GB1468397A - Bonding a small object to a substrate - Google Patents

Bonding a small object to a substrate

Info

Publication number
GB1468397A
GB1468397A GB1363574A GB1363574A GB1468397A GB 1468397 A GB1468397 A GB 1468397A GB 1363574 A GB1363574 A GB 1363574A GB 1363574 A GB1363574 A GB 1363574A GB 1468397 A GB1468397 A GB 1468397A
Authority
GB
United Kingdom
Prior art keywords
collet
pellet
substrate
lead frame
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1363574A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1468397A publication Critical patent/GB1468397A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB1363574A 1973-04-06 1974-03-27 Bonding a small object to a substrate Expired GB1468397A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3872973A JPS571896B2 (https=) 1973-04-06 1973-04-06

Publications (1)

Publication Number Publication Date
GB1468397A true GB1468397A (en) 1977-03-23

Family

ID=12533405

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1363574A Expired GB1468397A (en) 1973-04-06 1974-03-27 Bonding a small object to a substrate

Country Status (5)

Country Link
US (1) US3918144A (https=)
JP (1) JPS571896B2 (https=)
GB (1) GB1468397A (https=)
HK (1) HK64179A (https=)
MY (1) MY8000121A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2034613B (en) * 1978-11-09 1983-01-19 Tokyo Shibaura Electric Co Method and apparatus for mounting electronic components
US4489228A (en) * 1982-09-20 1984-12-18 Wells Robert M Welding method and thermostat produced
US4457976A (en) * 1983-03-28 1984-07-03 Rca Corporation Method for mounting a sapphire chip on a metal base and article produced thereby
US4576326A (en) * 1984-05-14 1986-03-18 Rca Corporation Method of bonding semiconductor devices to heatsinks
US4815779A (en) * 1987-08-21 1989-03-28 American Telephone And Telegraph Co. Method and apparatus for part pickup
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JP2532615B2 (ja) * 1988-10-20 1996-09-11 松下電器産業株式会社 バンプ形成方法
US5249450A (en) * 1992-06-15 1993-10-05 Micron Technology, Inc. Probehead for ultrasonic forging
JP5865639B2 (ja) * 2011-09-15 2016-02-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1564867C3 (de) * 1966-06-30 1975-04-10 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen
US3474521A (en) * 1967-04-26 1969-10-28 Ibm Bonding method
US3568307A (en) * 1969-04-10 1971-03-09 Kulicke & Soffa Ind Inc Method of picking up and bonding semiconductor wafers to a carrier
US3628717A (en) * 1969-11-12 1971-12-21 Ibm Apparatus for positioning and bonding
US3695502A (en) * 1970-09-14 1972-10-03 Floyd E Gaiser Bonding tool

Also Published As

Publication number Publication date
HK64179A (en) 1979-09-14
JPS571896B2 (https=) 1982-01-13
MY8000121A (en) 1980-12-31
US3918144A (en) 1975-11-11
JPS49127572A (https=) 1974-12-06

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee