GB1493814A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB1493814A GB1493814A GB46514/74A GB4651474A GB1493814A GB 1493814 A GB1493814 A GB 1493814A GB 46514/74 A GB46514/74 A GB 46514/74A GB 4651474 A GB4651474 A GB 4651474A GB 1493814 A GB1493814 A GB 1493814A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- semiconductor
- oct
- leadthrough
- recrystallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/50—Alloying conductive materials with semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
Landscapes
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41129573A | 1973-10-30 | 1973-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1493814A true GB1493814A (en) | 1977-11-30 |
Family
ID=23628360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB46514/74A Expired GB1493814A (en) | 1973-10-30 | 1974-10-28 | Semiconductor devices |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5080788A (enExample) |
| CA (1) | CA1020290A (enExample) |
| DE (1) | DE2450902A1 (enExample) |
| FR (1) | FR2249443B1 (enExample) |
| GB (1) | GB1493814A (enExample) |
| SE (1) | SE396846B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2136203A (en) * | 1983-03-02 | 1984-09-12 | Standard Telephones Cables Ltd | Through-wafer integrated circuit connections |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4042448A (en) * | 1975-11-26 | 1977-08-16 | General Electric Company | Post TGZM surface etch |
| JPS57153446A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Semiconductor device for integrated circuit |
| JPS5853859A (ja) * | 1981-09-26 | 1983-03-30 | Matsushita Electric Ind Co Ltd | 集積型薄膜素子の製造方法 |
| JPS5857015U (ja) * | 1981-10-14 | 1983-04-18 | 東芝テック株式会社 | 直管形螢光灯器具 |
-
1974
- 1974-10-25 DE DE19742450902 patent/DE2450902A1/de not_active Withdrawn
- 1974-10-28 GB GB46514/74A patent/GB1493814A/en not_active Expired
- 1974-10-29 CA CA212,555A patent/CA1020290A/en not_active Expired
- 1974-10-30 SE SE7413675A patent/SE396846B/xx unknown
- 1974-10-30 FR FR7436242A patent/FR2249443B1/fr not_active Expired
- 1974-10-30 JP JP49124498A patent/JPS5080788A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2136203A (en) * | 1983-03-02 | 1984-09-12 | Standard Telephones Cables Ltd | Through-wafer integrated circuit connections |
Also Published As
| Publication number | Publication date |
|---|---|
| SE396846B (sv) | 1977-10-03 |
| FR2249443B1 (enExample) | 1978-09-29 |
| JPS5080788A (enExample) | 1975-07-01 |
| DE2450902A1 (de) | 1975-05-07 |
| SE7413675L (enExample) | 1975-05-02 |
| CA1020290A (en) | 1977-11-01 |
| FR2249443A1 (enExample) | 1975-05-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| 746 | Register noted 'licences of right' (sect. 46/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |