GB201709895D0 - Light emitting device and light emitting device packaging - Google Patents
Light emitting device and light emitting device packagingInfo
- Publication number
- GB201709895D0 GB201709895D0 GBGB1709895.5A GB201709895A GB201709895D0 GB 201709895 D0 GB201709895 D0 GB 201709895D0 GB 201709895 A GB201709895 A GB 201709895A GB 201709895 D0 GB201709895 D0 GB 201709895D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- light emitting
- emitting device
- packaging
- device packaging
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410848993.8A CN104681684A (en) | 2014-12-30 | 2014-12-30 | Light emitting device and light emitting device package |
PCT/CN2015/070708 WO2016106853A1 (en) | 2014-12-30 | 2015-01-14 | Light emitting device and light emitting device packaging |
Publications (4)
Publication Number | Publication Date |
---|---|
GB201709895D0 true GB201709895D0 (en) | 2017-08-02 |
GB2548515A GB2548515A (en) | 2017-09-20 |
GB2548515A8 GB2548515A8 (en) | 2018-07-18 |
GB2548515B GB2548515B (en) | 2020-08-26 |
Family
ID=53316489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1709895.5A Active GB2548515B (en) | 2014-12-30 | 2015-01-14 | Light emitting device and light emitting device package |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6460586B2 (en) |
KR (1) | KR101899743B1 (en) |
CN (1) | CN104681684A (en) |
GB (1) | GB2548515B (en) |
WO (1) | WO2016106853A1 (en) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091628A (en) * | 1998-09-09 | 2000-03-31 | Murata Mfg Co Ltd | Semiconductor light emitting element |
CN1300860C (en) * | 2003-02-25 | 2007-02-14 | 中国科学院半导体研究所 | Method for producing N-type layer ohmic contact electrode of GaN LED |
DE102007022947B4 (en) * | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic semiconductor body and method for producing such |
US10147843B2 (en) * | 2008-07-24 | 2018-12-04 | Lumileds Llc | Semiconductor light emitting device including a window layer and a light-directing structure |
JP5426124B2 (en) * | 2008-08-28 | 2014-02-26 | 株式会社東芝 | Semiconductor light emitting device manufacturing method and semiconductor light emitting device |
JP2009200522A (en) * | 2009-05-15 | 2009-09-03 | Mitsubishi Chemicals Corp | GaN SYSTEM SEMICONDUCTOR LIGHT EMITTING ELEMENT |
KR100986560B1 (en) | 2010-02-11 | 2010-10-07 | 엘지이노텍 주식회사 | Light emitting device and fabrication method thereof |
JP2011258856A (en) * | 2010-06-11 | 2011-12-22 | Toshiba Corp | Light-emitting element and light-emitting device |
JP5589812B2 (en) * | 2010-12-06 | 2014-09-17 | 豊田合成株式会社 | Semiconductor light emitting device |
JP2012138452A (en) * | 2010-12-27 | 2012-07-19 | Panasonic Corp | Method of manufacturing nitride semiconductor light-emitting element, and nitride semiconductor light-emitting element |
TWM436224U (en) * | 2011-10-28 | 2012-08-21 | Rgb Consulting Co Ltd | |
CN102403425A (en) * | 2011-11-25 | 2012-04-04 | 俞国宏 | Method for manufacturing inverted LED chip |
TWI474516B (en) * | 2012-08-30 | 2015-02-21 | Lextar Electronics Corp | Flip-chip light-emitting diode structure and manufacturing method thereof |
CN104064634A (en) * | 2013-03-22 | 2014-09-24 | 上海蓝光科技有限公司 | Production method for high-brightness GaN-based eutectic welding light emitting diodes |
JP6147061B2 (en) * | 2013-04-02 | 2017-06-14 | スタンレー電気株式会社 | Flip-chip type semiconductor light emitting device, semiconductor device and manufacturing method thereof |
DE102013109316A1 (en) * | 2013-05-29 | 2014-12-04 | Osram Opto Semiconductors Gmbh | Method for producing a plurality of optoelectronic semiconductor chips and optoelectronic semiconductor chip |
-
2014
- 2014-12-30 CN CN201410848993.8A patent/CN104681684A/en active Pending
-
2015
- 2015-01-14 JP JP2017534665A patent/JP6460586B2/en active Active
- 2015-01-14 GB GB1709895.5A patent/GB2548515B/en active Active
- 2015-01-14 KR KR1020177018445A patent/KR101899743B1/en active IP Right Grant
- 2015-01-14 WO PCT/CN2015/070708 patent/WO2016106853A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2018500773A (en) | 2018-01-11 |
GB2548515B (en) | 2020-08-26 |
WO2016106853A1 (en) | 2016-07-07 |
KR20170091729A (en) | 2017-08-09 |
CN104681684A (en) | 2015-06-03 |
JP6460586B2 (en) | 2019-01-30 |
KR101899743B1 (en) | 2018-09-17 |
GB2548515A8 (en) | 2018-07-18 |
GB2548515A (en) | 2017-09-20 |
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