GB2130383B - Test board for semiconductor packages - Google Patents
Test board for semiconductor packagesInfo
- Publication number
- GB2130383B GB2130383B GB08322587A GB8322587A GB2130383B GB 2130383 B GB2130383 B GB 2130383B GB 08322587 A GB08322587 A GB 08322587A GB 8322587 A GB8322587 A GB 8322587A GB 2130383 B GB2130383 B GB 2130383B
- Authority
- GB
- United Kingdom
- Prior art keywords
- test board
- semiconductor packages
- packages
- semiconductor
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14093282U JPS5942982U (en) | 1982-09-14 | 1982-09-14 | Semiconductor package test substrate |
JP14554782U JPS5949976U (en) | 1982-09-24 | 1982-09-24 | Semiconductor test board |
JP14928282U JPS5952485U (en) | 1982-09-29 | 1982-09-29 | Semiconductor test board |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8322587D0 GB8322587D0 (en) | 1983-09-28 |
GB2130383A GB2130383A (en) | 1984-05-31 |
GB2130383B true GB2130383B (en) | 1986-06-04 |
Family
ID=27318156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08322587A Expired GB2130383B (en) | 1982-09-14 | 1983-08-23 | Test board for semiconductor packages |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2130383B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4760335A (en) * | 1985-07-30 | 1988-07-26 | Westinghouse Electric Corp. | Large scale integrated circuit test system |
JPH0752664B2 (en) * | 1992-12-28 | 1995-06-05 | 山一電機株式会社 | IC socket |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3319166A (en) * | 1964-07-21 | 1967-05-09 | Westinghouse Electric Corp | Fixture for securing and electrically testing an electronic component in flat package with coplanar leads |
GB1299241A (en) * | 1969-02-28 | 1972-12-13 | Licentia Gmbh | Contact device for enabling the dynamic measurement of semiconductor parameters |
GB1284742A (en) * | 1969-03-21 | 1972-08-09 | Lucas Industries Ltd | Transporting and testing device for use with semi-conductor wafers |
GB1521614A (en) * | 1977-02-17 | 1978-08-16 | Int Computers Ltd | Apparatus for testing circuit elements |
US4329642A (en) * | 1979-03-09 | 1982-05-11 | Siliconix, Incorporated | Carrier and test socket for leadless integrated circuit |
GB2070256B (en) * | 1980-02-22 | 1983-09-21 | Marconi Co Ltd | Fault finding in electronic circuits |
GB2104669A (en) * | 1981-08-06 | 1983-03-09 | Int Computers Ltd | Apparatus for testing electronic devices |
-
1983
- 1983-08-23 GB GB08322587A patent/GB2130383B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2130383A (en) | 1984-05-31 |
GB8322587D0 (en) | 1983-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |