GB1423928A - Method for the electrolytic deposition of copper on aluminium and its alloys and the products obtained therewith - Google Patents
Method for the electrolytic deposition of copper on aluminium and its alloys and the products obtained therewithInfo
- Publication number
- GB1423928A GB1423928A GB3027574A GB3027574A GB1423928A GB 1423928 A GB1423928 A GB 1423928A GB 3027574 A GB3027574 A GB 3027574A GB 3027574 A GB3027574 A GB 3027574A GB 1423928 A GB1423928 A GB 1423928A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electro
- plate
- bath
- plated
- july
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1423928 Electro-depositing copper on anodized aluminium R COLALE 9 July 1974 [9 July 1973] 30275/74 Heading C7B An A1 or A1 alloy body e.g. plate is electroplated with Cu by immersing the degreased and pickled body in an electrolyte bath containing Cu (and preferably K 4 ) pyrophosphate with pH between 8À2 and 9À7 and temperature between 50 and 65‹C, first as anode then as cathode by reversing polarity without withdrawing the body from the bath, the counter-electrode being at least one Cu plate or bar, and regulating the voltage so that a CD of between 1À6 and 2À4 A/dm<SP>2</SP> of body surface passes during anodizing, and of between 0À2 and 0À9 rising to a maximum of between 5 and 10 A/dm<SP>2</SP> of body surface during electro-plating, the voltage being reduced to between 0À3 and 0À7V at the end of the first stage. For offset printing, A1 cylinders electro-plated with Cu as above may be further electro-plated with Ni and/or Cr; for electronics, the Cu electro-plate may be coated with Sn-Pb soldering alloy. Degreasing may be effected in C 2 HCl 3 and etching in NaOH then HNO 3 solution. The bath may also contain inorganic salts of alkali metals, e.g. oxalates or citrates, to obtain shiny and brilliant Cu deposits.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT26376/73A IT991079B (en) | 1973-07-09 | 1973-07-09 | PROCEDURE FOR ELECTROLYTICALLY RETURNING COPPER ON ALUMINUM AND ITS ALLOYS AND PRODUCTS OBTAINED WITH THIS PROCESS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1423928A true GB1423928A (en) | 1976-02-04 |
Family
ID=11219353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3027574A Expired GB1423928A (en) | 1973-07-09 | 1974-07-09 | Method for the electrolytic deposition of copper on aluminium and its alloys and the products obtained therewith |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE817405A (en) |
| DE (1) | DE2432888A1 (en) |
| GB (1) | GB1423928A (en) |
| IT (1) | IT991079B (en) |
| NL (1) | NL7409288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110114517A (en) * | 2016-08-17 | 2019-08-09 | 席勒斯材料科学有限公司 | The method of thin functional coating is generated on light-alloy |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601346A (en) * | 2020-12-21 | 2021-04-02 | 深圳明阳电路科技股份有限公司 | Manufacturing method of super-thick copper plate and super-thick copper plate |
-
1973
- 1973-07-09 IT IT26376/73A patent/IT991079B/en active
-
1974
- 1974-07-09 DE DE2432888A patent/DE2432888A1/en active Pending
- 1974-07-09 GB GB3027574A patent/GB1423928A/en not_active Expired
- 1974-07-09 BE BE2053738A patent/BE817405A/en unknown
- 1974-07-09 NL NL7409288A patent/NL7409288A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110114517A (en) * | 2016-08-17 | 2019-08-09 | 席勒斯材料科学有限公司 | The method of thin functional coating is generated on light-alloy |
| EP3500695A4 (en) * | 2016-08-17 | 2020-03-25 | Cirrus Materials Science Limited | Method to create thin functional coatings on light alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| BE817405A (en) | 1974-11-04 |
| NL7409288A (en) | 1975-01-13 |
| IT991079B (en) | 1975-07-30 |
| DE2432888A1 (en) | 1975-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |