GB1558867A - Polyetheramide-imide epoxy resin blends - Google Patents
Polyetheramide-imide epoxy resin blends Download PDFInfo
- Publication number
- GB1558867A GB1558867A GB44345/76A GB4434576A GB1558867A GB 1558867 A GB1558867 A GB 1558867A GB 44345/76 A GB44345/76 A GB 44345/76A GB 4434576 A GB4434576 A GB 4434576A GB 1558867 A GB1558867 A GB 1558867A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin
- blend
- polyetheramide
- wire
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2938—Coating on discrete and individual rods, strands or filaments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2942—Plural coatings
- Y10T428/2947—Synthetic resin or polymer in plural coatings, each of different type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/628,331 US4118535A (en) | 1975-11-03 | 1975-11-03 | Novel polyetheramide-imide epoxy resin blends |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1558867A true GB1558867A (en) | 1980-01-09 |
Family
ID=24518440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB44345/76A Expired GB1558867A (en) | 1975-11-03 | 1976-10-26 | Polyetheramide-imide epoxy resin blends |
Country Status (6)
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54162174A (en) * | 1978-06-14 | 1979-12-22 | Sumitomo Bakelite Co | Method of producing flexible printed circuit board |
DE2900560A1 (de) * | 1979-01-09 | 1980-07-17 | Bayer Ag | Mischungen aus polyamidimidharzen und epoxidverbindungen |
DE3034536C2 (de) * | 1980-09-12 | 1982-04-08 | Hitachi Chemical Co., Ltd., Tokyo | Polyamid-imidharzmasse und ihre Verwendung |
DE3363507D1 (en) * | 1982-07-14 | 1986-06-19 | Ciba Geigy Ag | Epoxy resin systems modified with thermoplastic resins |
EP0108476A1 (en) * | 1982-09-15 | 1984-05-16 | The British Petroleum Company p.l.c. | Epoxy resin composition |
US4567216A (en) * | 1983-12-22 | 1986-01-28 | Union Carbide Corporation | Thermoplastic modified epoxy compositions |
US4504632A (en) * | 1983-12-30 | 1985-03-12 | General Electric Company | Amide ether imide block copolymers |
US4557860A (en) * | 1984-07-06 | 1985-12-10 | Stauffer Chemical Company | Solventless, polyimide-modified epoxy composition |
FR2592050B1 (fr) * | 1985-12-24 | 1988-01-08 | Centre Etd Mat Org Tech Avance | Copolyimides arylaliphatiques a enchainements ether, leur preparation, leurs melanges ou produits de reaction avec des resines epoxydes et leur utilisation pour la fabrication de materiaux composites flexibles |
US4892901A (en) * | 1987-12-31 | 1990-01-09 | General Electric Company | Polyetherimide ester elastomer |
US4975221A (en) * | 1989-05-12 | 1990-12-04 | National Starch And Chemical Investment Holding Corporation | High purity epoxy formulations for use as die attach adhesives |
US5538789A (en) * | 1990-02-09 | 1996-07-23 | Toranaga Technologies, Inc. | Composite substrates for preparation of printed circuits |
WO2001046029A2 (en) | 1999-12-20 | 2001-06-28 | Kimberly-Clark Worldwide, Inc. | Filtering cap for bottled fluids |
AU2003286758A1 (en) | 2003-07-17 | 2005-03-07 | Honeywell International Inc | Planarization films for advanced microelectronic applications and devices and methods of production thereof |
US8980053B2 (en) | 2012-03-30 | 2015-03-17 | Sabic Innovative Plastics Ip B.V. | Transformer paper and other non-conductive transformer components |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3453292A (en) * | 1964-07-07 | 1969-07-01 | Sumitomo Electric Industries | Method of manufacturing tetracarboxylic acid dianhydride |
US3458595A (en) * | 1967-01-04 | 1969-07-29 | Anaconda Wire & Cable Co | Epoxidized amide-imide polymeric coating powder |
US3416994A (en) * | 1967-01-12 | 1968-12-17 | Du Pont | Cross-linked polyimide |
DE1720663C3 (de) * | 1967-06-01 | 1975-09-18 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung von Kunststoffen |
US3838101A (en) * | 1970-04-13 | 1974-09-24 | Aerojet General Co | Reactions between an organic diimide and an epoxy resin with a chromium iii tricarboxylate catalyst |
US3663651A (en) * | 1970-09-03 | 1972-05-16 | Rogers Corp | Thermal-resistant polyimide-epoxy polymers |
-
1975
- 1975-11-03 US US05/628,331 patent/US4118535A/en not_active Expired - Lifetime
-
1976
- 1976-10-26 GB GB44345/76A patent/GB1558867A/en not_active Expired
- 1976-10-29 FR FR7632875A patent/FR2329721A1/fr active Granted
- 1976-10-30 DE DE19762650019 patent/DE2650019A1/de not_active Withdrawn
- 1976-11-02 NL NL7612155A patent/NL7612155A/xx not_active Application Discontinuation
- 1976-11-04 JP JP51131811A patent/JPS5268257A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2650019A1 (de) | 1977-05-05 |
JPS5268257A (en) | 1977-06-06 |
NL7612155A (nl) | 1977-05-05 |
US4118535A (en) | 1978-10-03 |
FR2329721A1 (fr) | 1977-05-27 |
FR2329721B1 (US07906523-20110315-C00004.png) | 1981-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |