JPS63122155A - Connecting bump of semiconductor chip - Google Patents

Connecting bump of semiconductor chip

Info

Publication number
JPS63122155A
JPS63122155A JP61267992A JP26799286A JPS63122155A JP S63122155 A JPS63122155 A JP S63122155A JP 61267992 A JP61267992 A JP 61267992A JP 26799286 A JP26799286 A JP 26799286A JP S63122155 A JPS63122155 A JP S63122155A
Authority
JP
Japan
Prior art keywords
formed
electrode
method
semiconductor chip
composed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61267992A
Inventor
Yoshihiro Bessho
Yasuhiko Horio
Hisako Mori
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP61267992A priority Critical patent/JPS63122155A/en
Publication of JPS63122155A publication Critical patent/JPS63122155A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Abstract

PURPOSE: To electrically connect a fine clear electrode formed on a glass substrate to a connecting bump of a semiconductor chip with high reliability by a method wherein the protruding electrode composed of a specific alloy is constructed on an Al pad of the semiconductor chip via an intermediate metal layer.
CONSTITUTION: An Al electrode is formed on a silicon substrate 1 ; a surface- protecting film 3 composed of SiO2 or the like is then formed. An intermediate metal layer 4, which is composed of a barrier layer of Cr, Ti or the like for the Al electrode and of a bonding-strength reinforced layer of Cu, Au or the like, is formed on said Al electrode. These metal layers are formed by, an evaporation method or a nonelectrolytic plating method. Then, a connecting bump 5, whose base material is In-Sn and where the concentration of an element to be added such as Zn, Sb, Al, Ti, Cu or the like is within 10 wt.%, is formed, in the same manner, by the evaporation method, a dip method or a thermal transfer method of a sheet of an alloy foil.
COPYRIGHT: (C)1988,JPO&Japio
JP61267992A 1986-11-11 1986-11-11 Connecting bump of semiconductor chip Pending JPS63122155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61267992A JPS63122155A (en) 1986-11-11 1986-11-11 Connecting bump of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61267992A JPS63122155A (en) 1986-11-11 1986-11-11 Connecting bump of semiconductor chip

Publications (1)

Publication Number Publication Date
JPS63122155A true JPS63122155A (en) 1988-05-26

Family

ID=17452405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61267992A Pending JPS63122155A (en) 1986-11-11 1986-11-11 Connecting bump of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS63122155A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0388011A2 (en) * 1989-03-14 1990-09-19 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor device.
EP0887851A3 (en) * 1997-06-23 1999-08-18 Ford Motor Company Method of forming interconnections on electronic modules
US6097314A (en) * 1997-01-31 2000-08-01 Daimlerchrysler Ag Process and apparatus for assisting in the parking of a motor vehicle
JP2003529493A (en) * 2000-03-31 2003-10-07 アンテリテック(インテリジェント・テクノロジーズ) Methods and devices for managing the slot parking of a motor driven vehicle
JP2007505298A (en) * 2003-09-12 2007-03-08 バレオ・シャルター・ウント・ゼンゾーレン・ゲーエムベーハー Method and computer program for detecting the contour of the obstacle in the surroundings of the vehicle
US8130120B2 (en) 2007-02-27 2012-03-06 Toyota Jidosha Kabushiki Kaisha Parking assistance device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761285A (en) * 1980-08-01 1982-04-13 Lohja Ab Oy Method of rorming electrically conductive buried member in thin film
JPS58141540A (en) * 1982-02-17 1983-08-22 Sharp Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761285A (en) * 1980-08-01 1982-04-13 Lohja Ab Oy Method of rorming electrically conductive buried member in thin film
JPS58141540A (en) * 1982-02-17 1983-08-22 Sharp Corp Semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0388011A2 (en) * 1989-03-14 1990-09-19 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor device.
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
US6097314A (en) * 1997-01-31 2000-08-01 Daimlerchrysler Ag Process and apparatus for assisting in the parking of a motor vehicle
EP0887851A3 (en) * 1997-06-23 1999-08-18 Ford Motor Company Method of forming interconnections on electronic modules
US6082610A (en) * 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
US6250541B1 (en) 1997-06-23 2001-06-26 Visteon Global Technologies, Inc. Method of forming interconnections on electronic modules
JP2003529493A (en) * 2000-03-31 2003-10-07 アンテリテック(インテリジェント・テクノロジーズ) Methods and devices for managing the slot parking of a motor driven vehicle
JP2007505298A (en) * 2003-09-12 2007-03-08 バレオ・シャルター・ウント・ゼンゾーレン・ゲーエムベーハー Method and computer program for detecting the contour of the obstacle in the surroundings of the vehicle
JP4927541B2 (en) * 2003-09-12 2012-05-09 バレオ・シャルター・ウント・ゼンゾーレン・ゲーエムベーハー Method and computer program for detecting the contour of the obstacle in the surroundings of the vehicle
US8130120B2 (en) 2007-02-27 2012-03-06 Toyota Jidosha Kabushiki Kaisha Parking assistance device

Similar Documents

Publication Publication Date Title
EP0061593B1 (en) Solder support pad for semiconductor devices
US4875617A (en) Gold-tin eutectic lead bonding method and structure
JPS62216352A (en) Manufacture of semiconductor device
JPS6066843A (en) Integrated circuit package
JPS6410648A (en) Method of multilayer metallization for integrated circuit
JPH03166739A (en) Soldering method
JPS60257160A (en) Semiconductor device
JPH03101242A (en) Flip chip soldering structure
JPS59155950A (en) Low melting-point glass seal type ceramic package for semiconductor device
JPH02187042A (en) Manufacture of semiconductor device
JPH01209746A (en) Semiconductor device
JPS59193036A (en) Semiconductor device
JPS614250A (en) Package for semiconductor device
JPS58169942A (en) Semiconductor device
JPS5586130A (en) Connection of semiconductor element
JPH02310956A (en) High-density mounting semiconductor package
JPS59210656A (en) Semiconductor device
JPH03185741A (en) Semiconductor device and manufacture thereof
JPH01245585A (en) Semiconductor laser device
JPH046841A (en) Mounting structure of semiconductor device
JPS57106057A (en) Bump structure of ic
JPS62229848A (en) Semiconductor device
JPH0193149A (en) Semiconductor device
JPH0262035A (en) Semiconductor device
JPS57197838A (en) Semiconductor flip chip element