GB2095923A - Integrated-circuit connector assembly - Google Patents

Abstract

An integrated-circuit (14) having a plurality of leads (26) is received in a carrier (16) to form a module (10) which is received in a socket (12), whereby each terminal (52,54) of the socket (12) is connected to a respective lead (26). The socket and carrier are made of static-conductive insulating material preferably consisting of nylon 6/6 filled with 20-10 wt.% glass fibre and 10-20 wt.% carbon fibre, the total filler being 30 wt.%. A carrier carrying a particular circuit may be suitably indexed so as to mate only with a correspondingly indexed socket. <IMAGE>

Description

SPECIFICATION Modular integrated circuit connector assembly Background of the invention 1. Field of the invention The present invention relates generally to connectors for electrically connecting an integrated circuit device to another circuit element. More particularly, the present invention relates to a connector of the type described that includes a hand held module for mounting said integrated circuit device which is selectively matable with a socket.

2. Brief description ofthe prior art The miniaturization of electronic circuits and their packaging has resulted in the development of systems whose overall size is relatively small. Examples of such systems can be found in the hand held computer or calculator art.

Aside from the miniaturization of the components and circuits, modularization has also contributed to the reduction in size of heretofore larger systems.

That is, rather than developing a system with logic packages and associated components to perform all the necessary functions, one can now use one of many modules to change the function of the system.

The module contains a logic package such as an integrated circuit device which has been designed to perform a predetermined function. The integrated circuit device is mounted in a carrier made of insulative material. The carrier usually has some means integrally formed thereon so that the entire module may be grasped for insertion and removal into the socket. A socket, which is adapted to be electrically connected to a printed circuit board or the like, is provided for receiving the module. If the mode or function is desired to be changed, all that need be done is to remove one module from its socket and replace it with another module which is suited for the desired purposes.

An example of the type of system described is a hand held computer which was developed and/or sold by Friends of Amis Inc. This particular system translated one language to another language. In order to change the language, a hand held module would be inserted within the unit in place of another module.

In the prior art assemblies of the type described, two problems were present. The first problem resides in the electrical characteristics of the material in which the carrier and socket are made. The smaller the area on the chip comprising the integrated circuit device, the more of a problem static electricity is. Miniaturization results in closely packed circuitry that makes chips more sensitive to static.

Minute circuits, such as the ones envisioned herein, can be destroyed by as little as 100 to 200 volts. It is not unusual for a human being to carry a static electric charge of 10,000 or more volts merely by walking across a floor. If someome were to hold a module containing an integrated circuit device, permanent damage would be sustained.

It is, therefore, important to provide some means of draining or discharging the unwanted electrostatic charge to prevent any damage to the integrated circuit device. In the past, this has been accomplished by adding a conductive material to insulative material to make the carrier and socket semiconductive. However, experience has shown that the composition thus chosen did not adequately perform the function for which it was designed. Either the composition used did not adequately discharge the electrostatic charge, or due to the addition of a conductive material, the strength of the material was unacceptably weakened.

The second problem with a prior art connector assemblies of the type described is caused by the possibility of inserting the module within the socket in a non-oriented disposition or, perhaps, inserting a module into the wrong socket altogether. If either of these events should occur, the integrated circuit device may be damaged and malfunction.

In the past, some means of polarizing the module with respect to a socket was provided. However, this polarization oriented the module only in a two dimensional sense. The prior art polarizing means did not prevent a carrier from being inserted upside down, nor did it prevent a module from being inserted into the wrong socket.

Summary of the invention According to one aspect of the present invention there is provided a modular integrated circuit assembly comprising a module having a integrated circuit device with a plurality of leads extending from opposite sides thereof and a carrier for mounting said integrated circuit device, said carrier including a support surface on which said integrated circuit device is supported and a pair of end walls extending from opposite sides of said surface; a socket for receiving said module and having a floor joined to a pair of opposite side walls extending from said floor and a plurality of spring terminals mounted in each side wall extending inwardly of said socket toward the opposite wall, each terminal being adapted to electrically engage a lead when said module is received in said socket;; interengaging polarizing means formed on said carrier and socket for cooperation therebetween to orient the module upon insertion into said socket; and said interengaging polarizing means including a pair of handles, each one integrally formed on one of the end walls extending outwardly therefrom, and at least one rib integrally formed on each end wall extending vertically beneath each handle, said socket including a corresponding vertical slot for each rib formed on the carrier to be matingly received therein.

According to a further aspect of the present invention there is provided a modular integrated circuit connector assembly comprising a module having an integrated circuit device with a plurality of leads extending from opposite sides thereof and a carrier made of static conductive insulative material for mounting said integrated circuit therein; a socket made of static conductive insulative material for receiving said module, said socket having a polarity of terminals mounted therein adapted to electrically engage a lead when said module is received into the socket; and said insulative material consisting of nylon 6/6 material containing 30% filler material, said filler material including carbon fiber and glass fiber, said carbon fiber being present in the range of 20% to 10% by weight and said glass fiber being present in the range of 10% to 20% by weight.

Brief description of the drawings Figure 1 is a perspective view of an exemplary modular integrated circuit connector assembly according to the present invention showing the module prior to insertion into the socket; Figure 2 is a perspective view of the modular integrated circuit connector assembly of Figure 1 showing the module inserted into the socket; Figure 3 is a plan view of the underside of the module taken generally along the line 3-3 of Figure 1; and Figure 4 is a sectional view taken generally along the line 4-4 of the Figure 3.

Description of the preferred embodiment Turning to Figure 1, the modular integrated circuit connector assembly of the present invention is seen to include a module, generally designated 10, which is insertable into and matable with a dual in-line socket, generally designated 12. The design is such that the module 10 is adapted to be selectively insertable into and removable from the socket 12.

The module 10 includes an integrated circuit device 14 which contains a logic package and a carrier, generally designated 16, made of electrostatic conductive insulative material. The integrated circuit device 14 is adapted to be supported on surface 18 (Figure 3) on the carrier 16. The carrier 16 also includes a pair of end walls 20 and 22 extending from opposite sides of the surface 18 and two rows of upstanding parallel spaced-apart L-shaped ribs 24 on either side of the surface 18 which join the end walls 20 and 22. Each region between adjacent ribs 24 receives a downwardly disposed integrated circuit lead 26 which extend from the integrated device 14 and are bent around the surface 18 as is best shown in Figure 4.

The end walls 20 and 22 include extensions 28 which extend past the rows of ribs 24. These extensions 28 are provided for polarizing purposes as will be discussed in greater detail hereinafter.

Each end wall 20 and 22 includes a handle 32 and 34 integrally formed thereon and extending out wardlytherefrom. The handles 32 and 34 are intended to be grasped by the forefinger and thumb for insertion and removal of the module 10 into or out of the socket 12.

Immediately beneath handle 32, a polarizing rib 36 is provided. In a like manner, polarizing ribs 38 and 40 are provided immediately below handle 34. The polarizing ribs 36,38 and 40 are adapted to interengage portions of the socket 12 as will be discussed in greater detail hereinafter.

As with the carrier 16, the socket 12 is made of electrostatic conductive insulative material. This material is molded in a form that will receive the module 10 in a mating configuration.

As is best seen in Figure 1, the socket 12 includes a floor 44 with a pair of opposite side walls 46 extending from said floor. A pair of opposite end walls 48 and 50 join the side walls 46.

A plurality of spring terminals 52 are mounted in each side wall 46. The terminals 52 extend inwardly of the socket toward the opposite wall 46. Each terminal 52 is adapted to electrically engage an integrated circuit lead 26 when the module 10 is received into the socket 12. In addition, each terminal 52 has a printed circuit tail 54 extending beneath the floor 44 of socket 12. The printed circuit tails 54 are adapted to be soldered to a printed circuit board (not shown).

Four polarizing recesses 56 are formed in the side walls 46. Recesses 56 are adapted to receive the end wall extensions 28 when the module 10 is inserted into the socket 12. The configuration of the end wall extensions 28 and the corresponding recesses 56 are such that one could not rotate the module 10 180 and still be able to insert the module into the socket 12. However, it is to be noted that it may be still possible to turn the module 10 upside down and still insert it into the socket 12. To prevent this, slot 60 is provided in end wall 48 and slots 62 and 64 are provided in end wall 50. These slots 60,62 and 64 are adapted to matingly receive the polarizing ribs 36,38 and 40 respectively.

The structure defined by the handles 32 and 34, the polarizing ribs 36,38 and 40 and the slots 60, 62 and 64 polarize the module 10 in two respects: 1. The module 10 cannot be inserted upside down into the socket 12. This is rendered impossible because the handles 32 and 34 would butt against the top of the socket end walls 48 and 50 preventing any of the integrated circuit leads 26 from electrically contacting any of the socket terminals 52.

2. By forming the polarizing ribs 36,38 and 40 and their corresponding slots 60, 62 and 64 in a unique manner for each complete modular integrated circuit connector assembly, only the correct module 10 can be inserted into its inteded socket 12.

For example, if polarizing rib 36 where moved closer to one end of wall 20, it would not be receivable within slot 60 in the socket 12. The unique combinations are infinite with respect to the placement of ribs 36,38 and 40 and their corresponding slots 60, 62and64.

The electrostatic conductive insulative material that is used for making the carrier 16 and the socket 12 consist of nylon 6-6 material contaning 30% filler material. The filler material includes carbon fiber and glass fiber. Preferably, the carbon fiber should be present in the range of 20% to 10% by weight and the glass fiber should be present in the range of 10% to 20% by weight.

The addition of carbon fiber tends to weaken the strength of the material though it adds to the conductivity of the nylon. If too much carbon is included in the material, it becomes too conductive and will short out the integrated circuit device 14. If the carbon fiber is less than 10%, any ambient static electric charge will not be efficiently eliminated.

The addition of carbon fiber to the nylon tends to weaken the integrity of both the carrier 16 and the pocket 12. The glass fiber is added to make up for the lost strength in the material caused by the addition of the carbon fiber. If more than 20% glass fiber filler is added, the conductivity of the insulative material will be inadequate.

Claims (8)

1. A modular integrated circuit connector assembly including, in combination, a module having an integral circuit device with a plurality of leads extending from opposite s#ides thereof and a carrier made of static conductive insulative material for mounting said integrated circuit device therein, and a socket made of static conductive insulative material for receiving said module, said socket having a plurality of terminals mounted therein adapted to electrically engage lead when said module is received into the socket, said insulative material consisting of nylon 6/6 material containing 30% filler material, said filler material including carbon fiber and glass fiber, said carbon fiber being present in the range or 20% to 10% by weight and said glass fiber being present in the range of 10% to 20% by weight

2.The assembly of claim 1 wherein said carrier includes a support surface on which said integrated circuit device is supported which is enclosed by a pair of end walls extending from opposite sides of said surface, a plurality of upstanding parallel spaced-apart L-shaped ribs on either side of the surface joining end walls, each region between adjacent ribs receiving a downward- ly disposed lead therein in a bent configuration, and a pair of handles, each handle integrally formed on one of the end walls extending outwardly therefrom; and wherein said socket includes a floor jointed by a pair of opposite side walls extending from said floor, said terminals being resiliently mounted in each side wall extending inwardly of the socket toward the opposite sidewall, and each terminal being adapted to be slidingly received between adjacent ribs of said carrier to electrically engage a lead position therein when said module is received into said socket, said handles extending longitudinally outside of the socket.

3. The assembly of claim 2 including interengaging polarizing means formed on said carrier and socket for cooperation therebetween to orient the module upon insertion into said socket, said interengaging polarizing means including a pair of handles, each one integrally formed on one of the end walls extending outwardly therefrom, and at least one rib integrally formed on each end wall extending vertically beneath each handle, said socket including a corresponding vertical slot for each rib formed on the carrier to be matingly received therein.

4. The assembly of claim 3 wherein said second polarizing means includes protrusions extending out-wardly perpendicular from the end walls of the carrier which are matingly received within corresponding vertical slots formed in the socket.

5. A modular integrated circuit connector assembly including, in combination, a a module having an integrated circuit device with a plurality of leads extending from opposite sides thereof and a carrierformounting said integrated circuit device, said carrier including a support surface on which said integrated circuit device is supported and a pair of end walls extending from opposite sides of said surface, a socket for receiving said module and having a floor joined to a pair of opposite sidewalls extending from said floor, and a plurality of spring terminals mounted in each sidewall extending inwardly of said socket toward the opposite wall, each terminal being adapted to electrically engage a lead when said module is received into said socket, and interengaging polarizing means formed on said carrier and socket for cooperation therebetween to orient the module upon insertion into said socket, said interengaging polarizing means including a pair of handles, each one integrally formed on one of the end walls and extending outwardly therefrom, and at least one rib integrally formed on each end wall extending vertically beneath each handle, said socket including a corresponding vertical slot for each rib formed on the carrier to be matingly received therein.

6. The assembly of claim 5 wherein said second polarizing means includes protrusions extending out-wardly perpendicular from the end walls of the carrier which are matingly received within corresponding vertical slots formed in the socket.

7. The assembly of claim 5 or 6 wherein said carrier further includes a plurality of upstanding parallel spaced-apart L-shaped ribs on either side of the surface joining the end walls, each region between adjacent ribs receiving a downwardly disposed lead therein in a bent configuration, each terminal mounted in the socket being adapted to be slidingly received between adjacent ribs of said carrier to electrically engage a lead positioned therein when said module is received into said socket.

8. A modular integrated circuit connector assembly substantially as herein described with reference to the accompanying drawings.