GB1549453A - Method for compensating for emitter-push effect in the fabrication of transistors - Google Patents

Method for compensating for emitter-push effect in the fabrication of transistors

Info

Publication number
GB1549453A
GB1549453A GB13792/76A GB1379276A GB1549453A GB 1549453 A GB1549453 A GB 1549453A GB 13792/76 A GB13792/76 A GB 13792/76A GB 1379276 A GB1379276 A GB 1379276A GB 1549453 A GB1549453 A GB 1549453A
Authority
GB
United Kingdom
Prior art keywords
compensating
emitter
fabrication
transistors
push effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB13792/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Space and Mission Systems Corp
Original Assignee
TRW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRW Inc filed Critical TRW Inc
Publication of GB1549453A publication Critical patent/GB1549453A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/694—Inorganic materials composed of nitrides
    • H10P14/6943—Inorganic materials composed of nitrides containing silicon
    • H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
GB13792/76A 1975-04-21 1976-04-06 Method for compensating for emitter-push effect in the fabrication of transistors Expired GB1549453A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/570,036 US4006046A (en) 1975-04-21 1975-04-21 Method for compensating for emitter-push effect in the fabrication of transistors

Publications (1)

Publication Number Publication Date
GB1549453A true GB1549453A (en) 1979-08-08

Family

ID=24277930

Family Applications (1)

Application Number Title Priority Date Filing Date
GB13792/76A Expired GB1549453A (en) 1975-04-21 1976-04-06 Method for compensating for emitter-push effect in the fabrication of transistors

Country Status (5)

Country Link
US (1) US4006046A (cg-RX-API-DMAC7.html)
DE (1) DE2617293C3 (cg-RX-API-DMAC7.html)
FR (1) FR2309038A1 (cg-RX-API-DMAC7.html)
GB (1) GB1549453A (cg-RX-API-DMAC7.html)
NL (1) NL7603939A (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4102715A (en) * 1975-12-19 1978-07-25 Matsushita Electric Industrial Co., Ltd. Method for diffusing an impurity into a semiconductor body
JPS53132275A (en) * 1977-04-25 1978-11-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and its production
JPS543479A (en) * 1977-06-09 1979-01-11 Toshiba Corp Semiconductor device and its manufacture
US4225874A (en) * 1978-03-09 1980-09-30 Rca Corporation Semiconductor device having integrated diode
US4157269A (en) * 1978-06-06 1979-06-05 International Business Machines Corporation Utilizing polysilicon diffusion sources and special masking techniques
US4868624A (en) * 1980-05-09 1989-09-19 Regents Of The University Of Minnesota Channel collector transistor
US4263066A (en) * 1980-06-09 1981-04-21 Varian Associates, Inc. Process for concurrent formation of base diffusion and p+ profile from single source predeposition
JPS57194572A (en) * 1981-05-27 1982-11-30 Clarion Co Ltd Semiconductor device and manufacture thereof
JPH01123417A (ja) * 1987-11-07 1989-05-16 Mitsubishi Electric Corp 半導体装置の製造方法
US4978636A (en) * 1989-12-26 1990-12-18 Motorola Inc. Method of making a semiconductor diode
US5126281A (en) * 1990-09-11 1992-06-30 Hewlett-Packard Company Diffusion using a solid state source
US5374566A (en) * 1993-01-27 1994-12-20 National Semiconductor Corporation Method of fabricating a BiCMOS structure
US5541121A (en) * 1995-01-30 1996-07-30 Texas Instruments Incorporated Reduced resistance base contact method for single polysilicon bipolar transistors using extrinsic base diffusion from a diffusion source dielectric layer
EP0974165B1 (en) * 1998-02-09 2009-03-25 Nxp B.V. Semiconductor device with a bipolar transistor, and method of manufacturing such a device
TWI501292B (zh) * 2012-09-26 2015-09-21 財團法人工業技術研究院 形成圖案化摻雜區的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3575742A (en) * 1964-11-09 1971-04-20 Solitron Devices Method of making a semiconductor device
CH482795A (de) * 1966-09-06 1969-12-15 Ciba Geigy Verfahren zur Herstellung neuer Monoazofarbstoffpigmente
US3615938A (en) * 1969-01-28 1971-10-26 Westinghouse Electric Corp Method for diffusion of acceptor impurities into semiconductors
JPS495668B1 (cg-RX-API-DMAC7.html) * 1970-04-03 1974-02-08
JPS4926747B1 (cg-RX-API-DMAC7.html) * 1970-10-09 1974-07-11
US3719535A (en) * 1970-12-21 1973-03-06 Motorola Inc Hyperfine geometry devices and method for their fabrication
US3808060A (en) * 1972-07-05 1974-04-30 Motorola Inc Method of doping semiconductor substrates
US3839104A (en) * 1972-08-31 1974-10-01 Texas Instruments Inc Fabrication technique for high performance semiconductor devices
US3915767A (en) * 1973-02-05 1975-10-28 Honeywell Inc Rapidly responsive transistor with narrowed base

Also Published As

Publication number Publication date
DE2617293C3 (de) 1979-03-15
NL7603939A (nl) 1976-10-25
DE2617293A1 (de) 1976-11-04
US4006046A (en) 1977-02-01
FR2309038B1 (cg-RX-API-DMAC7.html) 1982-04-23
DE2617293B2 (de) 1978-07-13
FR2309038A1 (fr) 1976-11-19

Similar Documents

Publication Publication Date Title
US4038107B1 (en) Method for making transistor structures
GB1547789A (en) Method of fabricating polyrethane articles such as cathers
ZA761449B (en) Method for the preparation of alkylenecarbonates
GB2003322B (en) Methods for manufacturing field effect transistors
YU39479B (en) Process for the manufacture of thieno-pyridine derivatives
GB1543227A (en) Field effect transistor circuits
JPS5345160A (en) Method of controlling transistor
JPS5274283A (en) Transistor
HU175216B (hu) Fundicidnye kompozicii soderzhahhie proizvodnye aniliny i sposob poluchenija proizvodnykh anilina
GB1537653A (en) Method for the treatment of glass
JPS51115772A (en) Method and apparaus for dippsoldering semiconductor element
JPS529648A (en) Method of selectively ionnetching silicon
GB1532866A (en) Cephalosporins and processes for producing same
GB1555138A (en) Method for the manufacture of foamed glass
JPS53105482A (en) 11**55*44hydroxyy2hh1*22benzothiazinee33yl** 1*2*44oxadiazolee33yl*methyl*ethanonees*ss dioxide compound and method for its production
GB1557876A (en) Method and apparatus for the long term conservation of grain
GR58235B (en) Method for the preparation of diaryluutanolamines
JPS5277001A (en) Combining isomerizationnalkylation method
GR62435B (en) Compositions and method for decreasing substrates
PT64934B (en) Method for making transistor structures
JPS51120982A (en) Method of increasing electron yield at lighttionization in the presence of sensitizer
MW4676A1 (en) Method for the treatment of sugarcance
JPS51149863A (en) Method of manufacturing frames for motor* radiator and the like
JPS51117582A (en) Method of forming transistor structure
JPS51125340A (en) Lipidddepleted active compound * its composition and process for producing the same

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee