GB2141140B - Electrodeposition of copper - Google Patents

Electrodeposition of copper

Info

Publication number
GB2141140B
GB2141140B GB08414862A GB8414862A GB2141140B GB 2141140 B GB2141140 B GB 2141140B GB 08414862 A GB08414862 A GB 08414862A GB 8414862 A GB8414862 A GB 8414862A GB 2141140 B GB2141140 B GB 2141140B
Authority
GB
United Kingdom
Prior art keywords
electrodeposition
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08414862A
Other languages
English (en)
Other versions
GB8414862D0 (en
GB2141140A (en
Inventor
Daniel J Combs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of GB8414862D0 publication Critical patent/GB8414862D0/en
Publication of GB2141140A publication Critical patent/GB2141140A/en
Application granted granted Critical
Publication of GB2141140B publication Critical patent/GB2141140B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemically Coating (AREA)
GB08414862A 1983-06-10 1984-06-11 Electrodeposition of copper Expired GB2141140B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50121183A 1983-06-10 1983-06-10

Publications (3)

Publication Number Publication Date
GB8414862D0 GB8414862D0 (en) 1984-07-18
GB2141140A GB2141140A (en) 1984-12-12
GB2141140B true GB2141140B (en) 1986-12-10

Family

ID=23992559

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08414862A Expired GB2141140B (en) 1983-06-10 1984-06-11 Electrodeposition of copper

Country Status (10)

Country Link
JP (1) JPS6013090A (enrdf_load_stackoverflow)
AU (1) AU554236B2 (enrdf_load_stackoverflow)
BR (1) BR8402811A (enrdf_load_stackoverflow)
CA (1) CA1255621A (enrdf_load_stackoverflow)
DE (1) DE3420999A1 (enrdf_load_stackoverflow)
ES (1) ES8601336A1 (enrdf_load_stackoverflow)
FR (1) FR2547318B1 (enrdf_load_stackoverflow)
GB (1) GB2141140B (enrdf_load_stackoverflow)
IT (1) IT1177785B (enrdf_load_stackoverflow)
NL (1) NL8401841A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126502C1 (enrdf_load_stackoverflow) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
RU2215829C1 (ru) * 2002-02-21 2003-11-10 Калининградский государственный университет Электролит блестящего меднения
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL174178B (nl) * 1952-05-26 Chevron Res Werkwijze voor het winnen van koolwaterstoffen uit een permeabele koolwaterstofhoudende formatie door injectie met stoom.
NL178453B (nl) * 1952-05-26 Mita Industrial Co Ltd Werkwijze voor het elektrostatisch copieren.
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (enrdf_load_stackoverflow) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
SE444822B (sv) * 1975-03-11 1986-05-12 Oxy Metal Industries Corp Bad och medel for elektrolytisk utfellning av koppar
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
JPS6112036B2 (enrdf_load_stackoverflow) 1986-04-05
IT8448351A0 (it) 1984-06-08
GB8414862D0 (en) 1984-07-18
BR8402811A (pt) 1985-05-21
NL8401841A (nl) 1985-01-02
JPS6013090A (ja) 1985-01-23
ES533252A0 (es) 1985-10-16
AU554236B2 (en) 1986-08-14
DE3420999C2 (enrdf_load_stackoverflow) 1987-10-15
DE3420999A1 (de) 1984-12-13
FR2547318A1 (fr) 1984-12-14
FR2547318B1 (fr) 1990-05-04
ES8601336A1 (es) 1985-10-16
CA1255621A (en) 1989-06-13
AU2903384A (en) 1984-12-13
GB2141140A (en) 1984-12-12
IT1177785B (it) 1987-08-26

Similar Documents

Publication Publication Date Title
HK66586A (en) Electrodeposition of copper
GB2097020B (en) Electrodeposition of bright copper
GB8513501D0 (en) Copper electroplating
EP0137981A3 (en) Through-hole plating
GB8531356D0 (en) Copper plating
GB8426184D0 (en) Electrodeposition of mica on coil
GB8402208D0 (en) Positioning of equipment
GB8334226D0 (en) Electrodeposition of gold alloys
GB8422528D0 (en) Continuous electroplating of alloys
GB8313861D0 (en) Codeposition of dissolved metal
GB2141140B (en) Electrodeposition of copper
GB8303264D0 (en) Electrodeposition of polyesters
DE3473303D1 (en) Electrolytic copper plating
GB2150145B (en) Electrodeposition of mica
GB8517612D0 (en) Electrodeposition of metals
GB2141141B (en) Electrodepositing copper
GB8529856D0 (en) Cyanide-free copper plating process
GB8414871D0 (en) Gold plating baths
DE3377068D1 (en) Method of electroplating
GB8326110D0 (en) Electrolytic refining of copper
ZA834937B (en) Edtp-containing electroless copper baths
GB8320821D0 (en) Plating
GB8423805D0 (en) Pretreatment of ores
GB8432395D0 (en) Copper plating
GB8432400D0 (en) Copper plating

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee