GB1482297A - Semiconductor power component - Google Patents
Semiconductor power componentInfo
- Publication number
- GB1482297A GB1482297A GB21641/75A GB2164175A GB1482297A GB 1482297 A GB1482297 A GB 1482297A GB 21641/75 A GB21641/75 A GB 21641/75A GB 2164175 A GB2164175 A GB 2164175A GB 1482297 A GB1482297 A GB 1482297A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- tubes
- ring
- potassium
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229910001369 Brass Inorganic materials 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910000799 K alloy Inorganic materials 0.000 abstract 2
- 229910000528 Na alloy Inorganic materials 0.000 abstract 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 2
- 239000010951 brass Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 239000011591 potassium Substances 0.000 abstract 2
- 229910052792 caesium Inorganic materials 0.000 abstract 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052753 mercury Inorganic materials 0.000 abstract 1
- 239000012858 resilient material Substances 0.000 abstract 1
- 230000000284 resting effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS6116A CS169520B1 (enrdf_load_stackoverflow) | 1974-09-05 | 1974-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1482297A true GB1482297A (en) | 1977-08-10 |
Family
ID=5407436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB21641/75A Expired GB1482297A (en) | 1974-09-05 | 1975-05-20 | Semiconductor power component |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4037246A (enrdf_load_stackoverflow) |
| JP (1) | JPS5138979A (enrdf_load_stackoverflow) |
| CH (1) | CH589360A5 (enrdf_load_stackoverflow) |
| CS (1) | CS169520B1 (enrdf_load_stackoverflow) |
| DE (1) | DE2525652A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1482297A (enrdf_load_stackoverflow) |
| PL (1) | PL100320B1 (enrdf_load_stackoverflow) |
| SE (1) | SE7506725L (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5633536A (en) * | 1995-06-20 | 1997-05-27 | Mitsubishi Denki Kabushiki Kaisha | Press contact type semiconductor device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3143336A1 (de) * | 1981-10-31 | 1983-05-19 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitergleichrichterbaueinheit |
| DE3501732A1 (de) * | 1984-01-19 | 1985-07-25 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Einrichtung zur verlustwaermeabfuhr von halbleiterelementen |
| US4897708A (en) * | 1986-07-17 | 1990-01-30 | Laser Dynamics, Inc. | Semiconductor wafer array |
| US4954875A (en) * | 1986-07-17 | 1990-09-04 | Laser Dynamics, Inc. | Semiconductor wafer array with electrically conductive compliant material |
| DE4025885C2 (de) * | 1990-08-16 | 1994-09-08 | Gewerk Auguste Victoria | Halbleitersäule |
| JP2965729B2 (ja) * | 1991-03-04 | 1999-10-18 | 日本石油化学株式会社 | 割繊具 |
| DE4404035A1 (de) * | 1994-02-09 | 1995-08-10 | Sel Alcatel Ag | Wärmeleitvorrichtung für elektrische Bauelemente |
| US7348665B2 (en) * | 2004-08-13 | 2008-03-25 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2734154A (en) * | 1953-07-27 | 1956-02-07 | Semiconductor devices | |
| US3475660A (en) * | 1967-12-01 | 1969-10-28 | Int Rectifier Corp | Hollow cylindrical semiconductor device |
| US3812404A (en) * | 1973-05-29 | 1974-05-21 | Gen Electric | Increasing the initial flow rate in a rectifier assembly employing electromagnetically-pumped liquid metal for cooling |
-
1974
- 1974-09-05 CS CS6116A patent/CS169520B1/cs unknown
-
1975
- 1975-05-20 GB GB21641/75A patent/GB1482297A/en not_active Expired
- 1975-06-09 DE DE19752525652 patent/DE2525652A1/de active Pending
- 1975-06-10 CH CH748875A patent/CH589360A5/xx not_active IP Right Cessation
- 1975-06-12 SE SE7506725A patent/SE7506725L/xx unknown
- 1975-07-04 JP JP50082000A patent/JPS5138979A/ja active Pending
- 1975-07-09 PL PL1975182031A patent/PL100320B1/xx unknown
- 1975-07-16 US US05/596,437 patent/US4037246A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5633536A (en) * | 1995-06-20 | 1997-05-27 | Mitsubishi Denki Kabushiki Kaisha | Press contact type semiconductor device |
| GB2302613B (en) * | 1995-06-20 | 1999-12-22 | Mitsubishi Electric Corp | Press contact type semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CS169520B1 (enrdf_load_stackoverflow) | 1976-07-29 |
| US4037246A (en) | 1977-07-19 |
| DE2525652A1 (de) | 1976-03-25 |
| CH589360A5 (enrdf_load_stackoverflow) | 1977-06-30 |
| PL100320B1 (pl) | 1978-09-30 |
| JPS5138979A (enrdf_load_stackoverflow) | 1976-03-31 |
| SE7506725L (sv) | 1976-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB777985A (en) | Improvements in or relating to semi-conductor rectifying devices | |
| US2883591A (en) | Semiconductor rectifier device | |
| GB822770A (en) | Improvements in semiconductor device construction | |
| GB1333190A (en) | Semiconductor devices | |
| GB1172648A (en) | An Improved Integral Heat Sink for Semiconductor Devices. | |
| GB1482297A (en) | Semiconductor power component | |
| GB1400608A (en) | Transcalent semiconductor device | |
| ES389451A1 (es) | Perfeccionamientos en los componentes semiconductores y procedimiento de fabricacion correspondiente. | |
| GB824255A (en) | Improvements in or relating to transistors | |
| GB836370A (en) | Improvements in high current rectifier | |
| GB917812A (en) | Heat dissipating electrical shields for electronic components | |
| US3585454A (en) | Improved case member for a light activated semiconductor device | |
| GB848619A (en) | Improvements in or relating to the fabrication of semiconductor rectifiers | |
| GB768103A (en) | Improvements in or relating to semiconductor devices | |
| ES218906A1 (es) | Un sistema de electrodos que comprende al menos un miembro semiconductor | |
| US2921245A (en) | Hermetically sealed junction means | |
| GB919947A (en) | Semiconductor device | |
| GB975827A (en) | A semi-conductor arrangement | |
| GB1295775A (enrdf_load_stackoverflow) | ||
| GB1177031A (en) | Pressure Assembled Semiconductor Device using Massive Flexibly Mounted Terminals | |
| GB1047778A (en) | A semiconductor device | |
| GB1000023A (en) | Semi-conductor devices | |
| GB838432A (en) | Improvements in electric rectifiers employing semi-conductors | |
| GB1071429A (en) | Semi-conductor components | |
| JPS5242384A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |