GB1451668A - Semiconductor manufacturing systems - Google Patents

Semiconductor manufacturing systems

Info

Publication number
GB1451668A
GB1451668A GB5680673A GB5680673A GB1451668A GB 1451668 A GB1451668 A GB 1451668A GB 5680673 A GB5680673 A GB 5680673A GB 5680673 A GB5680673 A GB 5680673A GB 1451668 A GB1451668 A GB 1451668A
Authority
GB
United Kingdom
Prior art keywords
substrate
vacuum
supported
division
tube ends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5680673A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US00319563A external-priority patent/US3850105A/en
Priority claimed from US00329494A external-priority patent/US3845286A/en
Priority claimed from US329920A external-priority patent/US3889355A/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1451668A publication Critical patent/GB1451668A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
GB5680673A 1972-12-29 1973-12-07 Semiconductor manufacturing systems Expired GB1451668A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US00319563A US3850105A (en) 1972-12-29 1972-12-29 Apparatus for transferring articles through various processing sectors of a manufacturing system
US00329494A US3845286A (en) 1973-02-05 1973-02-05 Manufacturing control system for processing workpieces
US329920A US3889355A (en) 1973-02-05 1973-02-05 Continuous processing system

Publications (1)

Publication Number Publication Date
GB1451668A true GB1451668A (en) 1976-10-06

Family

ID=27406059

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5680673A Expired GB1451668A (en) 1972-12-29 1973-12-07 Semiconductor manufacturing systems

Country Status (6)

Country Link
CH (1) CH566843A5 (enExample)
DE (1) DE2364790C2 (enExample)
ES (1) ES421844A1 (enExample)
FR (1) FR2212965A5 (enExample)
GB (1) GB1451668A (enExample)
NL (1) NL184986C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2126374A (en) * 1982-06-23 1984-03-21 Nec Corp A production system for the manufacture of semiconductor devices

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60184678A (ja) * 1984-03-02 1985-09-20 Canon Inc 真空処理装置
EP0162703A3 (en) * 1984-05-23 1987-02-04 Machine Technology Inc. Modular processing apparatus and modules for use therewith
JPS6126229A (ja) * 1984-07-16 1986-02-05 Oki Electric Ind Co Ltd 半導体装置の製造装置
GB2191310A (en) * 1986-05-29 1987-12-09 Ford Motor Co Conveying system
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
DE19821389B4 (de) * 1998-02-12 2010-02-18 Claas Fertigungstechnik Gmbh Verfahren und Vorrichtung zum Handling von Werkstücken

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL297192A (enExample) * 1962-07-20
AT288112B (de) * 1966-05-12 1971-02-25 Molins Machine Co Ltd Werkzeugmaschinenanlage mit einem zentralen Steuergerät
US3543392A (en) * 1967-12-15 1970-12-01 Cincinnati Milacron Inc Machine tools having conveyor means extending therebetween and carrying pallet means which are selectively connectable to the machine tools

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2126374A (en) * 1982-06-23 1984-03-21 Nec Corp A production system for the manufacture of semiconductor devices

Also Published As

Publication number Publication date
AU6308273A (en) 1975-06-05
ES421844A1 (es) 1976-05-01
FR2212965A5 (enExample) 1974-07-26
DE2364790A1 (de) 1974-07-04
CH566843A5 (enExample) 1975-09-30
NL184986B (nl) 1989-07-17
NL7317755A (enExample) 1974-07-02
DE2364790C2 (de) 1985-11-28
NL184986C (nl) 1989-12-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19921207