DE2007322A1 - Transport and testing device for semiconductor wafers - Google Patents
Transport and testing device for semiconductor wafersInfo
- Publication number
- DE2007322A1 DE2007322A1 DE19702007322 DE2007322A DE2007322A1 DE 2007322 A1 DE2007322 A1 DE 2007322A1 DE 19702007322 DE19702007322 DE 19702007322 DE 2007322 A DE2007322 A DE 2007322A DE 2007322 A1 DE2007322 A1 DE 2007322A1
- Authority
- DE
- Germany
- Prior art keywords
- box
- transport
- testing device
- semiconductor
- semiconductor wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Die Erfindung betrifft eine Transportier- und Prüfeinrichtung für HaIbleiter-Plättohen. Dtr Begriff "Halbleiter-Plättohen" kennzeichnet kier la wesentlichen jedes Plättchen aus einem Halbleiterwerkstoff, bei dem es sich um einen getrennten Teil oder einer Anzahl von Teilen oder um eine komplexe Sohaltung handeln kann, gleichgültig ob die Fertigungsrerfahren beendet worden sind oder nicht, denen das Plättchen unteraogen wird.The invention relates to a transporting and testing device for semiconductor plates. The term "semiconductor plates" identifies la essentially every plate made of a semiconductor material in which it is a separate part, or a number of parts, or a complex attitude can act, regardless of whether the manufacturing process finished or not to which the platelet was subjected will.
liu linriohtung gemäfi der Erfindung besteht aus einem aus Kunststoff geformten Kasten mit offener Oberseite und mit dem Kasten in einer YIeX-saal Ton Täohera unterteilenden Trennwänden, wobei die !fächer jeweils sä* Aufnahme eines Halbleiter-Plättchens Torgesehen sind und der lasten mit einem Beokel Tersehea ist und so beschichtet ist, daß mindestens derLiu linriohtung according to the invention consists of a plastic shaped box with open top and with the box in a YIeX hall Clay Täohera dividing walls, with the! Compartments respectively sä * recording of a semiconductor wafer are seen and the loads with a Beokel Tersehea and is coated so that at least the
009841/1088 - 2 -009841/1088 - 2 -
Boden des jeweiligen Faoh leitend iat, derart, dafl daa Plättohen im jeweiligen ?aoh geprüft werden kann.The soil of the respective Faoh is conductive in such a way that the plates are in the respective? aoh can be checked.
Sie lrfindung ist im nachfolgenden anhand einee Ausführungsbeispiels unter Bezugnahme auf die Zeichnung näher erläutert. In der Zeichnung sind ιThe invention is based on an exemplary embodiment below explained in more detail with reference to the drawing. In the drawing are ι
Tig. 1 eine Draufsicht auf eine Xinriohtung gemäfi der Erfindung und Fig. 2 ein Schnitt an der Linie A-A der Fig. 1.Tig. 1 shows a plan view of a device according to the invention and FIG. 2 is a section on line A-A of FIG. 1.
Die linriohtung besteht aue einem Kasten 11 mit offener Oberseite» der au* A, B, S geformt ist und eine Vielzahl einstückig angeformter Trennwände 12 aufweist» die im reohten Winkel zueinander stehen und den Kasten in eine große Anzahl getrennter Fäoher 13 unterteilen. Bas jeweilige Faoh ist zur Aufnahme eines Halbleiter-Plattchens vorgesehen, bei dem es sioh beispielsweise um eine Diode handeln kann. Der Kasten ist vernickelt, derart, daß die jeweilige Diode in ihrem Faoh 1} auf leitendem Material liegt und unter Verwendung einer normalen Prüfsonde geprüft werden kann. Im Kasten ist ein Deokel 14 zugeordnet, der zweokmaßigerweise im Gleit-SIIFZ auf dem Kasten sitzt, so daß während der Herstellung die Dioden in ihre Fäoher 13 gelegt werden können und dann innerhalb des Kastens entweder gleichzeitig unter Verwendung eines Hehrfaohprüfgeräte oder nacheinander unter Verwendung einer Prüfrorrlohtung geprüft werden können, die automatisch die Teile nacheinander prüft. Babei eind die Abmessungen der Fäoher 13 eo gewählt, daß der Abstand der Teile ein Arbeiten mit einer solchen Prüfvorrichtung geetattet. Als Beschichtungswerkstoff wird ' liokel bevorzugt. Naohdem eine Prüfung erfolgt ist« kann der Deokel 14 auf den Kasten 11 aufgeschoben werden, und danaoh können die Teile transportiert werden. The line direction consists of a box 11 with an open top au * A, B, S is shaped and a large number of integrally molded partitions 12 has »which are at a right angle to each other and the box divide into a large number of separate skippers 13. Bas respective Faoh is intended to hold a semiconductor plate, in which it sioh can for example be a diode. The box is nickel-plated in such a way that the respective diode in its Faoh 1} is on conductive material and can be tested using a normal test probe. A deodorant 14 is assigned in the box, the two-dimensional SIIFZ sits on the box so that during manufacture the diodes can be placed in their Fäoher 13 and then inside the box either simultaneously using a Hehrfaohprüfgerät or can be tested one after the other using a test tube, which automatically checks the parts one after the other. Here and the dimensions der Fäoher 13 eo chosen that the spacing of the parts works with such a test device geetatte. Oil is preferred as the coating material. After an examination has been carried out, the Deokel 14 can be pushed onto the box 11, and then the parts can be transported.
009841/1088009841/1088
Claims (1)
Wa/Se 024
Wa / Se
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1486669A GB1284742A (en) | 1969-03-21 | 1969-03-21 | Transporting and testing device for use with semi-conductor wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2007322A1 true DE2007322A1 (en) | 1970-10-08 |
Family
ID=10048890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19702007322 Pending DE2007322A1 (en) | 1969-03-21 | 1970-02-18 | Transport and testing device for semiconductor wafers |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS4840813B1 (en) |
DE (1) | DE2007322A1 (en) |
FR (1) | FR2037235B1 (en) |
GB (1) | GB1284742A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2130383B (en) * | 1982-09-14 | 1986-06-04 | Risho Kogyo Kk | Test board for semiconductor packages |
FR2562372B1 (en) * | 1984-04-03 | 1986-08-08 | Ramy Jean Pierre | MICRO COMPONENT TRANSPORT STORAGE RECEPTACLE |
-
1969
- 1969-03-21 GB GB1486669A patent/GB1284742A/en not_active Expired
-
1970
- 1970-02-18 DE DE19702007322 patent/DE2007322A1/en active Pending
- 1970-03-03 FR FR7007662A patent/FR2037235B1/fr not_active Expired
- 1970-03-19 JP JP2272570A patent/JPS4840813B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1284742A (en) | 1972-08-09 |
FR2037235B1 (en) | 1975-12-26 |
FR2037235A1 (en) | 1970-12-31 |
JPS4840813B1 (en) | 1973-12-03 |
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