GB2125211A - Mechanical support of piezoelectric devices - Google Patents

Mechanical support of piezoelectric devices Download PDF

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Publication number
GB2125211A
GB2125211A GB08222375A GB8222375A GB2125211A GB 2125211 A GB2125211 A GB 2125211A GB 08222375 A GB08222375 A GB 08222375A GB 8222375 A GB8222375 A GB 8222375A GB 2125211 A GB2125211 A GB 2125211A
Authority
GB
United Kingdom
Prior art keywords
piezoelectric
support
quartz
mechanical support
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08222375A
Inventor
Douglas Frank George Dwyer
Edward George Tuckett
Ann Muriel Harrison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB08222375A priority Critical patent/GB2125211A/en
Publication of GB2125211A publication Critical patent/GB2125211A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/058Holders; Supports for surface acoustic wave devices
    • H03H9/059Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/058Holders; Supports for surface acoustic wave devices
    • H03H9/0585Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

A method of mounting a piezoelectric device, such as a surface acoustic wave filter or a crystal resonator, in which the piezoelectric device 1 is mounted on an intermediate support structure 4 of material having the same or similar temperature dependent characteristics as the piezoelectric device and having the same crystallographic orientation, the intermediate support structure being mounted in turn on a mechanical support 5, whereby stress due to differential expansion may be reduced. <IMAGE>

Description

SPECIFICATION Mechanical support of piezoelectric devices This invention relates to a method for mechanically supporting piezoelectric devices such as surface acoustic wave (SAW) filters, crystal resonators and the like.
The performance of piezoelectric devices can suffer modification due to stress from the support structure. Though this stress may be minimised at a given temperature, differential expansion between the support structure and the device over an operating temperature range can modify the device characteristics.
Various attempts have been made in the past to negate or eliminate the effects of differential expansion. For example it is known to mount a piezoelectric device such as a resonator in specially designed spring strips (British patent 1,459,609). Yet another proposed solution is to mount a piezoelectric device on a semiconductor device having a voltage or current dependent heat balance, whereby the temperature of the piezoelectric device is kept constant (British patent 1,435,655).
According to the present invention there is provided a method of mounting a piezoelectric device comprising inserting between the device and its mechanical support structure an intermediate support structure of material having the same or similar temperature dependent characteristics and crystal orientation as the piezoelectric device whereby differential expansion effects on the device are minimised and stress from the mechanical support structure is reduced.
Embodiments of the invention are now described with reference to the accompanying drawings, in which: Fig. 1 illustrates a mounting arrangement for a SAW resonator device, and Fig. 2 illustrates a mounting arrangement for a crystal resonator device.
In the arrangement shown in Fig. 1 a surface acoustic wave filter device comprises a rectangular body of quartz 11 provided on its upper surface at each end with an interdigitated electro-acoustic transducer 1 2, 1 3. The body 1 is adhesively bonded, e.g. by a layer of epoxy or polyimide resin to an intermediate, larger supporting body 14 of similar material, e.g. quartz, having the same crystal orientation as the filter body 1 The intermediate body 14 is in turn affixed to a mechanical support structure, e.g. a conventional header 1 5, which is provided with lead-through terminals 1 6. The transducers 1 2, 13 are connected to the terminals 16 by bonded wires 1 7.
In the arrangement shown in Fig. 2 a quartz crystal resonator slice 21 is provided on opposite faces with metallic electrodes patterns 22, 23.
The slice 21 is supported on two pellets of conductive paste 24, 25. Pellet 24 makes direct contact with electrode pattern 22, whilst pellet 25 is formed around and over the edge of the slice to make contact with the electrode pattern 23. The pellets are supported on metallic conductors 26, 27 deposited on a rectangular body 28 of quartz having the same crystallographic orientation as the slice 21. The quartz body is then affixed to a suitable mechanical support (not shown). The pellets of conductive paste allow a clearance gap between the main resonating portion of the crystal and the intermediate support.
Although only two specific examples have been given it is apparent that the invention is applicable to any piezoelectric structure including bulk crystal resonators, multipole filters, SAW transversal filters, SAW delay lines etc. The invention is also applicable to any piezoelectric material, of which quartz and lithium niobate are the most commonly used examples. In some cases it may be that the centre of the device is supported on a compressed pellet of paste and electrical connections are made by bonded wires. Because of reduced mounting strain, the use of a supporting substrate of the same material as the electronics device provides improved long term drift, temperature stability, acceleration and vibration performance, and very often simplifies the mounting of complex devices.
1. A method of mounting a piezoelectric device comprising inserting between the device and its mechanical support structure and intermediate support structure of material having the same or similar temperature dependent characteristics and crystal orientation as the piezoelectric device whereby differential expansion effects on the device are minimised and stress from the mechanical support structure is reduced.
2. A method according to claim 1 wherein the device is adhesively bonded to the intermediate support structure.
3. A method according to claim 1 wherein the device is affixed to the intermediate support structure by pellets of conductive paste making electrical connections between electrodes on the device and conductors on the intermediate support.
4. A method according to any preceding claim wherein the device and the intermediate support are both made of quartz or lithium niobate.
5. A method of mounting a piezoelectric device substantially as described with reference to Fig. 1 or Fig. 2 of the accompanying drawings.
6. A piezoelectric device mounted on an intermediate support structure which is in turn mounted on a mechanical support structure, said intermediate support structure being made of the same or similar material I' as the piezoelectric device and having the same crystaliographic orientation as the piezoelectric device.
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (8)

**WARNING** start of CLMS field may overlap end of DESC **. SPECIFICATION Mechanical support of piezoelectric devices This invention relates to a method for mechanically supporting piezoelectric devices such as surface acoustic wave (SAW) filters, crystal resonators and the like. The performance of piezoelectric devices can suffer modification due to stress from the support structure. Though this stress may be minimised at a given temperature, differential expansion between the support structure and the device over an operating temperature range can modify the device characteristics. Various attempts have been made in the past to negate or eliminate the effects of differential expansion. For example it is known to mount a piezoelectric device such as a resonator in specially designed spring strips (British patent 1,459,609). Yet another proposed solution is to mount a piezoelectric device on a semiconductor device having a voltage or current dependent heat balance, whereby the temperature of the piezoelectric device is kept constant (British patent 1,435,655). According to the present invention there is provided a method of mounting a piezoelectric device comprising inserting between the device and its mechanical support structure an intermediate support structure of material having the same or similar temperature dependent characteristics and crystal orientation as the piezoelectric device whereby differential expansion effects on the device are minimised and stress from the mechanical support structure is reduced. Embodiments of the invention are now described with reference to the accompanying drawings, in which: Fig. 1 illustrates a mounting arrangement for a SAW resonator device, and Fig. 2 illustrates a mounting arrangement for a crystal resonator device. In the arrangement shown in Fig. 1 a surface acoustic wave filter device comprises a rectangular body of quartz 11 provided on its upper surface at each end with an interdigitated electro-acoustic transducer 1 2, 1 3. The body 1 is adhesively bonded, e.g. by a layer of epoxy or polyimide resin to an intermediate, larger supporting body 14 of similar material, e.g. quartz, having the same crystal orientation as the filter body 1 The intermediate body 14 is in turn affixed to a mechanical support structure, e.g. a conventional header 1 5, which is provided with lead-through terminals 1 6. The transducers 1 2, 13 are connected to the terminals 16 by bonded wires 1 7. In the arrangement shown in Fig. 2 a quartz crystal resonator slice 21 is provided on opposite faces with metallic electrodes patterns 22, 23. The slice 21 is supported on two pellets of conductive paste 24, 25. Pellet 24 makes direct contact with electrode pattern 22, whilst pellet 25 is formed around and over the edge of the slice to make contact with the electrode pattern 23. The pellets are supported on metallic conductors 26, 27 deposited on a rectangular body 28 of quartz having the same crystallographic orientation as the slice 21. The quartz body is then affixed to a suitable mechanical support (not shown). The pellets of conductive paste allow a clearance gap between the main resonating portion of the crystal and the intermediate support. Although only two specific examples have been given it is apparent that the invention is applicable to any piezoelectric structure including bulk crystal resonators, multipole filters, SAW transversal filters, SAW delay lines etc. The invention is also applicable to any piezoelectric material, of which quartz and lithium niobate are the most commonly used examples. In some cases it may be that the centre of the device is supported on a compressed pellet of paste and electrical connections are made by bonded wires. Because of reduced mounting strain, the use of a supporting substrate of the same material as the electronics device provides improved long term drift, temperature stability, acceleration and vibration performance, and very often simplifies the mounting of complex devices. CLAIMS
1. A method of mounting a piezoelectric device comprising inserting between the device and its mechanical support structure and intermediate support structure of material having the same or similar temperature dependent characteristics and crystal orientation as the piezoelectric device whereby differential expansion effects on the device are minimised and stress from the mechanical support structure is reduced.
2. A method according to claim 1 wherein the device is adhesively bonded to the intermediate support structure.
3. A method according to claim 1 wherein the device is affixed to the intermediate support structure by pellets of conductive paste making electrical connections between electrodes on the device and conductors on the intermediate support.
4. A method according to any preceding claim wherein the device and the intermediate support are both made of quartz or lithium niobate.
5. A method of mounting a piezoelectric device substantially as described with reference to Fig. 1 or Fig. 2 of the accompanying drawings.
6. A piezoelectric device mounted on an intermediate support structure which is in turn mounted on a mechanical support structure, said intermediate support structure being made of the same or similar material I' as the piezoelectric device and having the same crystaliographic orientation as the piezoelectric device.
7. A piezoelectric device mounted by the method claimed in any one of claims 1-5.
8. A piezoelectric device mounted substantially as described with reference to Fig. 1 or Fig. 2 of the drawings.
GB08222375A 1982-08-03 1982-08-03 Mechanical support of piezoelectric devices Withdrawn GB2125211A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08222375A GB2125211A (en) 1982-08-03 1982-08-03 Mechanical support of piezoelectric devices

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB08222375A GB2125211A (en) 1982-08-03 1982-08-03 Mechanical support of piezoelectric devices
JP58141787A JPS5944117A (en) 1982-08-03 1983-08-02 Method of holding piezoelectric device
FR8312826A FR2532118A1 (en) 1982-08-03 1983-08-03 METHOD FOR MOUNTING A PIEZOELECTRIC DEVICE AND PIEZOELECTRIC DEVICE THUS MOUNTED

Publications (1)

Publication Number Publication Date
GB2125211A true GB2125211A (en) 1984-02-29

Family

ID=10532079

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08222375A Withdrawn GB2125211A (en) 1982-08-03 1982-08-03 Mechanical support of piezoelectric devices

Country Status (3)

Country Link
JP (1) JPS5944117A (en)
FR (1) FR2532118A1 (en)
GB (1) GB2125211A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202989A (en) * 1987-04-02 1988-10-05 Stc Plc Crystal resonator
US5012151A (en) * 1989-09-12 1991-04-30 Halliburton Company Thermally matched strip mounted resonator and related mounting method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017746B2 (en) * 1989-03-31 2000-03-13 日本電波工業株式会社 Crystal oscillator
JP3017750B2 (en) * 1989-04-30 2000-03-13 日本電波工業株式会社 Crystal oscillator
EP0635938B1 (en) * 1993-07-20 1998-04-15 AVL List GmbH Piezoelectric crystal element

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1444504A (en) * 1973-07-10 1976-08-04 Suwa Seikosha Kk Quartz crystal vibrator
GB1448651A (en) * 1973-11-16 1976-09-08 Suwa Seikosha Kk Quartz crystal vibrator
GB1464229A (en) * 1974-11-09 1977-02-09 Suwa Seikosha Kk Shear-mode quartz crystal vibrator
GB2002955A (en) * 1977-07-19 1979-02-28 Matsushima Kogyo Kk Piezo-electric oscillator assembly
GB2043995A (en) * 1978-12-21 1980-10-08 Seiko Instr & Electronics Contour vibration mode piezo-electric resonator
GB1583843A (en) * 1976-09-14 1981-02-04 Ebauches Sa Piezoelectric microresonators
GB2056764A (en) * 1979-07-05 1981-03-18 Suisse Horlogerie Piezoelectric resonators and method of manufacture thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3861013A (en) * 1974-01-17 1975-01-21 Air Preheater Method of constructing a rotor for a rotary regenerative heat exchanger

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1444504A (en) * 1973-07-10 1976-08-04 Suwa Seikosha Kk Quartz crystal vibrator
GB1448651A (en) * 1973-11-16 1976-09-08 Suwa Seikosha Kk Quartz crystal vibrator
GB1464229A (en) * 1974-11-09 1977-02-09 Suwa Seikosha Kk Shear-mode quartz crystal vibrator
GB1583843A (en) * 1976-09-14 1981-02-04 Ebauches Sa Piezoelectric microresonators
GB2002955A (en) * 1977-07-19 1979-02-28 Matsushima Kogyo Kk Piezo-electric oscillator assembly
GB2043995A (en) * 1978-12-21 1980-10-08 Seiko Instr & Electronics Contour vibration mode piezo-electric resonator
GB2056764A (en) * 1979-07-05 1981-03-18 Suisse Horlogerie Piezoelectric resonators and method of manufacture thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202989A (en) * 1987-04-02 1988-10-05 Stc Plc Crystal resonator
GB2202989B (en) * 1987-04-02 1991-01-09 Stc Plc Crystal resonnator
US5012151A (en) * 1989-09-12 1991-04-30 Halliburton Company Thermally matched strip mounted resonator and related mounting method

Also Published As

Publication number Publication date
FR2532118A1 (en) 1984-02-24
JPS5944117A (en) 1984-03-12

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)