GB2142567A - Solderable adhesive layer - Google Patents
Solderable adhesive layer Download PDFInfo
- Publication number
- GB2142567A GB2142567A GB08416310A GB8416310A GB2142567A GB 2142567 A GB2142567 A GB 2142567A GB 08416310 A GB08416310 A GB 08416310A GB 8416310 A GB8416310 A GB 8416310A GB 2142567 A GB2142567 A GB 2142567A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- adhesive layer
- metalloid
- anyone
- solderable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 title claims description 11
- 239000010410 layer Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052752 metalloid Inorganic materials 0.000 claims description 10
- 150000002738 metalloids Chemical class 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000007738 vacuum evaporation Methods 0.000 claims 2
- 229920000136 polysorbate Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 235000010210 aluminium Nutrition 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000905957 Channa melasoma Species 0.000 description 1
- -1 CoJeVI3100-X-Y Chemical compound 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4415—Cables for special applications
- G02B6/4427—Pressure resistant cables, e.g. undersea cables
- G02B6/4428—Penetrator systems in pressure-resistant devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
- H01B17/301—Sealing of insulators to support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
1 GB 2 142 567 A 1
SPECIFICATION
Solderable adhesive layer The present invention relates to a solderable adhesive layer to a method of applying the layer and to devices provided with such a layer. Such layers are needed mainlyto make electrical contacts to or mechanical connections between components. They are particularly useful in making contacts to thin-film circuits deposited on semiconductor, glass or ceramic substrates.
To produce contact areas and interconnections in thin-film circuits, layers of copper, gold, or alumi- nium are commonly deposited in a vacuum. Such layers have the advantage of very high conductivity, but they have the disadvantage of not adhering well to the base, so that special precautions have to be taken during soldering.
The invention seeks to provide a layer which, is easily solderable and which also adheres well to a base material of for example glass or a semiconductor.
According to one aspect of the invention there is provided a solderable adhesive layer, for making electrical contacts to or mechanical connections between components, characterised in that the layer is a thin layer of an alloy comprising a metal and a metalloid.
According to another aspect of the invention the solderable adhesive layer as previously defined is produced by evaporation and or sputtering of the metal(s) and metalloid(s).
The layer of the invention has an added advantage in that it can be much thinner than conventional layers. A thickness of about 100 nm will be sufficient, while a copper layer must be about 3 Km thick. For special applications, it may be of importance that the layer also has magnetic properties, so that magnetic sensors, together with their terminals, can be manu factured in a single operation. For some applica tions, it may be of importance that commonly used solders and the layer, while combining very well, do not dissolve in each other and, thus, can be sepa rated again residue-free, while in conventional sol dered joints, inseparable alloys are formed between the solder and the joint.
The layer of the invention and the method of producing the layer will now be described, by way of example only, and then some devices incorporating 115 such layers will be explained in more detail with reference to the drawings, in which:
Figure 1 is a top view of a magnetic sensor deposited as a layer in accordance with the invention on a glass substrate and having four leads and four 120 solder pads; Figure 2 is a sectional view of a feedthrough insulator having a layer deposited in accordance with the invention for bringing a conductor inside a vacuum vessel, and Figure 3 is a sectional view of a glass-fibre mounting employing a deposited layer in accord ance with the invention.
We have discovered that readily solderable and, above all, very well adhering contact layers for 130 thin-film circuits can be formed by depositing thin layers of an alloy consisting of metals and metalloids and that such deposition can be effectively carried out by evaporation or sputtering The adhesion of such a layer to the base has been found to be quite sufficient if the layer is deposited by evaporation. However, because of the simplicity of the process, not because of the even better result, sputtering is preferred. The metals cobalt and iron and the metalloids boron, silicon, and germanium have proved to be particularly well suited. A suitable proportion of the metals approximately 60 to 90 at.% preferably 80 at.%. Particularly well suited alloys are those of cobalt and boron and alloys consisting of cobalt, iron, and boron, such as CoJeVI3100-X-Y, where 705 x 5 80 and 4:5 Y:5 10 (x and y in at.%).
Figure 1 shows a glass substrate 1 which supports a magnetic sensor 2 together with its connections. The sensor 2 is a circular area. It has four radially outwardly extending leads 3, which are spaced at 90' intervals. At its outer end, each of the leads 3 has a solder pad 4. The sensor 2, together with its leads 3 and the solder pads 4, is formed by depositing a thin layer of an amorphous metal, C075Fe51320, in a single operation. During the deposition of the layer, the glass substrate 1 is situated in a magnetic field whose direction is parallel to either of the two lead pairs. It thus shows magnetic anisotropy, which can be described by an anisotropic field Hk. If a current is passed through the sensor 2 parallel to Hk, and the sensor is placed in a magnetic field perpendicular to Hk in the plane of the sensor, a voltage from which the magnitude of the applied magnetic field is determinable can be taken off in a direction perpen- dicular to Hk. In the case of especially long leads 3, the latter may be of a different material such as aluminium. The sensor 2 and the solder pads 4, on the one hand, and the leads 3, on the other hand, must then be produced in separate operations.
Figure 2 shows a conductor 11 fed through a "vacuum flange" 12. The conductor 11 may be of platinum, for example and where it passes through the vacuum flange 12 it is sealed in a glass envelope 13 having a solder layer 14 on its outside. The solder layer is formed in accordance with the invention and is an alloy consisting of about 80 at.% of cobalt and 20 at.% of boron. The vacuum flange 12 is soldered to the solder layer 14, so that a feedthrough insulator for a vacuum vessel is obtained.
By a similar technique, an optical fibre of glass can be mounted, as shown in Figure 3. A glass fibre 21 is provided with a soldering layer 23 of CoB in the vicinity of a soldering sleeve 22. The soldering layer 23 and the soldering sleeve 22 are soldered together.
Claims (17)
1. A solderabie adhesive layer, for making electrical contacts to or mechanical connections be- tween components, characterised in that the layer is a thin layer of an alloy comprising a metal and a metalloid
2. A layer as claimed in claim 1, characterised in that the metal comprises cobalt.
3. A layer as claimed in claim 1 or 2, characte- 2 GB 2 142 567 A 2 rised in that the metal comprises iron.
4. A layer as claimed in anyone of the preceding claims, characterised in that the metalloid comprises boron.
5. Alayerasclai - med in any one of the preceding claims, characterised in that the metalloid comprises silicon.
6. A layer as claimed in anyone of the preceding claims, characterised in that the metalloid comprises germanium.
7. A layer as claimed in claim 2, characterised in that it consists of cobalt and boron.
8. A layer as claimed in claim 2, characterised in that it consists of cobalt, iron, and boron.
9. A layeras claimed in anyone of claims 1 to4, characterised in that the percentage of the metals is about 60 to 90, preferably 80 at.%.
10. A layer as claimed in claim 4, characterised in that it consists of CojeYBI100-x-Y where70 < x < 80 (at.%) and 4 <y < 10 (at.%)
11. A layeras claimed in anyone of claims 1 to 10, characterised in that it is a layer deposited by vacuum evaporation.
12. A layeras claimed in anyone of claims 1 to 10, characterised in that it is a layer deposited by sputtering.
13. A solderable adhesive layer substantially as described herein.
14. A method of producing a solderable adhesive layer as claimed in any one of claims 1 to 11, characterised in that the metal(s) and metalloid(s) are applied by vacuum evaporation.
15. A method of producing a solderable adhesive layer as claimed in any one of claims 1 to 10 or 12, characterised in that the metal(s) and metalloid(s) are applied by sputtering.
16. A device provided with a solderable adhesive layer as claimed in any one of claims 1 to 11.
17. A device provided with a solderable adhesive layer which device is substantially as described herein with reference to Figure 1, Figure 2 or Figure 3 of the drawings.
Printed in the UK for HMSO, D8818935, 1 V84,7102. Published by The Patent Office, 25 Southampton Buildings, London, WC2A IlAY, from which copies may be obtained.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833323196 DE3323196A1 (en) | 1983-06-28 | 1983-06-28 | Solderable adhesive layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8416310D0 GB8416310D0 (en) | 1984-08-01 |
| GB2142567A true GB2142567A (en) | 1985-01-23 |
| GB2142567B GB2142567B (en) | 1986-12-31 |
Family
ID=6202556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08416310A Expired GB2142567B (en) | 1983-06-28 | 1984-06-27 | Solderable adhesive layer |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4659378A (en) |
| JP (1) | JPS6013044A (en) |
| DE (1) | DE3323196A1 (en) |
| FR (1) | FR2548451B1 (en) |
| GB (1) | GB2142567B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2167087A (en) * | 1984-11-12 | 1986-05-21 | Alps Electric Co Ltd | Amorphous magnetic alloys |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4916529A (en) * | 1986-11-14 | 1990-04-10 | Canon Kabushiki Kaisha | Imaging device utilizing solid-state image sensors combined with a beam-splitting prism |
| US5042913A (en) * | 1989-03-17 | 1991-08-27 | Canon Kabushiki Kaisha | Electrical signal forming apparatus having image splitting prism |
| US5178319A (en) * | 1991-04-02 | 1993-01-12 | At&T Bell Laboratories | Compression bonding methods |
| DE102006041940A1 (en) * | 2006-09-07 | 2008-03-27 | Biotronik Crm Patent Ag | Electrical implementation |
| DE102008004308A1 (en) * | 2008-01-15 | 2009-07-16 | Biotronik Crm Patent Ag | Implementation for a battery, method of making the same and battery |
| US9217190B2 (en) | 2011-09-01 | 2015-12-22 | Stuller, Inc. | Sterling silver alloy and articles made from same |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB487263A (en) * | 1937-02-12 | 1938-06-17 | Patent Treuhand Ges Fure Elek | Improvements in solders for uniting the metallic parts of vacuum devices |
| GB985281A (en) * | 1960-03-18 | 1965-03-03 | Texas Instruments Inc | Composite products for soldering and the like and method of their manufacture |
| GB1145978A (en) * | 1965-04-05 | 1969-03-19 | Eastman Kodak Co | Method and apparatus for splicing strip material |
| GB1515748A (en) * | 1974-08-08 | 1978-06-28 | Westinghouse Electric Corp | Silicon semiconductor device with stress-free electrodes |
| GB1547117A (en) * | 1977-10-26 | 1979-06-06 | Alloy Metals Inc | Nickel base brazing alloy |
| GB1547761A (en) * | 1975-04-09 | 1979-06-27 | Davy Loewy Ltd | Continous casting mould |
| GB1556627A (en) * | 1976-12-15 | 1979-11-28 | Allied Chem | Brazing process and ductile brazing foils |
| GB1558151A (en) * | 1976-03-01 | 1979-12-19 | Allied Chem | Magnetic glassy metal appoys |
| EP0011703A1 (en) * | 1978-11-08 | 1980-06-11 | Allied Corporation | Magnetic composite structure and method for making said structure |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB941880A (en) * | 1960-08-29 | 1963-11-13 | Gen Electric Co Ltd | Improvements in or relating to alloying processes for forming junctions in silicon carbide bodies |
| GB1145948A (en) * | 1967-10-25 | 1969-03-19 | Coast Metals Inc | Cobalt-base alloys |
| AT313979B (en) * | 1968-09-20 | 1974-03-11 | Egyesuelt Izzolampa | Coating for resistance welding of the housing of semiconductor components |
| US3857683A (en) * | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
| US4052201A (en) * | 1975-06-26 | 1977-10-04 | Allied Chemical Corporation | Amorphous alloys with improved resistance to embrittlement upon heat treatment |
| US4059217A (en) * | 1975-12-30 | 1977-11-22 | Rohr Industries, Incorporated | Superalloy liquid interface diffusion bonding |
| US4221592A (en) * | 1977-09-02 | 1980-09-09 | Allied Chemical Corporation | Glassy alloys which include iron group elements and boron |
| US4236946A (en) * | 1978-03-13 | 1980-12-02 | International Business Machines Corporation | Amorphous magnetic thin films with highly stable easy axis |
| JPS5779052A (en) * | 1980-10-16 | 1982-05-18 | Takeshi Masumoto | Production of amorphous metallic filament |
-
1983
- 1983-06-28 DE DE19833323196 patent/DE3323196A1/en not_active Withdrawn
-
1984
- 1984-06-22 FR FR8409900A patent/FR2548451B1/en not_active Expired
- 1984-06-22 US US06/623,757 patent/US4659378A/en not_active Expired - Fee Related
- 1984-06-26 JP JP59130196A patent/JPS6013044A/en active Pending
- 1984-06-27 GB GB08416310A patent/GB2142567B/en not_active Expired
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB487263A (en) * | 1937-02-12 | 1938-06-17 | Patent Treuhand Ges Fure Elek | Improvements in solders for uniting the metallic parts of vacuum devices |
| GB985281A (en) * | 1960-03-18 | 1965-03-03 | Texas Instruments Inc | Composite products for soldering and the like and method of their manufacture |
| GB1145978A (en) * | 1965-04-05 | 1969-03-19 | Eastman Kodak Co | Method and apparatus for splicing strip material |
| GB1515748A (en) * | 1974-08-08 | 1978-06-28 | Westinghouse Electric Corp | Silicon semiconductor device with stress-free electrodes |
| GB1547761A (en) * | 1975-04-09 | 1979-06-27 | Davy Loewy Ltd | Continous casting mould |
| GB1558151A (en) * | 1976-03-01 | 1979-12-19 | Allied Chem | Magnetic glassy metal appoys |
| GB1556627A (en) * | 1976-12-15 | 1979-11-28 | Allied Chem | Brazing process and ductile brazing foils |
| GB1547117A (en) * | 1977-10-26 | 1979-06-06 | Alloy Metals Inc | Nickel base brazing alloy |
| EP0011703A1 (en) * | 1978-11-08 | 1980-06-11 | Allied Corporation | Magnetic composite structure and method for making said structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2167087A (en) * | 1984-11-12 | 1986-05-21 | Alps Electric Co Ltd | Amorphous magnetic alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2142567B (en) | 1986-12-31 |
| US4659378A (en) | 1987-04-21 |
| GB8416310D0 (en) | 1984-08-01 |
| FR2548451A1 (en) | 1985-01-04 |
| JPS6013044A (en) | 1985-01-23 |
| FR2548451B1 (en) | 1986-07-18 |
| DE3323196A1 (en) | 1985-01-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |