GB1555364A - Electronic circuit packaging arrangement and method - Google Patents

Electronic circuit packaging arrangement and method

Info

Publication number
GB1555364A
GB1555364A GB20209/76A GB2020976A GB1555364A GB 1555364 A GB1555364 A GB 1555364A GB 20209/76 A GB20209/76 A GB 20209/76A GB 2020976 A GB2020976 A GB 2020976A GB 1555364 A GB1555364 A GB 1555364A
Authority
GB
United Kingdom
Prior art keywords
circuit device
package
electronic circuit
circuit packaging
packaging arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB20209/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/581,604 external-priority patent/US3986334A/en
Priority claimed from US05/581,605 external-priority patent/US4012723A/en
Priority claimed from US05/581,603 external-priority patent/US3986335A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1555364A publication Critical patent/GB1555364A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Light Receiving Elements (AREA)
  • Electromechanical Clocks (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
GB20209/76A 1975-05-29 1976-05-17 Electronic circuit packaging arrangement and method Expired GB1555364A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US58162075A 1975-05-29 1975-05-29
US05/581,604 US3986334A (en) 1975-05-29 1975-05-29 Electronic watch and its method of fabrication
US05/581,605 US4012723A (en) 1975-05-29 1975-05-29 Magnetic bubble memory packaging arrangement and its method of fabrication
US05/581,603 US3986335A (en) 1975-05-29 1975-05-29 Electronic watch module and its method of fabrication

Publications (1)

Publication Number Publication Date
GB1555364A true GB1555364A (en) 1979-11-07

Family

ID=27504954

Family Applications (1)

Application Number Title Priority Date Filing Date
GB20209/76A Expired GB1555364A (en) 1975-05-29 1976-05-17 Electronic circuit packaging arrangement and method

Country Status (7)

Country Link
JP (1) JPS51145370A (pt)
BR (1) BR7603423A (pt)
CA (1) CA1058312A (pt)
DE (1) DE2623715A1 (pt)
FR (1) FR2356339A1 (pt)
GB (1) GB1555364A (pt)
IT (1) IT1062029B (pt)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000336B (en) * 1977-06-20 1982-07-07 Hitachi Ltd Electronic device and method of fabricating the same
EP0438905A2 (en) * 1990-01-26 1991-07-31 STMicroelectronics, Inc. IC package having replaceable backup battery
GB2302996A (en) * 1996-07-19 1997-02-05 Delta Schoeller Ltd Electrical circuit

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227555A (en) * 1975-08-27 1977-03-01 Seiko Instr & Electronics Electronic timekeeper
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
JPS5424673A (en) * 1977-07-27 1979-02-24 Seiko Epson Corp Electronic wristwatch
CH623452B (fr) * 1977-12-14 Fontainemelon Horlogerie Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede.
JPS56122972U (pt) * 1980-02-19 1981-09-18
EP0105841A1 (fr) * 1982-10-05 1984-04-18 Ebauches Electroniques S.A. Bande de travail destinée à la fabrication de supports de composants pour montre

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3784725A (en) * 1972-07-24 1974-01-08 Solitron Devices Electronic hybrid package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000336B (en) * 1977-06-20 1982-07-07 Hitachi Ltd Electronic device and method of fabricating the same
EP0438905A2 (en) * 1990-01-26 1991-07-31 STMicroelectronics, Inc. IC package having replaceable backup battery
EP0438905A3 (en) * 1990-01-26 1993-02-03 Sgs-Thomson Microelectronics, Inc. Ic package having replaceable backup battery
GB2302996A (en) * 1996-07-19 1997-02-05 Delta Schoeller Ltd Electrical circuit
GB2302996B (en) * 1996-07-19 1998-07-22 Delta Schoeller Ltd Electrical circuit

Also Published As

Publication number Publication date
CA1058312A (en) 1979-07-10
DE2623715A1 (de) 1977-01-20
FR2356339A1 (fr) 1978-01-20
IT1062029B (it) 1983-06-25
BR7603423A (pt) 1976-12-21
FR2356339B1 (pt) 1983-03-04
JPS51145370A (en) 1976-12-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee