GB2014891B - Process for joining silicon bodies - Google Patents
Process for joining silicon bodiesInfo
- Publication number
- GB2014891B GB2014891B GB7900458A GB7900458A GB2014891B GB 2014891 B GB2014891 B GB 2014891B GB 7900458 A GB7900458 A GB 7900458A GB 7900458 A GB7900458 A GB 7900458A GB 2014891 B GB2014891 B GB 2014891B
- Authority
- GB
- United Kingdom
- Prior art keywords
- silicon bodies
- joining silicon
- joining
- bodies
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/10—Reaction chambers; Selection of materials therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Silicon Compounds (AREA)
- Ceramic Products (AREA)
- Arc Welding In General (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782800507 DE2800507A1 (en) | 1978-01-05 | 1978-01-05 | PROCESS FOR GAS SEALING CONNECTING HIGHLY PURE SILICON MOLDED PARTS |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2014891A GB2014891A (en) | 1979-09-05 |
GB2014891B true GB2014891B (en) | 1982-05-06 |
Family
ID=6029060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7900458A Expired GB2014891B (en) | 1978-01-05 | 1979-01-05 | Process for joining silicon bodies |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5495182A (en) |
BE (1) | BE873323A (en) |
DE (1) | DE2800507A1 (en) |
DK (1) | DK4079A (en) |
FR (1) | FR2413934A1 (en) |
GB (1) | GB2014891B (en) |
IT (1) | IT1114308B (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1917016B2 (en) * | 1969-04-02 | 1972-01-05 | Siemens AG, 1000 Berlin u. 8000 München | PROCESS FOR MANUFACTURING HOLLOW BODIES FROM SEMICONDUCTOR MATERIAL |
-
1978
- 1978-01-05 DE DE19782800507 patent/DE2800507A1/en not_active Withdrawn
- 1978-12-19 JP JP15589378A patent/JPS5495182A/en active Granted
-
1979
- 1979-01-03 IT IT47518/79A patent/IT1114308B/en active
- 1979-01-04 FR FR7900146A patent/FR2413934A1/en not_active Withdrawn
- 1979-01-04 DK DK4079A patent/DK4079A/en not_active Application Discontinuation
- 1979-01-05 BE BE0/192773A patent/BE873323A/en unknown
- 1979-01-05 GB GB7900458A patent/GB2014891B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5495182A (en) | 1979-07-27 |
IT1114308B (en) | 1986-01-27 |
DE2800507A1 (en) | 1979-07-19 |
DK4079A (en) | 1979-07-06 |
GB2014891A (en) | 1979-09-05 |
FR2413934A1 (en) | 1979-08-03 |
BE873323A (en) | 1979-07-05 |
IT7947518A0 (en) | 1979-01-03 |
JPS6128427B2 (en) | 1986-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |