp Semiconductor integrated circuit device
EP0953983A3 (en) * 1996-03-01 2005-10-05 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory device with clamping circuit for preventing malfunction
DE69700241T2 (en) * 1996-03-01 1999-11-04 Mitsubishi Denki K.K., Tokio/Tokyo Semiconductor memory device to prevent malfunction due to line selection line interruption

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1244668A (en) * 1967-12-06 1971-09-02 Ibm Improvements relating to semiconductor devices
EP0016577A1 (en) * 1979-03-09 1980-10-01 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device with a double interconnection layer
GB1596907A (en) * 1978-05-25 1981-09-03 Fujitsu Ltd Manufacture of semiconductor devices
EP0048610A2 (en) * 1980-09-22 1982-03-31 Kabushiki Kaisha Toshiba Semiconductor device and its manufacture
EP0103362A2 (en) * 1982-06-30 1984-03-21 Fujitsu Limited Semiconductor device with power lines
EP0129476A2 (en) * 1983-06-16 1984-12-27 Digital Equipment Corporation Planar interconnection for integrated circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1244668A (en) * 1967-12-06 1971-09-02 Ibm Improvements relating to semiconductor devices
GB1596907A (en) * 1978-05-25 1981-09-03 Fujitsu Ltd Manufacture of semiconductor devices
EP0016577A1 (en) * 1979-03-09 1980-10-01 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device with a double interconnection layer
EP0048610A2 (en) * 1980-09-22 1982-03-31 Kabushiki Kaisha Toshiba Semiconductor device and its manufacture
EP0103362A2 (en) * 1982-06-30 1984-03-21 Fujitsu Limited Semiconductor device with power lines
EP0129476A2 (en) * 1983-06-16 1984-12-27 Digital Equipment Corporation Planar interconnection for integrated circuits

Also Published As

Publication number Publication date
JPS6290950A (en) 1987-04-25
GB8624497D0 (en) 1986-11-19
GB2181894A (en) 1987-04-29
DE3635259A1 (en) 1987-04-16
KR870004502A (en) 1987-05-09
KR900001659B1 (en) 1990-03-17

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19951108

PE20 Patent expired after termination of 20 years

Effective date: 20061012