GB1453886A - Bright dip compositions for leadtin alloys - Google Patents

Bright dip compositions for leadtin alloys

Info

Publication number
GB1453886A
GB1453886A GB1102074A GB1102074A GB1453886A GB 1453886 A GB1453886 A GB 1453886A GB 1102074 A GB1102074 A GB 1102074A GB 1102074 A GB1102074 A GB 1102074A GB 1453886 A GB1453886 A GB 1453886A
Authority
GB
United Kingdom
Prior art keywords
alkali metal
alloys
march
ammonium salt
leadtin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1102074A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of GB1453886A publication Critical patent/GB1453886A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB1102074A 1973-03-13 1974-03-12 Bright dip compositions for leadtin alloys Expired GB1453886A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US340912A US3888778A (en) 1973-03-13 1973-03-13 Bright dip composition for tin/lead

Publications (1)

Publication Number Publication Date
GB1453886A true GB1453886A (en) 1976-10-27

Family

ID=23335448

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1102074A Expired GB1453886A (en) 1973-03-13 1974-03-12 Bright dip compositions for leadtin alloys

Country Status (5)

Country Link
US (1) US3888778A (de)
JP (1) JPS5725636B2 (de)
CA (1) CA1020067A (de)
DE (1) DE2412134C3 (de)
GB (1) GB1453886A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107109651A (zh) * 2014-12-25 2017-08-29 Mec股份有限公司 无电解镀锡被膜表面的洗净液及其补给液以及镀锡层的形成方法
US20240052501A1 (en) * 2020-12-24 2024-02-15 Ishihara Chemical Co., Ltd. TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004956A (en) * 1974-08-14 1977-01-25 Enthone, Incorporated Selectively stripping tin or tin-lead alloys from copper substrates
US4297257A (en) * 1980-04-17 1981-10-27 Dart Industries Inc. Metal stripping composition and method
IT1144797B (it) * 1981-10-14 1986-10-29 Alfachimici Spa Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo
USRE32555E (en) * 1982-09-20 1987-12-08 Circuit Chemistry Corporation Solder stripping solution
US4713144A (en) * 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards
DE19510825A1 (de) * 1995-03-24 1996-09-26 Henkel Kgaa Korrosionsschützender Reiniger für verzinnten Stahl
US6461534B2 (en) 1997-11-19 2002-10-08 Europa Metalli S. P. A. Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same
JP6429079B2 (ja) * 2015-02-12 2018-11-28 メック株式会社 エッチング液及びエッチング方法
TW201930647A (zh) * 2017-12-22 2019-08-01 德商德國艾托特克公司 用於選擇性移除鈀之方法及處理組合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3181984A (en) * 1962-05-04 1965-05-04 Fmc Corp Cleaning and brightening of solder
US3677949A (en) * 1970-09-04 1972-07-18 Enthone Selectively stripping tin and/or lead from copper substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107109651A (zh) * 2014-12-25 2017-08-29 Mec股份有限公司 无电解镀锡被膜表面的洗净液及其补给液以及镀锡层的形成方法
US20240052501A1 (en) * 2020-12-24 2024-02-15 Ishihara Chemical Co., Ltd. TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

Also Published As

Publication number Publication date
US3888778A (en) 1975-06-10
JPS49122434A (de) 1974-11-22
JPS5725636B2 (de) 1982-05-31
DE2412134B2 (de) 1978-04-06
CA1020067A (en) 1977-11-01
DE2412134A1 (de) 1974-10-03
DE2412134C3 (de) 1978-11-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee