FR2502854A1 - CONNECTOR DEVICE FOR MODULAR INTEGRATED CIRCUITS - Google Patents

Abstract

A. DEVICE INCLUDING A MODULE 10 CONSTITUTED BY AN INTEGRATED CIRCUIT 14 ENGAGED IN A BOX 16 IN ELECTROSTATICALLY CONDUCTIVE INSULATION MATERIAL, AND A SUPPORT 12 FOR THE MODULE INCLUDING TERMINALS 52 FOR CONNECTION TO ANOTHER INTEGRATED CIRCUIT. B. CHARACTERIZED IN THAT THE INSULATION MATERIAL CONSISTS OF POLYAMIDE (NYLON) 66 CONTAINING 30 OF FILLING MATERIAL, THIS FILLING MATERIAL INCLUDING CARBON FIBER IN A PROPORTION OF THE ORDER OF 20 TO 10 BY WEIGHT, AND FIBERGLASS IN A PROPORTION OF THE ORDER OF 10 TO 20 BY WEIGHT; C. PROVISION APPLICABLE TO COMPLEX INTEGRATED CIRCUIT MODULES.

Description

The invention relates generally to connector devices

  to electrically connect

  an integrated circuit module to another integrated circuit module.

  More specifically, the invention relates to a connector of the above type, comprising a module that can be held by hand to mount the integrated circuit adapting selectively in

a socket or a support.

  The miniaturization of electronic circuits

  and their boxes has led to the development of systems whose overall size is relatively small. Examples of such systems can be found in the meter technique

or manual calculators.

  In parallel with the miniaturization of

  In addition, modular designs have helped to reduce the size of previously larger systems. Indeed, rather than developing a system from logical blocks and associated components, to perform all the necessary functions, we can now use

  one or more modules to modify the system function.

  Each module contains a logic block such as an integrated circuit designed to perform a predetermined function. This circuit

  integrated is mounted in a carrying case made of insulating material.

  This box generally comprises means forming an integral part thereof and for gripping the entire module to introduce it into its socket or receiving support or remove it. This receiver support intended to be electrically connected to a printed circuit board or the like,

  is designed to receive the integrated circuit module.

  If you want to change the operating mode

  In general, the only operation to be performed is to remove a module from its receiving medium and to replace it.

  another module corresponding to the other intended use.

  chée. An example of such a system is provided by the hand calculator developed by Friends of Friends Inc. This

  particular system transforms a language into another language.

  To change the language just replace a module to

  hand by another module in the system.

  In the devices according to the prior art described above, two problems arise. The first problem is related to the electrical characteristics of the material

  in which are made the housing and the receiving medium.

  The smaller the surface of the chip constituting the integrated circuit, the more the problem of static electricity is critical. Miniaturization leads to very tight circuits making the pellets more sensitive to static electricity. Very small circuits such as those considered here can be destroyed by voltages not exceeding 100 to 200 volts. It is not unusual for the human body to charge static electricity at voltages of 10,000 volts or more when simply walking on the ground. If the person thus charged takes charge of a module containing a circuit

  the risks of permanent deterioration are consid-

  rable. It is therefore very important to provide

  means of evacuating or discharging the electronic

  unwanted static to prevent any risk of damage to the integrated circuit. In the prior art, this result has been achieved by adding a conductive material to the insulating material to make the casing and the semiconductor carrier. However, experience has shown that the complex assembly thus obtained no longer exhibits adequate operating performance for the application under consideration. Indeed, or the composition used did not allow to properly discharge the

  electrostatic charges, or the resistance of the material does not

  was more sufficient as a result of the addition of a conductive material. The second problem posed by the prior art connector devices described above is related to the risks of introducing the module into its support with an incorrect orientation, or even of introducing a module into a bad support. If any of these events occur, the integrated circuit may be damaged or present

malfunctions.

  In the past, various means have been used to impose the correct orientation of the module with respect to the support. However, these means allow to orient the module in two dimensions and do not prevent the risk of introducing a botter upside down or in a bad

4o support.

  The aim of the invention is to offset the

  disadvantages of the prior art by creating a device

  Advanced connector for integrated circuits, of the above type, to prevent any risk of damage to integrated circuits. For this purpose the invention relates to a

  connector device for modular integrated circuits,

  taking in combination a module constituted by an integrated circuit provided with a number of conductors from the opposite sides thereof, this integrated circuit being engaged in a stack of electrostatically conductive insulation material, and a support material of electrically conductive insulation for receiving the module, this support having a number of terminals mounted therein so as to come into electrical contact with a conductor of the integrated circuit when the module is housed in the support, characterized in that the insulation material is 6/6 polyamide (nylon) containing 30% filler material, said filler material comprising carbon fiber in a proportion of about 20% to 10% by weight, and fiberglass in a proportion of the order of

% to 20% by weight.

  According to another characteristic of the in-

  In the invention, the housing comprises a support surface of the integrated circuit surrounded by a pair of end walls extending from the opposite sides of this surface, a number of parallel, parallel, L-shaped vertical ribs lying on both sides of the surface. a surface connecting the end walls, each area between adjacent ribs receiving a downward curved conductor, and a pair of handles each integral with an end wall extending outwardly therefrom; the support comprising a bottom connecting a pair of opposite side walls starting from this bottom, the terminals being resiliently mounted within each side wall of the support and facing the opposite side wall, each

  terminal being designed to slip between adjacent ribs

  the case to come into electrical contact with a conductor

  placed in this housing, when the module is housed in the support, the handles lying longitudinally outside

of the support.

  According to yet another feature of the invention the device comprises engagement orientation means formed on the housing and on the support so as to cooperate together to orient the module when introduced into the support, these means orientation comprising a pair of handles each integral with one of the end walls and extending outwardly therefrom, and at least one rib integral with each end wall extending vertically below each handle; the support having a vertical slot corresponding to each rib,

  formed on the case and coming to fit in this slot.

  The invention is described below with reference to the accompanying drawings in which: - Figure 1 is a perspective view of the connector device for modular integrated circuits according to the invention showing the module before introduction into its support; FIG. 2 is a perspective view of the connector device for modular integrated circuits according to the invention, representing the module once introduced into its support; FIG. 3 is a plan view, along the line 3-3 of FIG. 1, of the lower face of the module; FIG. 4 is a sectional view along the line 4-4 of FIG. 3. In FIG. 1, the connector device for modular integrated circuits according to the invention comprises a module marked generally by the reference numeral 10.

  can be introduced and adapted in a corresponding support

  dant 12 placed in front of him. The design of the device is such that it is possible to selectively

  module 10 in and out of its support 12.

  The module 10 comprises an integrated circuit 14 containing a logic block and a housing 16, made of an electrostatically conductive insulation material. The integrated circuit 14 is intended to be mounted, by its surface 18 (Figure 3) on the housing 16. This housing 16 also comprises a pair of end walls 20 and 22 from both sides

  opposed to the surface 18, and two rows of parallel ribs

  the L-shaped separate verticals 14 located on both sides of the surface 18 and interconnecting the end walls 20 and 22. Each zone between adjacent ribs 24 receives a downwardly directed integrated circuit conductor 26, these conductors starting from the integrated circuit 14 and curving around the surface 18, as can be

better see it in Figure 4.

  The end walls 20 and 22 have extensions 28 which extend beyond the rows of nervuri 24. These extensions 28 are intended to fix the orientation,

  as will be described in more detail below.

  Each end wall 20 and 22 includes a handle 32 and 34 integral with the corresponding wall and extending outwardly therefrom. These handles 32 and 34 are intended to be gripped between the thumb and forefinger to introduce or remove the module 10 of the support 12 Just below the handle 32 is provided an orientation rib 36. In the same manner, orientation ribs 38 and 40 are provided just below the handle 34. The orienting ribs 36, 38 and 40 are intended to engage in corresponding parts of the

  support 12, as will be described in more detail below.

  Like the casing 16, the support 12 is made of an electro-matically conductive insulation material. This material is molded in a mold intended

  to receive the module 10 with an exact coincidence.

  As can be better seen in FIG. 1, the support 12 comprises a bottom 44 from which two opposite side walls 46 start. Two opposite end walls 48

  and 50 connect the side walls 46 to each other.

  A number of contact terminal springs 52 are mounted in each side wall 46. These terminals 52 are placed inside the support and face opposite wall 46. Each terminal is intended to come into electrical contact with a conductor 26 of the integrated circuit 33 when the module 10 is housed in the support 12. In addition, each terminal 52 has a printed circuit board 54 below the bottom 44 of the support 12. The printed circuit tails 54 are intended for to be welded to

  a printed circuit board (not shown).

  Four orientation cavities 56 are

  formed in the sidewalls 46. These cavities are intended

  to accommodate the end wall extensions 28 when the module 10 is inserted into the support 12. The configuration of the end wall extensions 28 and the corresponding cavities 56 is such that the module can no longer be inserted into the housing. support 12 after spinning

  this module 10 of 1800. It will be noted, however, that it is always

  possible days to return the module 10 upside down and to introduce it again in the support 12. To also remove this possibility, a slot 60 is provided in the end wall 48 and slots 62, 64 in the wall of end _50. These slots 60, 62, 64 are designed to receive respectively the orientation ribs 36, 38 The structure defined by the handles 32 and 34, the orientation ribs 36, 38, 40 and the slots, 62, 64 allows orient the module 10 in two different ways:

  1 - Module 10 can not be introduced

  duit upside down in the support 12.

  Indeed this possibility is eliminated by the fact that the handles 32, 34 would abut against the top of the end walls 48, 50 thus preventing any driver 26 from

  integrated circuit to come into electrical contact with any one

conque of the terminals 52 of the support.

  2 - Given the orientation ribs 36, 38, 40 and their corresponding slots 60, 62, 64 a single configuration configuration for each complete connector device for modular integrated circuits, only the introduction of the right module 10 is possible in its corresponding support 12. If, for example, the orientation rib

  36 approached one end of the wall 20, this ribbon

  It would be possible to provide an infinite number of unique combinations of positions of the ribs 36, 38, 40 with respect to the corresponding slots 60, 62, 64. The electrostatically conductive isolation material used to make the boltier 16 and the support 12 is made of polyamide 6/6 containing 30% filler material. This filling material comprises carbon fiber and fiberglass. Preferably the weight content of the carbon fiber should be in the range of 20% to 10%, and the weight content of the fiberglass

  should be in the range of 20% to 10%.

  The addition of carbon fiber tends to reduce the strength of the material, but it increases the conductivity of the polyamide. If the material contains too much carbon, this material becomes too conductive and may short-circuit the integrated circuit 14. If instead the amount of carbon fiber is less than 10% ambient electrostatic charges are no longer sufficiently eliminated . The addition of carbon fiber to the polyamide tends to reduce the integrity of both the casing 16 and the support 12. The fiberglass is added to compensate.

  the loss of resistance caused in the material by the adjon-

  carbon fiber. If, however, more than 20% fiberglass is added, the conductivity of the insulation material

suits more.

Claims (3)

  1- Connector device for circuits   integrated modules, comprising in combination a component module   killed by an integrated circuit (14) provided with a number of conductors from the opposite sides thereof, this circuit   integrated part being engaged in a casing (16) of insulating material   electrically conductive insulation, and a carrier (12) of electrostatically-conductive insulation material for receiving the module, which carrier comprises a number of terminals (52) mounted therein for electrically contacting a circuit conductor integrated when the module is housed in the support, characterized in that the insulation material is made of polyamide (nylon) 6/6 containing 30% of filling material, this material   filling material comprising carbon fiber in a proportion   from 20% to 10% by weight, and fiberglass   in a proportion of about 10 to 20% by weight.   2- Device according to claim 1 characterized in that the casing comprises a support surface of the integrated circuit surrounded by a pair of end walls from the opposite sides of this surface a number of separate parallel vertical ribs, L-shaped locating on both sides of the surface connecting the end walls, each area between adjacent ribs receiving a downward curved conductor, and a pair of handles each integral with an end wall extending outwardly from that -this; the support comprising a bottom connecting a pair of opposite side walls starting from this bottom, the terminals being elastically mounted inside each side wall of the support and facing the opposite side wall, each terminal being designed to slip between adjacent ribs of the housing to come into electrical contact with a conductor placed in this housing, when the module is housed in the support, the handles are   located longitudinally outside the support.   3- Device according to any one of   claims 1 and 2, characterized in that it comprises   engagement orientation means trained on the shoemaker and on   support in such a way as to cooperate together to guide the   When the latter is introduced into the support, these orientation means comprise a pair of handles each of which is integral with one of the end walls and outwardly thereof, and at least one integral rib. with each end wall extending vertically below each handle, the support having a vertical slot correpondant to each rib formed on the casing and coming fit in this slot.   A- Device according to any one of   Claims 1 to 3, characterized in that the second mpyens   orientation includes parts protruding out-   perpendicularly to the end walls of the casing,   to fit into vertical slots corresponding to of the support.