DE7327452U - Device for holding electronic components for the construction of circuit arrangements, in particular for experimental purposes or the like - Google Patents

Description

DIpI.-Ing. E. Eder Dipl. K. Schieschke 8l «tochen13, EU« abeth »Uaee34

Claire Busseil Wainwright

Oberalting-Seefeld
Aubachstrasse 25

Device for holding electronic components for the construction of circuit arrangements, especially for experimental purposes or the like.

The innovation relates to a device for holding electronic devices Components for the construction of string arrangements, in particular for experimental purposes or the like.

The object of the innovation is to provide a device for holding electronic components for the construction of circuit arrangements to create, which makes it possible, e.g. during the construction of experimental setups, to have about the same electronic To achieve conditions as later with the end product to be manufactured.

The innovation solves this problem in that a carrier is used which has an adhesive layer on one side has, and on the other side has solderable metal surfaces in the form of a pattern.

This avoids lengthy electrical adjustments from the test circuit to the end product. This is for him Construction of all electrical circuits is of great advantage

- 2 and represents for the high frequency range - where short

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A suitable solder joint pattern was developed for practically every electronic component by using there is a soldering point for each conductor leg of a specific component.

For the construction of an overall or partial circuit arrangement a base plate with an electrically conductive surface is used, onto which the individual supports are pressed after the protective cover has been removed from the adhesive surface- The electronic components can either be soldered to the carrier before or after gluing to the base plate. The base plate is preferably made made of very thin solderable metal, applied to a base material, e.g. plastic. This baseplate is usually used as a zero potential, commonly known as "earth" or "ground" for electrical circuitry.

The innovation is explained in more detail below with reference to the drawing described.

In the drawing show:

Fig. 1 is a schematic view of the carrier for the electronic components, placed on a base plate, and

Pig. 2 is a schematic view of the carrier with

partially removed protective cover for the

The carriers 1, for holding electronic components, such as integrated circuits 2, capacitors 3t Resistors 4 · and the like. Preferably consist of one Insulating plate 5, which has solderable surfaces in the form of a thin metal pattern 6 on one side. Sas Solder joint sexton, preferably in the form of a printed one Circuit applied, can be designed differently. Purely for fastening integrated circuits the electrical conductor tracks 7 run radially outward. You ladder legs of the integrated circuits are with the electrical conductor tracks 7 in the Bah des Trägei - Zöät.rüüB vöflotet, ään TsIIb further Lctstvl— len are required - e.g. for a 12-pole integrated Circuit - four of the soldering points 8 could also be used to fix the component. On the outer areas of the conductor tracks 7, further components or Wires are soldered on. At the outer edges you can connect additional components, such as the resistors and Capacitors, conductor subareas 8 may be present. Fig.1 clearly shows how little by little 4 porters 1 ait electronic components 2, 3 and 4, earth wire and insulated wires 1 * can be fitted. Ready-to-use supports 1 are glued onto a large disk 10 in a domed manner. For this purpose, AerTräger has a self-adhesive adhesive layer 12 on the bridge side 11, which can be removed by iron Protective cover 13 is covered. After removing the cover 13, the carrier 1 can simply be attached to the Gxoad plate 10 can be pushed on. You Grua & Platte 10 consists of aas very thin »/, lotbarea Kigali, applied to a base material, tie e.g. plastic. Beait it is settled that the Metal layer side facing carriers as earth sa besmtsea.

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Sin the ladder leg of the component - like that of a resistor in Fig.1 - can be soldered directly to the metal surface of the base plate 10. The carrier 1 can over

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Stages of a circuit arrangement are connected. Darct Careful choice of shapes and solderable patterns allow relatively few patterns to attach a large one Selection of electronic components.

They can be any shape or size or carrier Possess strength. You can use rectangular carriers like this be as small as 10 χ 10 mm, but can also be as large as 50 χ 50 mm. The thickness of the carrier can be, for example, 1.5 mm. The rectangular supports 1 are suitable e.g. for components such as 3- and 4-pole transistors, Trimmpotsnticseter and EcsäessÄtoreüj bobbins. Chokes. 6-j 8-. 10- or 12-poXiee Sual-inspne integrated circuits, for IC sockets, Boppel-Transist ^ n, 4- to 8-pole Iapulsa bearers, small coils, for rectangular ones Trim potentiometers, and many others.

Sin solder post 10 χ 10 mm holds a ladder leg of a large component, or connects multiple wires or component leads.

Solder joint strips, with sB 6 94 mm, have solder joint surfaces at a certain distance between the solder joints. Other L9tstellea-8treifea ktaaea seem "verseaiedea" AbstänAe comprise suitable r * attachment VOA many electronic components, such as connectors printed ftchaltaagem fir, switches, coil bobbins, Triampoteatlometer, Trimmkoadeaeetoreö, KLastlk-LeistaaeetxmBaistoreB Vaa emoeve many components. These Utetelleav- # teeifea germinate aaeh be used in pairs,

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for the attachment of all dual-integrated in-line Circuits, groups of 2-pole components such as resistors, Capacitors, chokes and diodes. The models with larger distances can be attached in pairs be used by larger components, or you cut the strips to individual soldering points or Groups of solder points as needed. Finally, the carriers can also be designed in the form of impedance strips be, the solder joint pattern has the shape of a continuous conductor track, the width of which and strength have a certain impedance when glued to a base plate.

The innovation makes it possible, by using the carrier and the base plate, to build circuit arrangements in the form of either total or partial circuits, which during the test stage have approximately the same electrical values as those of the end product, which is mass-produced from plates with printed circuits. This innovation makes it unnecessary to drill holes in plates in order to attach components to them. The innovation enables read easy removal or replacement of components or component groups during the construction, aan den sow support member having a side cutter at a corner by lifting. The removed carrier can be used again later if the adhesive surface is kept clean. This simplifies changes to the circuit during construction and makes multiple use of the carrier and component possible * since the components are only soldered on and no other fastening device is used, the test circuit can be easily performed

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disassemble again and use the components themselves again. The carriers could then too removed from the base plate and reused several times. With this innovation, the developer can Arrange his circuit as he wishes in terms of component position, spacing and cable lengths, without To be bound to a certain grid size or the like. This innovation has many properties that are / are beneficial for low noise, high gain and high frequency circuits. The presence of a crowd with extremely Low resistance considerably reduces the possibility of unwanted feedback caused of voltages caused by earth currents. The shielding effect of the base plate, which is directly at located in the active circuits, reduces stray electrostatic fields and high-frequency electromagnetic fields to a minimum. The pads have a very low capacity on the base plate and one pad to the other. The remaining capacity is beneficial because it is typical of a double-sided Printed circuit board as it is normally used for final production. The developer has the option of effortlessly to build an ideal circuit arrangement, since he can use the electronic components wherever it seems desirable to him. The impedance strips become overexcitation conductors of a certain Impedance when glued to a base plate.

Patent attorney DIpI.-Ing. E. Eder Dipl.-Ing. K. Schleechk

llb * ltrae * 84

Claims (1)

.-Ing. E. Protection claims 1. Device for holding electronic components for the construction of circuit arrangements, in particular for experimental purposes or the like, characterized by a carrier (1) which has an adhesive layer (12) on one side, and on the other side in has a pattern solderable metal surfaces (7,8). 2. Apparatus according to claim 1, characterized in that the metal surfaces (7 * 8) in the form of a printed Circuit are applied. 3. Apparatus according to claim 1, characterized in that the adhesive layer (12) is covered by a removable cover. 4. Apparatus according to claim 1, characterized in that | that the carrier (1) has a rectangular shape 5 device near claim 1, characterized in that that the size of the carrier (1) 10 10 mm up to 50 χ 100 mm. 6. Apparatus according to claim 1, characterized in that the carrier (1) is strip-shaped. 7 · Device according to claim 1, characterized in that the carrier (1) is round. 8. Apparatus according to claim 1, characterized in that the Carrier (1) has a thickness of 1.5 mm. 9. The device according to claim 1, characterized by a base plate (10) for the carrier (1), which is made of a non-metal. -lischem, heat-insulating material and at least has a goer surface made of solderable metal. 7327412 3t ι H SEr ¹ "* mtf *** ™ *