GB1465424A - Semi-conductor packaging - Google Patents

Semi-conductor packaging

Info

Publication number
GB1465424A
GB1465424A GB972175A GB972175A GB1465424A GB 1465424 A GB1465424 A GB 1465424A GB 972175 A GB972175 A GB 972175A GB 972175 A GB972175 A GB 972175A GB 1465424 A GB1465424 A GB 1465424A
Authority
GB
United Kingdom
Prior art keywords
semi
buses
support elements
wafers
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB972175A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1465424A publication Critical patent/GB1465424A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/834—Interconnections on sidewalls of chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB972175A 1974-04-19 1975-03-07 Semi-conductor packaging Expired GB1465424A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US462463A US3908155A (en) 1974-04-19 1974-04-19 Wafer circuit package

Publications (1)

Publication Number Publication Date
GB1465424A true GB1465424A (en) 1977-02-23

Family

ID=23836497

Family Applications (1)

Application Number Title Priority Date Filing Date
GB972175A Expired GB1465424A (en) 1974-04-19 1975-03-07 Semi-conductor packaging

Country Status (5)

Country Link
US (1) US3908155A (enExample)
JP (1) JPS50137682A (enExample)
DE (1) DE2509507A1 (enExample)
FR (1) FR2268359B1 (enExample)
GB (1) GB1465424A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2100064B (en) * 1981-05-29 1984-12-12 Ferranti Ltd Electrical circuit assembly
US5191224A (en) * 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
KR960012649B1 (en) * 1987-04-22 1996-09-23 Hitachi Ltd Wafer scale or full wafer memory system, package, method thereof and wafer processing method employed therein
US5038201A (en) * 1988-11-08 1991-08-06 Westinghouse Electric Corp. Wafer scale integrated circuit apparatus
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure
US5086692A (en) * 1990-04-12 1992-02-11 Welch Henry W Air handling system and method for an operating room
KR19980064369A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 메모리 모듈, 메모리 탑 및 메모리 모듈 구성 방법
DE19734032C1 (de) * 1997-08-06 1998-12-17 Siemens Ag Elektronisches Steuergerät mit Kontaktstift sowie Herstellungsverfahren

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757345A (fr) * 1969-10-17 1971-04-09 Amp Inc Boite a fusibles
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly

Also Published As

Publication number Publication date
FR2268359A1 (enExample) 1975-11-14
FR2268359B1 (enExample) 1977-04-15
US3908155A (en) 1975-09-23
JPS50137682A (enExample) 1975-10-31
DE2509507A1 (de) 1975-10-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee