GB1441016A - Apparatus for holding electronic components during the assembly of circuit arrangements - Google Patents
Apparatus for holding electronic components during the assembly of circuit arrangementsInfo
- Publication number
- GB1441016A GB1441016A GB4378373A GB4378373A GB1441016A GB 1441016 A GB1441016 A GB 1441016A GB 4378373 A GB4378373 A GB 4378373A GB 4378373 A GB4378373 A GB 4378373A GB 1441016 A GB1441016 A GB 1441016A
- Authority
- GB
- United Kingdom
- Prior art keywords
- components
- soldered
- connections
- electronic components
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
1441016 Component assemblies C R WAINWRIGHT 18 Sept 1973 [26 July 1973] 43783/73 Heading H1R Electronic components are supported on an insulating plate member formed on one side with a thin metal, e.g. printed solderable circuit pattern 6 comprising, e.g. metallic areas 7 extending radially from the centre, and outlying areas 8 to which integrated circuit connectors may be soldered, with other components solderably connected to the outer margins. The supporting members have self-adhesive layers on their rearward sides protected by a removable covering (Fig. 2, not shown) and are pressure secured to a base 10 of insulant, e.g. plastic material with a thin metal, e.g. earth sheet thereon. Before adhesion the connections of components 2, 3, 4 are soldered to the metallic areas together with insulated outgoing and interunit connections 14 and earth connections 15. Certain components, e.g. resistor 4 are connectively soldered to the metal coating of the bass-plate and the components may comprise transistors, potentiometers, inductors, fixed and variable capacitors, transformers, pins and sockets, plug connectors, diodes and the like. The connection patterns may provide specific impedances or transmission lines. The supports may be rectangular or strip-like, and the baseplate may have a shielding function, while the invention is applicable to the construction of experimental circuits ad hoc.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE7327452U DE7327452U (en) | 1973-07-26 | 1973-07-26 | Device for holding electronic components for the construction of circuit arrangements, in particular for experimental purposes or the like |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1441016A true GB1441016A (en) | 1976-06-30 |
Family
ID=6639816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4378373A Expired GB1441016A (en) | 1973-07-26 | 1973-09-18 | Apparatus for holding electronic components during the assembly of circuit arrangements |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5053859A (en) |
AU (1) | AU6080573A (en) |
DE (1) | DE7327452U (en) |
GB (1) | GB1441016A (en) |
IL (1) | IL43349A0 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014135742A1 (en) * | 2013-03-07 | 2014-09-12 | Walki Group | Circuit board and a manufacturing method thereon |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59159969U (en) * | 1983-04-13 | 1984-10-26 | 株式会社 友枝研究所 | Prototype board |
JPS59173365U (en) * | 1983-05-04 | 1984-11-19 | サンハヤト株式会社 | Flexible printed wiring board for mini flat pack IC |
-
1973
- 1973-07-26 DE DE7327452U patent/DE7327452U/en not_active Expired
- 1973-09-18 GB GB4378373A patent/GB1441016A/en not_active Expired
- 1973-09-27 AU AU60805/73A patent/AU6080573A/en not_active Expired
- 1973-10-01 IL IL43349A patent/IL43349A0/en unknown
-
1974
- 1974-02-06 JP JP49016749A patent/JPS5053859A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014135742A1 (en) * | 2013-03-07 | 2014-09-12 | Walki Group | Circuit board and a manufacturing method thereon |
Also Published As
Publication number | Publication date |
---|---|
DE7327452U (en) | 1974-01-31 |
JPS5053859A (en) | 1975-05-13 |
IL43349A0 (en) | 1974-01-14 |
AU6080573A (en) | 1975-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4739453A (en) | Shielding apparatus for a printed circuit board | |
US4954929A (en) | Multi-layer circuit board that suppresses radio frequency interference from high frequency signals | |
GB1004459A (en) | Electronic circuits | |
GB1304510A (en) | ||
MY113889A (en) | Dual substrate package assembly for being electrically coupled to a conducting member | |
US3179854A (en) | Modular structures and methods of making them | |
GB1269592A (en) | Sub-element for electronic circuit board | |
US5561584A (en) | Electrical ground plane apparatus | |
US5199887A (en) | Surface mounting connector | |
US5509599A (en) | Method for securing a hybrid circuit on a printed circuit board | |
GB1441016A (en) | Apparatus for holding electronic components during the assembly of circuit arrangements | |
HK1026808A1 (en) | Printed circuit board for electrical apparatus with hf components, particular for mobile radio equipment | |
GB1377682A (en) | Thick film printed circuitry | |
US5132864A (en) | Printed circuit board | |
JPH0720943Y2 (en) | Multilayer printed wiring board | |
SE9600085D0 (en) | Shielding of electronic components that are baked directly on PCBs | |
GB1051257A (en) | ||
IL105753A (en) | Printed circuit substrates | |
GB1447070A (en) | Conductor base for breadboard or prototype circuits tuning arrangements | |
ES455373A1 (en) | Multilayer printed wiring board | |
JPH054294Y2 (en) | ||
JP3104109B2 (en) | Electronic circuit module device | |
JP7353244B2 (en) | Power supply device with insulating cover and manufacturing method thereof | |
GB1062928A (en) | Multi-wafer integrated circuits | |
JPS63300599A (en) | Electromagnetic shielding structure of communication equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |