GB1284742A - Transporting and testing device for use with semi-conductor wafers - Google Patents

Transporting and testing device for use with semi-conductor wafers

Info

Publication number
GB1284742A
GB1284742A GB1486669A GB1486669A GB1284742A GB 1284742 A GB1284742 A GB 1284742A GB 1486669 A GB1486669 A GB 1486669A GB 1486669 A GB1486669 A GB 1486669A GB 1284742 A GB1284742 A GB 1284742A
Authority
GB
United Kingdom
Prior art keywords
semi
box
wafers
transporting
testing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1486669A
Inventor
George Coffin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB1486669A priority Critical patent/GB1284742A/en
Priority to DE19702007322 priority patent/DE2007322A1/en
Priority to FR7007662A priority patent/FR2037235B1/fr
Priority to JP2272570A priority patent/JPS4840813B1/ja
Publication of GB1284742A publication Critical patent/GB1284742A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

1284742 Temporary-contact devices JOSEPH LUCAS (INDUSTRIES) Ltd 16 Jan 1970 [21 March 1969] 14866/69 Heading H2E [Also in Divisions B8 and H1] A device for use in testing semi-conductor wafers, e.g. diodes, comprises an open-topped box, which is moulded of ABS with a plurality of integral partition walls 12 subdividing the box into a plurality of wafer-receiving compartments and which is nickel-plated so that each wafer rests on a conductive surface. The wafers may be tested simultaneously or individually using probe testers, and the box closed by a sliding lid 14.
GB1486669A 1969-03-21 1969-03-21 Transporting and testing device for use with semi-conductor wafers Expired GB1284742A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB1486669A GB1284742A (en) 1969-03-21 1969-03-21 Transporting and testing device for use with semi-conductor wafers
DE19702007322 DE2007322A1 (en) 1969-03-21 1970-02-18 Transport and testing device for semiconductor wafers
FR7007662A FR2037235B1 (en) 1969-03-21 1970-03-03
JP2272570A JPS4840813B1 (en) 1969-03-21 1970-03-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1486669A GB1284742A (en) 1969-03-21 1969-03-21 Transporting and testing device for use with semi-conductor wafers

Publications (1)

Publication Number Publication Date
GB1284742A true GB1284742A (en) 1972-08-09

Family

ID=10048890

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1486669A Expired GB1284742A (en) 1969-03-21 1969-03-21 Transporting and testing device for use with semi-conductor wafers

Country Status (4)

Country Link
JP (1) JPS4840813B1 (en)
DE (1) DE2007322A1 (en)
FR (1) FR2037235B1 (en)
GB (1) GB1284742A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2130383A (en) * 1982-09-14 1984-05-31 Risho Kogyo Kk Test board for semiconductor packages

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2562372B1 (en) * 1984-04-03 1986-08-08 Ramy Jean Pierre MICRO COMPONENT TRANSPORT STORAGE RECEPTACLE

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2130383A (en) * 1982-09-14 1984-05-31 Risho Kogyo Kk Test board for semiconductor packages

Also Published As

Publication number Publication date
JPS4840813B1 (en) 1973-12-03
FR2037235B1 (en) 1975-12-26
FR2037235A1 (en) 1970-12-31
DE2007322A1 (en) 1970-10-08

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee