GB1299241A - Contact device for enabling the dynamic measurement of semiconductor parameters - Google Patents

Contact device for enabling the dynamic measurement of semiconductor parameters

Info

Publication number
GB1299241A
GB1299241A GB787170A GB787170A GB1299241A GB 1299241 A GB1299241 A GB 1299241A GB 787170 A GB787170 A GB 787170A GB 787170 A GB787170 A GB 787170A GB 1299241 A GB1299241 A GB 1299241A
Authority
GB
United Kingdom
Prior art keywords
substrate
feb
enabling
contact device
dynamic measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB787170A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691910314 external-priority patent/DE1910314C3/en
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of GB1299241A publication Critical patent/GB1299241A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

1299241 Probes LICENTIA PATENT VERWALTUNGS GmbH 18 Feb 1970 [28 Feb 1969] 7871/70 Heading H2E Part of a testing device for semi-conductors 6 comprises a circular resessed substrate 1 made of quartz or ceramic and flat inwardly directed electrical contacts 2, secured to the substrate by soldering and having contact portions, which may include anti-abrasion coatings 5, e.g. tungsten carbide, at the free ends. The contacts may be formed from a self-supporting metallic foil, using photo mask etching techniques, and having the abrasion resistant rating vapourdeposited thereon. Alternatively a temporary substrate may be used and the metal foil applied thereto by spluttering or vapour-deposition.
GB787170A 1969-02-28 1970-02-18 Contact device for enabling the dynamic measurement of semiconductor parameters Expired GB1299241A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691910314 DE1910314C3 (en) 1969-02-28 Contact device for a measuring arrangement for the dynamic measurement of semiconductor parameters

Publications (1)

Publication Number Publication Date
GB1299241A true GB1299241A (en) 1972-12-13

Family

ID=5726726

Family Applications (1)

Application Number Title Priority Date Filing Date
GB787170A Expired GB1299241A (en) 1969-02-28 1970-02-18 Contact device for enabling the dynamic measurement of semiconductor parameters

Country Status (2)

Country Link
FR (1) FR2063832A5 (en)
GB (1) GB1299241A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2130383A (en) * 1982-09-14 1984-05-31 Risho Kogyo Kk Test board for semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2130383A (en) * 1982-09-14 1984-05-31 Risho Kogyo Kk Test board for semiconductor packages

Also Published As

Publication number Publication date
DE1910314A1 (en) 1970-10-08
FR2063832A5 (en) 1971-07-09
DE1910314B2 (en) 1977-03-17

Similar Documents

Publication Publication Date Title
GB1082319A (en) Integrated circuit devices and methods of making them
GB958241A (en) Semi-conductor structure fabrication
JPS5237721A (en) Semiconductor integrated circuit
US3568124A (en) Piezoresistive force- and pressure-measuring element
DK156270C (en) PROCEDURE FOR THE PREPARATION OF A VACUUM BATTLED SOCKET ASSEMBLY BETWEEN A METALLIZED CERAMIC PART AND AN ANGLED METAL PART OF AN IRON ALLOY
GB1299241A (en) Contact device for enabling the dynamic measurement of semiconductor parameters
JPS52120782A (en) Manufacture of semiconductor device
GB1234858A (en) Terminal construction for electrical circuit element
JPS56148848A (en) Beam lead type semiconductor device
JPS5445570A (en) Manufacture for semiconductor element
JPS5412263A (en) Semiconductor element and production of the same
JPS6472079A (en) Electrical characteristic measuring instrument
JPS56148846A (en) Manufacture of circuit pattern
JPS5232275A (en) Wafer inspector
JPS5745965A (en) Semiconductor element connecting substrate
JPS57132332A (en) Semiconductor device
JPS5264274A (en) Wafer soldering device for semiconductor devices
Dejong Some Notes on the Influence of Residual Stresses on Stress Corrosion Crack Growth and Compliance Measurements of a Sensitized 7075 Alloy
JPS5558540A (en) Manufacture of semiconductor device
JPS6445039A (en) Manufacture of electron tube cathode device
JPS55160452A (en) Hybrid integrated circuit
JPS527719A (en) Photoresist
JPS5414159A (en) Manufacture for semiconductor device
JPS56162854A (en) Semiconductor integrated circuit device
JPS5565439A (en) Manufacture of semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees